$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method and apparatus for surface inspection in a chamber 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01N-021/00
출원번호 US-0742448 (1996-11-01)
발명자 / 주소
  • Sun James J.
출원인 / 주소
  • MSP Corporation
대리인 / 주소
    Westman, Champlin & Kelly, P.A.
인용정보 피인용 횟수 : 53  인용 특허 : 19

초록

An inspection system for inspecting products that have a flat, reflective surface, such as a wafer or a flat panel display on which a thin film is to be deposited, includes an inspection chamber connected to a processing chamber with both of the chambers being under vacuum. The inspection equipment

대표청구항

[ What is claimed is:] [1.] A processing and inspection apparatus including at least one product processing chamber for processing a product under vacuum, the product having a flat surface, at least one vacuum source for maintaining the product under vacuum, and an inspection chamber under vacuum, t

이 특허에 인용된 특허 (19)

  1. Sawin Herbert H. (Arlington MA) Conner William T. (Somerville MA) Dalton Timothy J. (N. Reading MA) Sachs Emanuel M. (Somerville MA), Apparatus and method for real-time measurement of thin film layer thickness and changes thereof.
  2. Clarke Graham Morley (Edinburgh SC), Detection of blemishes in surfaces.
  3. Toro-Lira Guillermo L. (Sunnyvale CA) Abel Alan C. (San Jose CA) Achilles Alan H. (San Jose CA), High speed wafer handling method.
  4. Aqui Derek G. (San Jose CA) Borden Peter G. (San Mateo CA), In situ real time particle monitor for a sputter coater chamber.
  5. Carlson David K. (Santa Clara CA) Bowman Russell (San Jose CA), In-situ measurement of a thin film deposited on a wafer.
  6. Barbee Steven G. (Dover Plains NY) Li Leping (New Paltz NY) Silvestri Victor J. (Hopewell Junction NY), Interferometer for in situ measurement of thin film thickness changes.
  7. Kramer Charles J. (Pittsford NY), Linear integrating cavity light collector.
  8. Massoud Hisham Z. (Durham NC) Sampson Ronald K. (Durham NC), Method and apparatus for real-time wafer temperature and thin film growth measurement and control in a lamp-heated rapid.
  9. Moslehi Mehrdad M. (Dallas TX), Method and apparatus for semiconductor device fabrication diagnosis and prognosis.
  10. Chanayem Steve G. (Sunnyvale CA), Method of in-situ particle monitoring in vacuum systems.
  11. Maydan Dan (Los Altos Hills CA) Wang David N. (Saratoga CA), Multistep planarized chemical vapor deposition process with the use of low melting inorganic material for flowing while.
  12. Levy Karl B. (19050 Dagmar Dr. Saratoga CA 95070), Optical monitoring of growth and etch rate of materials.
  13. Neukermans Armand P. (Palo Alto CA) Jann Peter C. (Santa Clara CA) Wolf Ralph (Palo Alto CA) Wolze David (San Jose CA) Stokowski Stanley (Danville CA), Particle detection on a patterned or bare wafer surface.
  14. Jann Peter C. (Santa Clara CA) Gross Kenneth P. (San Carlos CA) Neukermans Armand P. (Palo Alto CA), Particle detector for rough surfaces.
  15. Pecen Jiri (Palo Alto CA) Gross Kenneth P. (San Carlos CA) Leslie Brian (Cupertino CA) Kren George (Los Altos Hills CA), Position location in surface scanning using interval timing between scan marks on test wafers.
  16. Galbraith, Lee K., Scanning contaminant and defect detector.
  17. Gross Kenneth P. (San Carlos CA) Kren George J. (Los Altos Hills CA) Bevis Christopher F. (San Francisco CA), Surface scanner with thin film gauge.
  18. Ohshima Ken (Tokyo JPX) Sakamoto Masaharu (Tokyo JPX), System for checking defects on a flat surface of an object.
  19. Edwards Richard C. (Ringwood NJ) Kolesa Michael S. (Suffern NY) Ishikawa Hiroichi (Mahwah NJ), Wafer processing cluster tool batch preheating and degassing apparatus.

이 특허를 인용한 특허 (53)

  1. Kagoshima, Akira; Yamamoto, Hideyuki; Torii, Yoshimi; Usui, Tatehito, Apparatus and method for producing semiconductors.
  2. Wright,Mark, Chamber particle detection system.
  3. Phan, Khoi A.; Singh, Bhanwar; Porsche, Wolfram, Defect detection in pellicized reticles via exposure at short wavelengths.
  4. Almogy, Gilad; Goldberg, Boris; Naftali, Ron, Defect detection with enhanced dynamic range.
  5. Almogy, Gilad; Goldberg, Boris; Naftali, Ron, Defect detection with enhanced dynamic range.
  6. Ishiura,Tomoaki; Miyazaki,Kunihiko; Ichifuji,Katsumi, Defect detector and method of detecting defect.
  7. Opsal,Jon; Wen,Youxian, Feed forward critical dimension control.
  8. Muckenhirn, Sylvain, Front face and edge inspection.
  9. Janos, Alan; Saubhayana, Montien, In-situ absolute measurement process and apparatus for film thickness, film removal rate, and removal endpoint prediction.
  10. Reinhron, Silviu; Almogy, Gilad, Inspection systems performing two-dimensional imaging with line light spot.
  11. Wang, Wen-Chuan; Lin, Shy-Jay; Huang, Te-Chih; Ke, Chih-Ming; Su, Wei-Yu; Liu, Heng-Hsin; Gau, Tsai-Sheng; Lin, Chin-Hsiang, Mask haze early detection.
  12. Grover, Jason A.; Allen, Jr., Sam H.; Conboy, Michael R., Method and apparatus for controlling a multi-chamber processing tool.
  13. Park Soon-jong,KRX ; Yun Jong-soon,KRX, Method and apparatus for detecting the presence of particles on a wafer holder of semiconductor exposure equipment.
  14. Shortt,David W., Method and apparatus for determining surface layer thickness using continuous multi-wavelength surface scanning.
  15. Stehle, Jean-Louis; Boher, Pierre, Method and apparatus for ellipsometric metrology for a sample contained in a chamber or the like.
  16. Hunter, Reginald, Method and apparatus for embedded substrate and system status monitoring.
  17. Hunter, Reginald, Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques.
  18. Batson, Don T.; Hunter, Reginald, Method and apparatus for substrate imaging.
  19. Hunter, Reginald, Method and apparatus for substrate surface inspection using spectral profiling techniques.
  20. Rashid Mavliev ; Hwa-Chi Wang, Method and apparatus for the fast detection of surface characteristics.
  21. John A. Fitzsimmons ; Darryl D. Restaino ; Michael J. Schade, Method and apparatus to improve coating quality.
  22. Hunter, Reginald, Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques.
  23. Hunter,Reginald, Method and apparatus to provide for automated process verification and hierarchical substrate examination.
  24. Ashkenaz,Scott; Larson,C. Thomas, Method of interfacing ancillary equipment to FIMS processing stations.
  25. Hasper, Albert, Method of processing substrates with integrated weighing steps.
  26. Hunter, Reginald; Marquis, Eduardo, Methods for continuous embedded process monitoring and optical inspection of substrates using specular signature analysis.
  27. Hunter, Reginald, Optical signal routing method and apparatus providing multiple inspection collection points on semiconductor manufacturing systems.
  28. Janos, Alan C.; Cardoso, Andre G.; Richardson, Daniel B., Optimized optical system design for endpoint detection.
  29. Shiraishi,Daisuke; Kagoshima,Akira; Yamamoto,Hideyuki; Arai,Takeshi; Nakano,Hiroyuki, Particle control device and particle control method for vacuum processing apparatus.
  30. Hunter, Reginald, Particle detection and embedded vision system to enhance substrate yield and throughput.
  31. Hunter, Reginald; Tsadka, Sagie, Particle detection and embedded vision system to enhance substrate yield and throughput.
  32. Marxer,Norbert; Gross,Kenneth P.; Altendorfer,Hubert; Kren,George, Process and assembly for non-destructive surface inspections.
  33. De Ridder, Christianus Gerardus Maria; den Hartog, Edwin, Processing system with increased cassette storage capacity.
  34. Piccolo, III,Joseph; Martinez,Juan A.; Vincent,Gary W., Programmable multicandela notification device.
  35. Bischoff,Joerg, Resolution enhanced optical metrology.
  36. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
  37. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
  38. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  39. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  40. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  41. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  42. Phan,Khoi A.; Singh,Bhanwar; Subramanian,Ramkumar, Scatterometry monitor in cluster process tool environment for advanced process control (APC).
  43. Stevens Ronald R. ; Aggarwal Ravinder, Stackable cassette for use with wafer cassettes.
  44. Rosengaus, Eliezer; Lange, Steven R., System and method for inspecting semiconductor wafers.
  45. Gimelfarb, Vladimir; Hultgren, Kent, System and method for measuring coating thickness.
  46. Phan,Khoi; Rangarajan,Bharath; Singh,Bhanwar; Choo,Bryan, System and method for visually monitoring a semiconductor processing system.
  47. Cheng,Chi Wah; Tsang,Hoi Fung; Yeung,Chi Yat; Tse,Wang Lung Alan, System for processing electronic devices.
  48. Biellak,Steve; Stokowski,Stanley E.; Vaez Iravani,Mehdi, Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination.
  49. Finarov, Moshe, Two dimensional beam deflector.
  50. Finarov,Moshe, Two-dimensional beam deflector.
  51. Strait, David Robert, Vacuum chamber with recessed viewing tube and imaging device situated therein.
  52. Sullivan,Paul; Kren,George; Rosengaus,Eliezer; Huet,Patrick; Piramuthu,Robinson; Plihal,Martin; Xiong,Yan, Wafer inspection systems and methods for analyzing inspection data.
  53. Sullivan,Paul; Kren,George; Rosengaus,Eliezer; Huet,Patrick; Piramuthu,Robinson; Plihal,Martin; Xiong,Yan, Wafer inspection systems and methods for analyzing inspection data.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로