초록 ▼

An electronic semiconductor device package, the package comprising: a substrate having traces; a die attached to the substrate; first level interconnects of the die to the traces of the substrate; and a stiffener attached to the substrate, wherein the stiffener comprises at least one clip. A system

An electronic semiconductor device package, the package comprising: a substrate having traces; a die attached to the substrate; first level interconnects of the die to the traces of the substrate; and a stiffener attached to the substrate, wherein the stiffener comprises at least one clip. A system for attaching a heat sink to an electronic semiconductor device package, the system comprising: a stiffener of the electronic package which is attachable to the electronic package; and at least one clip that is integral with the stiffener and secures the heat sink to the stiffener. A method of detachably attaching a heat sink to an electronic semiconductor device package, the method comprising: attaching a stiffener to the package, wherein the stiffener comprises at least one clip; positioning a heat sink adjacent the stiffener; and engaging the clip with the heat sink, wherein the heat sink is secured to the stiffener by the clip.

대표청구항 ▼

[ I claim:] [1.] An electronic semiconductor device package, said package comprising:a substrate having traces;a die attached to said substrate;first level interconnects electrically coupling said die to the traces of said substrate;a stiffener attached to said substrate, wherein said stiffener comp

[ I claim:] [1.] An electronic semiconductor device package, said package comprising:a substrate having traces;a die attached to said substrate;first level interconnects electrically coupling said die to the traces of said substrate;a stiffener attached to said substrate, wherein said stiffener comprises at least one J shaped clip having a ridge; anda heat sink having a ridge adjacent to said stiffener, wherein the ridge of the J shaped clip of said stiffener engages the ridge of the heat sink to secure said heat sink to said stiffener.