초록 ▼

Two covered wires are conductively connected to each other by overlapping with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips. By melting cover portions and pressing resin chips from outside, the conductive wire portions of the covered wire

Two covered wires are conductively connected to each other by overlapping with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips. By melting cover portions and pressing resin chips from outside, the conductive wire portions of the covered wires are conductively contacted with each other at the connection portions. The pair of the resin chips are melt-fixed to each other to seal the connection portions. A crossing angle .theta. of the two covered wires at the connection portion is set to no less than 45.degree. and greater than 135.degree.. Thus, the covered wires can be conductively connected with each other inexpensively and easily. Further, a connecting state having an excellent electrical characteristic can be obtained stably.

대표청구항 ▼

[ What is claimed is:] [1.] A method for connecting covered wires, comprising:overlapping the two covered wires, each of said wires comprising a conductive wire portion composed of a plurality of core wires and a cover portion covering an outer periphery of the conductive wire portion;placing said w

[ What is claimed is:] [1.] A method for connecting covered wires, comprising:overlapping the two covered wires, each of said wires comprising a conductive wire portion composed of a plurality of core wires and a cover portion covering an outer periphery of the conductive wire portion;placing said wires in a wire supporting portion of a resin chip for restricting a crossing angle of said two covered wires;pinching an overlapping portion of said wires between the resin chip having the wire supporting portion and a second resin chip;pressurizing and exciting said overlapping portion pinched by said resin chips;exposing the conductive wire portions of the covered wires at the overlapping portion;conductively connecting the conductive wire portions of said covered wires at said overlapping portion; andmelt-fixing the resin chips to one another to seal the connected overlapping portion of said covered wires with said melted resin chips.