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Method of forming a circuit board 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/30
출원번호 US-0585428 (1996-01-11)
발명자 / 주소
  • Lake Rickie C.
  • Mousseau Joe
  • Tuttle Mark E.
출원인 / 주소
  • Micron Communications, Inc.
대리인 / 주소
    Wells, St. John, Roberts, Gregory & Matkin, P.S.
인용정보 피인용 횟수 : 41  인용 특허 : 17

초록 ▼

A method of forming a circuit board includes, a) providing a temporary substrate; b) depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate; c) substantially curing the uncured circuit board ma

대표청구항 ▼

[ We claim:] [1.] A method of forming a circuit board comprising the following steps:providing a temporary substrate;depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate;substantially curing

이 특허에 인용된 특허 (17)

  1. Souto Mark A. (Huntington Beach CA) Schreiber Christopher M. (Newport Beach CA), Apparatus and method using a permanent mandrel for manufacture of electrical circuitry.
    상세보기
  2. Takase Mitsuo (Kamagaya JPX) Fukuda Nobuhiro (Yokohama JPX) Dodo Toshihiro (Chigasaki JPX), Circuit board for optical devices.
    상세보기
  3. Hang Kenneth W. (Windsor Township ; Mercer County NJ) Prabhu Ashok N. (Windsor Township ; Mercer County NJ), Devitrifying glass frits.
    상세보기
  4. Hang Kenneth W. (West Windsor Township ; Mercer County NJ) Prabhu Ashok N. (East Windsor Township ; Mercer County NJ) Anderson Wayne M. (Hamilton Township ; Mercer County NJ), Dielectric inks for multilayer copper circuits.
    상세보기
  5. Hang Kenneth W. (West Windsor Township ; Mercer County NJ) Prabhu Ashok N. (East Windsor Township ; Mercer County NJ) Anderson Wayne M. (Hamilton Township ; Mercer County NJ), Dielectric inks for multilayer copper circuits.
    상세보기
  6. Fukutomi Naoki (Yuki JPX) Nakayama Hajime (Tsukuba JPX) Tsubomatsu Yoshiaki (Tsuchiura JPX) Kaitou Kouichi (Niihari JPX) Yoshidomi Yasunobu (Shimodate JPX) Takahashi Yoshihiro (Tsukuba JPX), Fabrication process of wiring board.
    상세보기
  7. MacLellan John Austin (Aberdeen NJ) Shober R. Anthony (Red Bank NJ) Vannucci Giovanni (Middletown NJ) Wright Gregory Alan (Colts Neck NJ), Full duplex modulated backscatter system.
    상세보기
  8. Baldwin ; Howard A. ; Depp ; Steven W. ; Koelle ; Alfred R. ; Freyman ; Robert W., Interrogation, and detection system.
    상세보기
  9. Crumly William R. (Anaheim) Schreiber Christopher M. (Newport Beach) Feigenbaum Haim (Irvine CA), Method of forming three-dimensional circuitry.
    상세보기
  10. Juskey Frank J. (Coral Springs FL) Bernardoni Lonnie L. (Coral Springs FL) Freyman Bruce J. (Plantation FL) Suppelsa Anthony B. (Coral Springs FL), Method of making a transfer molded semiconductor device.
    상세보기
  11. Ambrose Stephen D. (Ste. 176 ; 33338 Agua Dulce Canyon Rd. Agua Dulce CA 91350), Method of manufacturing an electrical circuit system and electrical circuit system.
    상세보기
  12. Ohta Tomozo (Ikoma JPX) Nakano Hiroshi (Tenri JPX) Higashi Kazutada (Tenri JPX) Yamamoto Hirohiko (Tenri JPX), Microwave data transmission apparatus.
    상세보기
  13. Sharpe Claude A. (McKinney TX) Hurta Dwaine S. (Garland TX) Hamlett Mark A. (Garland TX), Multi-stage transponder wake-up, method and structure.
    상세보기
  14. Ambros Peter (Leutershausen DEX) Budig Walter (Wulfershausen DEX) Westermeir Gisela (Hohenroth DEX), Process for preparing printed circuits.
    상세보기
  15. Prabhu Ashok N. (East Windsor NJ) Hang Kenneth W. (Princeton NJ) Conlon Edward J. (Princeton NJ), Thick-film copper conductor inks.
    상세보기
  16. Ochi Katsunori (Itami JPX) Takemura Seiji (Itami JPX) Kodai Syojiro (Sanda JPX) Kurisu Tuguo (Sanda JPX), Thin IC card.
    상세보기
  17. Hang Kenneth W. (West Windsor Township ; Mercer County NJ) Prabhu Ashok N. (East Windsor Township ; Mercer County NJ), Via fill ink composition for integrated circuits.
    상세보기

이 특허를 인용한 특허 (41)

  1. Crumly William R. ; Feigenbaum Haim, Bumps with plural under-bump dielectric layers.
    상세보기
  2. Wittenberg, Michael B.; Kole, Jared M.; Cohen, Sawyer I.; Malek, Shayan, Component mounting structures with breakaway support tabs.
    상세보기
  3. Tuttle, Mark E., Electronic communication devices, methods of forming electrical communication devices, and communications methods.
    상세보기
  4. Krappe,Anu; Str？mberg,Samuli, Injection moulded product and a method for its manufacture.
    상세보기
  5. Kim, Bong Young, Manufacturing method for protection circuit module of secondary battery.
    상세보기
  6. Tsai, Ming-Sung; Hsu, Hsieh-Wei, Memory card and method for fabricating the same.
    상세보기
  7. Hanhikorpi, Marko, Method for forming a product sensor, and a product sensor.
    상세보기
  8. Kerr, Roger Stanley; Tredwell, Timothy John, Method for forming an electronic device on a flexible substrate supported by a detachable carrier.
    상세보기
  9. Halope,Christophe, Method for manufacturing radiofrequency identification device using transfer paper and radiofrequency identification device produced using this method.
    상세보기
  10. Schoonejongen, Ronald J.; Juskey, Frank; LoBianco, Anthony J., Method for molding semiconductor package having a ceramic substrate.
    상세보기
  11. Halope, Christophe, Method for producing a contactless chip card using transfer paper.
    상세보기
  12. Sun, Shuo-Yang; Huang, Wan-Chen; Lin, Wei-Ting; Cheng, Chun-Cheng, Method of bonding and debonding substrate.
    상세보기
  13. Glenn Thomas P., Method of forming an integrated circuit device package using a plastic tape as a base.
    상세보기
  14. Yan, Susan G., Method of making membrane electrode assemblies.
    상세보기
  15. Tuttle Mark E. ; Tuttle John R. ; Lake Rickie C., Method of manufacturing an enclosed transceiver.
    상세보기
  16. Tuttle, Mark E.; Tuttle, John R.; Lake, Rickie C., Method of manufacturing an enclosed transceiver.
    상세보기
  17. McCormack, Mark Thomas; Roman, James; Zhang, Lei; Beilin, Solomon I., Methods for detaching a layer from a substrate.
    상세보기
  18. Lei Zhang ; Solomon Beilin ; Som S. Swamy ; James J. Roman, Methods for fabricating flexible circuit structures.
    상세보기
  19. Fjelstad, Joseph, Methods for manufacturing resistors using a sacrificial layer.
    상세보기
  20. Fjelstad,Joseph, Methods for manufacturing resistors using a sacrificial layer.
    상세보기
  21. Fjelstad,Joseph, Methods for manufacturing resistors using a sacrificial layer.
    상세보기
  22. Glenn, Thomas P., Plastic integrated circuit device package having exposed lead surface.
    상세보기
  23. Exposito Juan,FRX ; Herard Laurent,FRX ; Cigada Andrea,ITX, Process for manufacturing semiconductor packages comprising an integrated circuit.
    상세보기
  24. Tuttle, John R., Radio frequency identification device and method.
    상세보기
  25. Tuttle, John R., Radio frequency identification device and method.
    상세보기
  26. Frankowsky,Gerd; Hedler,Harry; Vasquez,Barbara, Semiconductor circuit module and method for fabricating semiconductor circuit modules.
    상세보기
  27. DiCaprio, Vincent; Kaskoun, Kenneth, Semiconductor memory card.
    상세보기
  28. DiCaprio, Vincent; Kaskoun, Kenneth, Semiconductor memory cards and method of making same.
    상세보기
  29. Str철mberg,Samuli; Hanhikorpi,Marko, Smart label and a smart label web.
    상세보기
  30. Str？mberg,Samuli, Smart label web and a method for its manufacture.
    상세보기
  31. Str？mberg,Samuli; Hanhikorpi,Marko, Smart label web and a method for its manufacture.
    상세보기
  32. Tuttle, John R., System and method to track articles at a point of origin and at a point of destination using RFID.
    상세보기
  33. Tuttle John R. ; Wood ; Jr. Clifton W. ; McCabe Arthur Barney, Tamper resistant smart card and method of protecting data in a smart card.
    상세보기
  34. Naito, Toshiki; Ohsawa, Tetsuya; Kataoka, Kouji, Wired circuit board assembly sheet.
    상세보기
  35. Naito, Toshiki; Ohsawa, Tetsuya; Kataoka, Kouji, Wired circuit board assembly sheet.
    상세보기
  36. Naito, Toshiki; Ohsawa, Tetsuya; Kataoka, Kouji, Wired circuit board assembly sheet.
    상세보기
  37. Naito, Toshiki; Ohsawa, Tetsuya; Kataoka, Kouji, Wired circuit board assembly sheet.
    상세보기
  38. Tuttle, Mark E., Wireless identification device, RFID device with push-on/push off switch, and method of manufacturing wireless identification device.
    상세보기
  39. Tuttle,Mark E., Wireless identification device, RFID device with push-on/push off switch, and method of manufacturing wireless identification device.
    상세보기
  40. Tuttle, Mark E., Wireless identification device, RFID device with push-on/push-off switch, method of manufacturing wireless identification device.
    상세보기
  41. Mark E. Tuttle, Wireless identification device, RFID device, and method of manufacturing wireless identification device.
    상세보기

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