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Ring illumination apparatus for illuminating reflective elements on a generally planar surface

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01N-021/00
  • G01B-011/14
  • H04N-007/18
  • H04N-009/47
출원번호 US-0807397 (1997-02-26)
발명자 / 주소
  • King Steven Joseph
  • Ludlow Jonathan Edmund
  • Chouinard Jon
  • Schurr George
출원인 / 주소
  • Acuity Imaging, LLC
대리인 / 주소
    Bourque and Associates, PA
인용정보 피인용 횟수 : 38  인용 특허 : 39

초록

An inspection system and method uses a ring illumination apparatus to illuminate one or more reflective elements, such as solder balls on an electronic component or other protruding surfaces or objects. The ring illumination apparatus includes a substantially ring-shaped light source that provides a

대표청구항

[ What is claimed is:] [1.] A ring illumination apparatus, for illuminating a plurality of reflective elements disposed on a generally planar surface of an article to be inspected and disposed within in a field of view of an illumination detection device, said ring illumination apparatus comprising:

이 특허에 인용된 특허 (39)

  1. Brown Mark D. (Carrollton TX) Kaiser Stephen B. (Flower Mound TX), Apparatus and method for inspection.
  2. Tokura Nobufumi (Fukuoka JPX) Nishi Shoichi (Fukuoka JPX), Apparatus for and method of detecting shape of solder portion.
  3. LeBeau Christopher J. (Tempe AZ), Automatic package inspection method.
  4. Sugawara Kenji (Tokyo JPX), Bonding wire inspection apparatus and method.
  5. White Timothy P. (New Boston NH) Messina Michael C. (Goffstown NH) LeBlanc Steven M. (Hancock NH), Continuous diffuse illumination method and apparatus.
  6. Kalnajs Andrejs K. (Madison AL) Mueller Rolf H. (Auburn NY), Distributed light delivery system.
  7. Cochran Don W. (Mayfield Village OH) Austin James R. (Mentor-on-the-Lake OH), Engineered video inspecting lighting array.
  8. Anderson Charles H. (Dallas TX), Hemispherical non-glare illuminator.
  9. Siu Bernard (732 N. Diamond Bar Blvd. Diamond Bar CA 91765), High speed illumination system for microelectronics inspection.
  10. Siu Bernard (732 N. Diamond Bar Blvd. Diamond Bar CA 91765), High speed image acquisition for microelectronics inspection.
  11. White Timothy P. (New Boston NH), Illumination device for indirectly illuminating an object with continuous diffuse light.
  12. White Timothy P. (146 Lull Rd. New Boston NH 03070), Illumination device for providing continuous diffuse light on and off an observing axis.
  13. Arnold Aaron L. (Palm Beach Gardens FL 4) Woodward Daniel A. (West Palm Beach FL), Illumination devices for inspection systems.
  14. Borgert Gerald D. (Northville MI) Bartlett Robert J. (Ann Arbor MI) Ellison James F. (Brighton MI), Illumination system and method for generating an image of an object.
  15. Cochran Don W. (Highland Heights OH) Austin James R. (Mentor-on-the-Lake OH), Inspection lighting system.
  16. Yoshida Hajime (Tokyo JPX), Lighting device for inspecting objects for flaws.
  17. Koljonen Juha (Needham MA) Michael David J. (Newton MA), Method and apparatus for ball bond inspection system.
  18. Beers Gregory E. (Austin TX) Bogaczyk Francis W. (Austin TX) Rubsam Michael A. (Austin TX) Wattenbarger Henry E. (Pflugerville TX), Method and apparatus for electronic component lead inspection.
  19. Ray Rajarshi (Princeton NJ), Method and apparatus for inspecting articles.
  20. Tokura Nobufumi (Fukuoka JPX), Method and apparatus for inspecting solder portions.
  21. Tokura Nobufumi (Fukuoka-ken JPX), Method and apparatus for inspecting solder portions.
  22. Takagi Yuji (Yokohama JPX) Hata Seiji (Fujisawa JPX), Method and apparatus for inspecting surface pattern of object.
  23. Reiser Kurt (Hawthorne CA), Method and apparatus for inspection of solder joints utilizing shape determination from shading.
  24. Ray Rajarshi (Princeton NJ), Method and apparatus for inspection of specular, three-dimensional features.
  25. Scott Richard S. F. (Woodside CA) Uziel Yoram (Yodfat CA ILX) Filice Franco A. (Gilroy CA), Method and apparatus for the automated analysis of three-dimensional objects.
  26. Smeyers Gust (Meise BEX) Vanderheydt Luc (Wilsele BEX), Method and device for determining a position of at least one lead of an electronic component.
  27. Breu Heinz (Mountain View CA), Method for inspecting the leads of electrical components on surface mount printed circuit boards.
  28. Kobayashi Shigeki (Shiga JPX) Takahara Hideaki (Kyoto JPX), Method of and apparatus for inspecting printed circuit boards and the like.
  29. Sharp Benny H. (Yukon OK), Method of and video system for identifying different light-reflective surface areas on articles.
  30. Collet-Beillon Olivier (27 Avenue de Brimont 78400-Chatou FRX), Method of inspecting an array of solder ball connections of an integrated circuit module.
  31. Siu Bernard (732 N. Diamond Bar Blvd. Diamond Bar CA 91765), Microelectronics inspection system.
  32. Doan Tam D. (Orange CA), Optical inspection system for solder joints and inspection method.
  33. Barnes Ramon M. (Hadley MA) Bertenyi Istvan (Budapest HUX), Plasma spectroscopic analysis of organometallic compounds.
  34. Vodanovic Bojko (Beaconsfield CAX) Blanchard Michel (St-Hyacinthe CAX), QFP lead quality inspection system and method.
  35. Nayar Shree K. (Pittsburgh PA) Sanderson Arthur C. (Williamstown MA) Weiss Lee E. (Pittsburgh PA) Simon David A. (Pittsburgh PA), Solder joint inspection system and method.
  36. Schoenbaum Gary L. (Newtown CT) Latanzi Lewis A. (Roxbury CT) Hedrick Stephen L. (Danbury CT) Johnson Harold V. (Danbury CT), Solder process inspection diffuser assembly.
  37. Okamoto Shinji (Yawata JPX) Yoshimura Kazunari (Yawata JPX) Nakahara Tomoharu (Nishinomiya JPX), Soldering inspection system and method therefor.
  38. Amir Israel (Ewing NJ), Technique for illuminating a surface with a gradient intensity line of light to achieve enhanced two-dimensional imaging.
  39. Iwai Takao (Toyota JPX), Weld bead quality determining apparatus.

이 특허를 인용한 특허 (38)

  1. Joshua J. Hackney ; John Ma ; Arye Malek ; Matthew M. McPherson ; Xin Shi, 3D scanner and method for measuring heights and angles of manufactured parts.
  2. Li David, Analysis of an image of a pattern of discrete objects.
  3. Welchman, Kenneth A.; Bresnahan, Steven A.; Conaty, Jr., Henry James, Apparatus and method for automated game ball inspection.
  4. Beaty Elwin M. ; Mork David P., Apparatus for three dimensional inspection of electronic components.
  5. Kinoshita, Satoshi, Ball mount apparatus and mount method.
  6. Ulrich, Franz W.; Ma, John; Hart, Darcy J., Binary optical grating and method for generating a moire pattern for 3D imaging.
  7. Ulrich, Franz W.; Bourn, Charles T.; Tonkin, Steven W., Circuit for machine-vision system.
  8. Paulsen, Mark T.; Ulrich, Franz W., Combined 3D- and 2D-scanning machine-vision system and method.
  9. Murakoshi, Takayuki; Tanaka, Makoto; Ohashi, Kazuo, Cream solder inspection method and apparatus therefor.
  10. Chapman, Kenneth; Dahan, Sam, Directional lighting and method to distinguish three dimensional information.
  11. Beaty,Elwin M.; Mork,David P., Electronic component products and method of manufacturing electronic component products.
  12. Beaty,Elwin M.; Mork,David P., Electronic component products made according to a process that includes a method for three dimensional inspection.
  13. Ohta,Seiya; Hornikx,Paul; Wykes,David Henry, Fingerprint scanning device.
  14. Ulrich, Franz W.; Bieman, Leonard H., Imaging for a machine-vision system.
  15. Mueller, Bernhard Gunter; Schmid, Ralf; Brunner, Matthias, Light-assisted testing of an optoelectronic module.
  16. Chang, Chih-Kuang; Jiang, Li; Li, Dong-Hai, Light-emitting structure.
  17. Smets, Carl; Van Gils, Karel; Van Der Burgt, Maarten, Measuring positions of coplanarity of contract elements of an electronic component with a flat illumination and two cameras.
  18. Smets,Carl; Van Gils,Karel; Zabolitsky,John; Everaerts,Jurgen, Method and an apparatus for measuring positions of contact elements of an electronic component.
  19. Puah, Yong Joo; Tang, Hak Wee; Teo, Soon Poo, Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components.
  20. Lebens,Gary A., Method and apparatus for adjusting illumination angle.
  21. Lebens, Gary A., Method and apparatus for auto-adjusting illumination.
  22. Hackney, Joshua J.; Malek, Arye; Ulrich, Franz W.; Estridge, John B., Method and apparatus for parts manipulation, inspection, and replacement.
  23. Cochran, Don W.; Cech, Steven D.; Palombo, Thomas H.; Yoder, Michael L.; Booher, Jesse C.; Graves, Terry L., Method and apparatus for providing patterned illumination fields for machine vision systems.
  24. Beaty Elwin M. ; Mork David P., Method and apparatus for three dimensional inspection of electronic components.
  25. Beaty, Elwin M.; Mork, David P., Method and apparatus for three dimensional inspection of electronic components.
  26. Beaty, Elwin M.; Mork, David P., Method and apparatus for three dimensional inspection of electronic components.
  27. Haas Gerhard,DEX, Method and device for controlled illumination of an object for improving identification of an object feature in an image of the object.
  28. Beaty,Elwin M.; Mork,David P., Method of manufacturing electronic components including a method for three dimensional inspection.
  29. Pine, Jeffrey Augustus; Lee, Wei, Optical imaging system and method using a reflective background.
  30. Malek, Arye; Hackney, Joshua J.; Ulrich, Franz W., Parts manipulation, inspection, and replacement.
  31. Hackney, Joshua J.; Malek, Arye; Ulrich, Franz W.; Estridge, John B., Parts manipulation, inspection, and replacement system and method.
  32. Malek, Arye; Hackney, Joshua J.; Ulrich, Franz W., Parts manipulation, inspection, and replacement system and method.
  33. Henry V. Holec, Precision 3D scanner base and method for measuring manufactured parts.
  34. Beaty Elwin M. ; Mork David P., Process for three dimensional inspection of electronic components.
  35. Ohta,Seiya, Region of a fingerprint scanning device with an illuminated ring.
  36. Lewis,Walter F.; Missler,Leonard R., Ring light with user manipulable control.
  37. Ludlow Jonathan Edmund ; King Steven Joseph, System and method for arithmetic operations for electronic package inspection.
  38. Malek, Arye; Hackney, Joshua J.; Ulrich, Franz W., Tray flipper, tray, and method for parts inspection.
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