초록 ▼

This invention relates to a process for improving the adhesion of copper circuitry to a dielectric layer and a method for forming a multilayer printed circuit board wherein the copper circuitry of the board is covered with a layer of an oxide, hydroxide, or combination thereof of a metal selected fr

This invention relates to a process for improving the adhesion of copper circuitry to a dielectric layer and a method for forming a multilayer printed circuit board wherein the copper circuitry of the board is covered with a layer of an oxide, hydroxide, or combination thereof of a metal selected from the group consisting of tin, bismuth, lead, indium, gallium, germanium, and alloys of said metals. The process and multilayer circuit boards made thereby, have improved laminate adhesion and strength. Further, partial delamination, known as pink ring, is decreased or avoided by the present process. Further, the multilayer structures have decreased bond strength deterioration when exposed to elevated temperatures.

대표청구항 ▼

[ I claim:] [37.] A multilayer printed circuit board containing conductive through-holes which make electrical contact to a series of electrically conducting layers through one or more insulating layers comprising:(A) a dielectric layer;(B) a copper circuitry on one or two opposite sides of the diel

[ I claim:] [37.] A multilayer printed circuit board containing conductive through-holes which make electrical contact to a series of electrically conducting layers through one or more insulating layers comprising:(A) a dielectric layer;(B) a copper circuitry on one or two opposite sides of the dielectric layer;(C) a layer of metal oxide, metal hydroxide, or combination thereof which overlays the copper circuitry wherein the metal is selected from the group consisting of bismuth, lead, indium, gallium, germanium, alloys of said metals and alloys of said metals with tin;(D) an organosilane layer over the layer of metal oxide, metal hydroxide or combination thereof; and(E) an insulating layer comprising a cured thermosetting polymer composition over the organosilane layer.