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Computer with an improved internal cooling system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0994742 (1997-12-19)
발명자 / 주소
  • Scholder Erica
출원인 / 주소
  • Dell U.S.A., L.P.
대리인 / 주소
    Haynes and Boone, L.L.P.
인용정보 피인용 횟수 : 47  인용 특허 : 11

초록

A computer in which a microprocessor module is disposed in the computer chassis and is cooled by a heat sink disposed in a heat exchange relation to the microprocessor. A fan is disposed in the chassis and adapted to induce air flow, and a shroud is connected to the heat sink and encloses the heat s

대표청구항

[ What is claimed is:] [1.] A computer comprising;a chassis,a microprocessor module disposed in the chassis,a heat sink disposed in the chassis in a heat exchange relation to the microprocessor, the heat sink formed by spaced, horizontally-extending plates and substantially U-shaped, vertically-exte

이 특허에 인용된 특허 (11)

  1. Estes Scott (Austin TX) Swamy Deepak (Austin TX), Circuit board-mounted IC package cooling apparatus.
  2. Kyung Johnny S. (Austin TX) Jones Pearce R. (Austin TX), Clip for mounting a heat sink on an electronic device package.
  3. Butterbaugh Matthew A. (Rochester MN) Dingfelder Donald W. (Winona MN) Herman Peter M. (Oronoco MN) Kang Sukhvinder S. (Rochester MN), Cooling apparatus for electronic chips.
  4. Suzuki Masahiro (Kawasaki JPX) Fujisaki Akihiko (Kawasaki JPX) Ishimine Junichi (Kawasaki JPX), Cooling structure for integrated circuit element modules, electronic device and heat sink block.
  5. Hoover John W. (Huntington CT), Detachable apparatus for cooling integrated circuits.
  6. Atarashi Takayuki (Tsuchiura JPX) Hatada Toshio (Tsuchiura JPX) Daikoku Takahiro (Isehara JPX) Kawasaki Nobuo (Ibaraki-ken JPX) Iino Toshiki (Ibaraki-ken JPX) Tsukaguchi Tamotsu (Hiratsuka JPX) Kasai, Electronic apparatus.
  7. Katsui Tadashi (Kawasaki JPX) Nakata Katsuhiko (Kawasaki JPX) Koga Takeshi (Kawasaki JPX) Matsumura Tadanobu (Kawasaki JPX) Tanaka Yoshimi (Kawasaki JPX) Sugimoto Yasuaki (Kawasaki JPX) Kitahara Taka, Heat sink for cooling a heat producing element and application.
  8. White Nikolas F. (Austin TX), Heat sink retention apparatus and method.
  9. Penniman Mark B. (Austin TX) Skillman Peter N. (San Carlos CA) Lillios Tony J. (Palo Alto CA) Boyle Dennis J. (Palo Alto CA), Integrated circuit dual cooling paths and method for constructing same.
  10. Nelson Daryl J. (Beaverton OR) Tirumala Muralidhar (Portland OR) Butler Peter (Hillsboro OR) Budelman Gerald A. (Aloha OR), Integrated circuit package with an integral heat sink and fan.
  11. Keen Nickey D. (Kokomo IN), Spring retainer for encapsulated semiconductor device.

이 특허를 인용한 특허 (47)

  1. Carr, Daniel Shawn; Johnson, Robert Warren; Shepherd, Jason Alan, Acoustic encapsulating system for hard drives.
  2. Tucker Sean W. ; Roesner Arlen L ; Smith Darren B ; Trotter Donald ; Delano Andrew D, Actively cooled daughterboard system.
  3. Cravens,Zachary A.; Wobig,Eric C., Adjustable heat sink shroud.
  4. Artman, Paul T.; Bailey, Mark M., Airflow shroud mounted fan system and method for cooling information handling system components.
  5. Talbot Gerald ; Beale Michael ; Reynolds Michael, Apparatus and method for cooling a processor circuit board.
  6. Stock, Michael; Campbell, Brenda; Robbins, Jonathan, Apparatus and method for cooling electrical components of a computer.
  7. Talbot Gerald ; Beale Michael ; Reynolds Michael, Apparatus and method for mounting a processor circuit board on a system mother board.
  8. Johnson Robert W. ; Eddings ; II Richard L. ; Curlee James D., Apparatus and method for mounting and cooling a system component assembly in a computer.
  9. Smith, Grant M.; Jochym, Daniel A.; Wessel, Mark W., Apparatus and method for shielding a circuit board.
  10. Johnson Robert W. ; Eddings ; II Richard L. ; Curlee James D., Apparatus for mounting and cooling a system components in a computer.
  11. Lin, Kuo-cheng; Tsai, Ming-shi; Huang, Yu-huang; Huang, Wen-shi, Centrifugal fan having upside-down mounted structure.
  12. Watts, Jr., La Vaughn F.; Dadzie, Kofi Nkisah; Zhang, Yi, Computer system thermal lap management method and apparatus.
  13. Sands Steve ; McAnally Andrew L. ; Mills R. Steven, Computer with an improved cooling system and a method for cooling a computer.
  14. Osborn, Jay K.; Wilson, Helenaur, Computing apparatus with cooling fan.
  15. Neal, Thomas; Throop, Robert; Robertson, Ken, Cooling a computing device.
  16. Yang,Chih Hao; Chang,Yuh Ching; Lo,Chien Yi; Chen,Rong Che, Cooling device for heat-generating electronic component.
  17. Jensen, Ralph W.; Bailey, Mark M., Dishrack shroud for shielding and cooling.
  18. Takashima, Osamu; Matsumoto, Kazuyoshi; Murano, Junichi; Shoji, Katsunori; Tsukamura, Kiyoshi; Uchida, Toshiyuki, Duct fan unit.
  19. Bestwick, Graham Spencer, Electronics assembly with cooling arrangement.
  20. Hung, Kuo-Chuan, Fan cover heat dissipation assembly for a host computer CPU.
  21. Bollesen Vernon P., Fan heat sink and method.
  22. Peter Cuong Dac Ta ; Vernon P. Bollesen ; Stephen Seto, Fan shroud and method of securing a fan.
  23. Chen, Ku-Feng; Chen, Yu-Lin, Fixing device without screws.
  24. Tian,Wei Qiang; Xia,Wan Lin; Li,Tao, Heat dissipation device.
  25. Zhou, Shi Wen; Cao, Jun; Deng, Jie Cheng, Heat dissipation device assembly with a fan duct having guiding members for guiding a screwdriver to assemble the heat dissipation device assembly to a printed circuit board.
  26. Chen,Chin Hui, Heat dissipation device incorporating fan duct.
  27. Xu, Hong Bo, Heat dissipation device with a fan holder.
  28. Miyamura, Harold; Malone, Christopher G., Heat sink apparatus utilizing the heat sink shroud to dissipate heat.
  29. Chou,Kuan Yin, Heat sink for a memory.
  30. Foster, Sr., Jimmy G.; Hardee, Donna C.; Keener, Don S.; Wolford, Robert R., Heat sink for dissipating a thermal load.
  31. Foster, Sr., Jimmy G.; Hardee, Donna C.; Keener, Don S.; Wolford, Robert R., Heat sink for dissipating a thermal load.
  32. Foster, Sr.,Jimmy G.; Hardee,Donna C.; Keener,Don S.; Wolford,Robert R., Heat sink for distributing a thermal load.
  33. Park,Hee sung; Kim,Sun soo, Heatsink.
  34. Lewis Jeffrey M. ; Rolla Michael R. ; Sullivan Robert L., Low-profile cooling assembly for the CPU chip of a computer or the like.
  35. Konstad Rolf A. ; Smelser Brad A., Memory card cooling device.
  36. David K. J. Kim ; William W. Ruckman ; Dimitry Struve, Method and apparatus for cooling electronic components.
  37. Korinsky, George K.; Crawford, Craig, Method and apparatus for dissipating heat from an electronic device.
  38. Korinsky, George K.; Crawford, Craig, Method and apparatus for dissipating heat from an electronic device.
  39. Dean, Ronald P.; Richard, Owen T.; Armiger, William J.; Bullington, James R., Method and apparatus for securing a fan within a device.
  40. Giraldo, Mike D.; Haselby, Jeffrey T.; Womack, Christopher C., Modular fan system.
  41. Chih-chung Chen TW, Motherboard heat sink passage and support board.
  42. Cachia, Charles Anthony, Plate.
  43. Becker, Craig Henry; Hsu, Jimmy Ming-Der; Vicknair, Wayne Elmo, Portable device for cooling a laptop computer.
  44. Wobig,Eric C.; Thornton,David S.; Duncan,Tyler B., Reinforced air shroud.
  45. Arbogast, Porter; Roesner, Arlen L., Removable fan module and electronic device incorporating same.
  46. Hoss Shawn P. ; Moss David L., Thermal connection system for modular computer system components.
  47. Allman Richard K., Thermally-coupled heat dissipation apparatus for electronic devices.
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