초록 ▼

A substrate carrier for a ceramic substrate which supports one or more high power semiconductor devices which is fabricated from a metal base composite and which includes strategically located high conductivity copper based inserts to provide an effective heat transfer path to a heat sink for high p

A substrate carrier for a ceramic substrate which supports one or more high power semiconductor devices which is fabricated from a metal base composite and which includes strategically located high conductivity copper based inserts to provide an effective heat transfer path to a heat sink for high power electronic devices. The coefficient of thermal expansion of both the metal based composite and the copper based inserts substantially match that of the substrate. The substrate carrier is formed by a pressure casting process where a porous preform of SiC, for example, is infiltrated with molten aluminum.

대표청구항 ▼

[ We claim:] [1.] A metal matrix composite substrate carrier for a substrate supporting high power, heat generating electronic devices, comprising:a porous preform structure having a shape conforming to a substrate supporting one or more electronic devices and locatable between a heat sink and said

[ We claim:] [1.] A metal matrix composite substrate carrier for a substrate supporting high power, heat generating electronic devices, comprising:a porous preform structure having a shape conforming to a substrate supporting one or more electronic devices and locatable between a heat sink and said substrate and comprised of non-metallic material, said preform structure being infiltrated with metal to form a hybrid metal based composite, said non-metallic material and said metal being selected so as to provide a composite having a coefficient of thermal expansion which substantially matches the coefficient of thermal expansion of said substrate, andat least one metal insert having relatively high thermal conductivity located in an opening formed in said carrier and affixed thereto for conducting heat generated by an adjacent a heat generating electronic device of said one or more electronic devices away from the substrate to a heat sink and having a size and shape substantially conforming to a footprint of said heat generating electronic device, said metal insert also having a coefficient of thermal expansion which substantially matches that of said substrate.