초록 ▼

A solid-state lighting unit for automated visual inspection includes a high-density array of light emitting diodes. The packing density of said diode array being limited only by the physical size of the light emitting diode chips and the ability to perform die and wire bond operations on the bare ch

A solid-state lighting unit for automated visual inspection includes a high-density array of light emitting diodes. The packing density of said diode array being limited only by the physical size of the light emitting diode chips and the ability to perform die and wire bond operations on the bare chips. Each diode is disposed on an electrically insulated, thermally conductive base unit. The base unit is, in turn, in a thermally conductive path with a heat dissipator. The provisions made to ensure a thermally conductive path from the individual light emitting diode chips to the heat dissipator combined with the high chip packing densities work together to create a solid-state lighting array capable of producing extremely high illumination fields when operated in either pulsed or continuous current mode.

대표청구항 ▼

[ Having thus described the invention, we now claim:] [1.] A machine vision apparatus comprising:a lighting array for selectively illuminating a viewing area comprising,a plurality of individual light emitting elements formed of a semiconductor compound which directly converts a percentage of electr

[ Having thus described the invention, we now claim:] [1.] A machine vision apparatus comprising:a lighting array for selectively illuminating a viewing area comprising,a plurality of individual light emitting elements formed of a semiconductor compound which directly converts a percentage of electrons which are conducted through their volume into emitted photons in one of UV, visible, and/or IR portions of an electromagnetic spectrum, the light emitting elements being placed within a one- or two-dimensional pattern wherein element spacing is less than or equal to 0.05",an electrically insulative, thermally conductive support substrate having a thermal conductivity greater than 1 W/m.cndot..sup.o K upon which the light emitting elements are directly attached in formation of the pattern, said support substrate specifically selected for its ability to facilitate conduction of locally generated thermal energy away from the light emitting elements while at the same time providing a sufficient degree of electrical isolation required to support parallel and series circuit construction associated with the individual light-emitting elements, and,a heat dissipater disposed in direct thermal contact with the thermally conductive support substrate reducing the temperature of the light-emitting elements within the array;a camera for acquiring images of specimens disposed in the illuminated viewing area;a lighting control unit in communication with the lighting array; and,a computer in communication with the camera to receive the acquired images and in communication with the lighting control unit.