|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||156/079 ; 156/252 ; 156/292 ; 156/295 ; 156/304.2 ; 156/304.3 ; 156/304.5|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 17 인용 특허 : 7|
An improved panel structure wherein at least one face of the panel is perforated with small holes and where it is desirable to minimize the number of holes that get filled in with adhesive. For example, an improved noise reducing acoustic panel (30) (FIG. 3) constructed of a nonperforated inner skin (14), a perforated outer skin (16) having small holes (18), two sections (12, 12a) of honeycomb core material which are bonded or spliced together by a partially or fully encapsulated foaming adhesive (32e) which has been foamed and expanded, thereby forcing ...
[ What is claimed is:] [1.] A lay-up process for making an improved multi-layered panel structure having at least one face member of the panel perforated with small holes and said perforated face member having a minimum number of said small holes that become filled with adhesive during the lay-up process, said process comprising:(a) cutting a rectangular strip of a supported film adhesive and laying said strip on a flat surface;(b) cutting a rectangular strip of a foaming adhesive, laying said strip of foaming adhesive on said strip of supported film adh...