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A system for cooling electronic components in the downhole assembly of a drill string through which a drilling fluid flows. The cooling system includes a thermoelectric cooler that conducts heat from the electronic component to a first heat transfer surface of a thermally conductive chassis. The hea

A system for cooling electronic components in the downhole assembly of a drill string through which a drilling fluid flows. The cooling system includes a thermoelectric cooler that conducts heat from the electronic component to a first heat transfer surface of a thermally conductive chassis. The heat received by the first heat transfer surface is transferred within the chassis to a second heat transfer surface that then transfers the heat to a housing. The housing transfers the heat to the drilling fluid flowing over the housing. To ensure good conductive heat transfer between the chassis and the housing, the chassis portions are urged outwardly toward the housing surface. A conformable thermal interface material preferably forms the chassis second heat transfer surface. The system may also includes a thermoelectric cooler mounted in a drill pipe portion of the downhole assembly that transfer heat from the an electronic component mounted in the drill pipe to the drill pipe, which then transfers the heat to the drilling fluid.

대표청구항 ▼

[ What is claimed:] [1.] A cooled electronic system for use downhole in a drill string through which a drilling fluid flows, said cooled electronic system comprising:a) a housing adapted to be disposed within said drill string, whereby said drilling fluid flows over said housing;b) at least first an

[ What is claimed:] [1.] A cooled electronic system for use downhole in a drill string through which a drilling fluid flows, said cooled electronic system comprising:a) a housing adapted to be disposed within said drill string, whereby said drilling fluid flows over said housing;b) at least first and second thermoelectric coolers enclosed by said housing, each of said first and second thermoelectric coolers comprising (i) a hot plate on one side thereof, (ii) a cold plate on another side thereof, and (iii) means for transferring heat from said cold plate to said hot plate;c) a first electronic component having first and second surfaces, said first electronic component enclosed by said housing and sandwiched between said first and second thermoelectric coolers, said first and second thermoelectric coolers oriented so that their respective cold plates are in heat flow communication with said first and second surfaces, respectively, of said first electronic component, whereby each of said cold plates receives heat from said first electronic component and transfers said received heat to its respective hot plate; andd) a thermally conductive chassis in which said sandwich of said electronic component and said thermoelectric coolers is mounted, said chassis having first, second and third heat transfer surfaces, said chassis first heat transfer surface in heat flow communication with said hot plate of said first thermoelectric cooler, said chassis second heat transfer surface in heat flow communication with said hot plate or said second thermoelectric cooler, said chassis third heat transfer surface in heat flow communication with said housing, whereby said chassis conducts heat from said hot plates of said first and second thermoelectric coolers to said housing, and whereby said housing transfers heat to said drilling fluid flowing over said housing.