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Electronic device having a plug-in unit with a heat sink structure

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0048284 (1998-03-26)
우선권정보 JP-0075227 (1997-03-27)
발명자 / 주소
  • Oyamada Takashi,JPX
출원인 / 주소
  • NEC Corporation, JPX
대리인 / 주소
    McGinn & Gibb, P.C.
인용정보 피인용 횟수 : 37  인용 특허 : 5

초록

A heat sink structure for an electronic device of the type having a chassis and a plug-in unit provides efficient heat dissipation for a heat-generating component on a printed circuit board within the unit. In a preferred embodiment, a first heat pipe is fixedly attached to a heat dissipating plate

대표청구항

[ What is claimed is:] [1.] In an electronic device:a unit having a printed circuit board with a heat generating body;a first heat pipe having a heat-receiving end portion thereof fixedly attached to and thermally coupled to said heat generating body, said first heat pipe having a heat-dissipating e

이 특허에 인용된 특허 (5)

  1. Hilbrink Johan O. (Cincinnati OH), Apparatus for cooling electronic devices.
  2. Porter Warren W. (Escandido CA), Computer component cooling system with local evaporation of refrigerant.
  3. Bhatia Rakesh (Sunnyvale CA) Haley Kevin (San Jose CA), Heat pipe exchanger system for cooling a hinged computing device.
  4. Bhatia Rakesh ; Haley Kevin, Heat pipe exchanger system for cooling a hinged computing device.
  5. Lijoi Bruno (Farmingdale NY) Cirrito Vincent (Massapequa Park NY) Edelstein Fred (Hauppauge NY), Heat-pipe cooled electronic circuit card.

이 특허를 인용한 특허 (37)

  1. Ishimine Junichi,JPX ; Suzuki Masahiro,JPX, Air-cooled electronic apparatus.
  2. Thomsen Peter, Apparatus and method for enabling hot plugging of an integrated circuit.
  3. Bhatia Rakesh ; Padilla Robert D., Apparatus for managing heat in a computer environment or the like.
  4. Amaike, Takeshi; Heo, Seon Meyong; Watanabe, Makoto; Yasaku, Takayuki; Izumi, Shinya; Shikamura, Naoya, Cartridge type server unit and a cabinet to accommodate multiple said server units.
  5. Sakuyama Tomohiro,JPX, Connector and connecting structure using connector.
  6. Kondo, Yoshihiro; Idei, Akio; Tsubaki, Shigeyasu; Matsushima, Hitoshi; Nakajima, Tadakatsu; Toyoda, Hiroyuki; Hayashi, Tomoo; Saito, Tatsuya; Kato, Takeshi; Ogiro, Kenji, Cooling device and electronic apparatus using the same.
  7. Fukuda, Hiroshi; Fujita, Kenji, Cooling structure for disk storage device.
  8. Karr, Ben, Device bay heat exchanger for a portable computing device.
  9. Gasquet, Jean-Claude; Tanghe, Alcina, Device supporting a light-emitting diode for an automobile signalling system, and a method of manufacturing such a device.
  10. Matsushima, Hitoshi; Fukuda, Hiroshi; Yamana, Shunsuke, Disk array apparatus and liquid cooling apparatus thereof.
  11. Reisfeld, Gideon, Efficient heat pumping from mobile platforms using on platform assembled heat pipe.
  12. Fields, Chris R.; Keller, Jerry, Electrical component assembly for thermal transfer.
  13. Shirakami, Takashi; Matsumoto, Hideaki, Electronic device.
  14. Wei, Wen-Chen, Flexible heat pipe.
  15. Peng,Xue Wen; Chen,Rui Hua, Heat dissipation device.
  16. Wu, Hsi-Sheng; Chiang, Hsu-Cheng; Hung, Kuo-Shu; Lin, Neng-Tan, Heat dissipation structure of electronic device.
  17. Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  18. Shabany, Younes, Liquid-air hybrid cooling in electronics equipment.
  19. Arciniegas, German; Ceremony, Jeff; Chu, Daniel Y.; Ragsdale, Charles W., Localized temperature control for spatial arrays of reaction media.
  20. Arciniegas, German; Ceremony, Jeff; Chu, Daniel Y.; Ragsdale, Charles W., Localized temperature control for spatial arrays of reaction media.
  21. Ceremony, Jeff; Chu, Daniel Y., Localized temperature control for spatial arrays of reaction media.
  22. Arney, Susanne; Cheng, Jen-Hau; Kolodner, Paul R.; Kota-Venkata, Krishna-Murty; Scofield, William; Salamon, Todd R.; Simon, Maria E., Mechanically-reattachable liquid-cooled cooling apparatus.
  23. French,F. William; Merrill,Leonard A., Method and apparatus for dispersing heat from high-power electronic devices.
  24. Tracewell,Matthew S.; Chen,Gary G., Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology.
  25. Winkler, David A.; Bowers, Morris B.; Sehmbey, Maninder S., Mobile computing device dock station with headset jack heat pipe interface.
  26. Memory, Stephen B.; Ganaway, Fredrick E.; Rogers, C. James; DeVuono, Anthony C.; Phillips, Alfred; Zuo, Zhijun, Modular cooling system and thermal bus for high power electronics cabinets.
  27. Facusse, Mario E.; Kosch, David Scott, Passive cooling enclosure system and method for electronics devices.
  28. Facusse, Mario; Kosch, David Scott, Passive cooling enclosure system and method for electronics devices.
  29. Facusse, Mario, Passive cooling system and method for electronics devices.
  30. Chiba,Osamu; Moriwaki,Shohei, Peripheral device and electronic device.
  31. Huang,Yi Chang; Lin,Yao Chung, Portable electronic device and heat-dissipation method and battery charger thereof.
  32. Knudsen, Corey; McDaniel, Kent T.; Smith, Bradley J.; Pautsch, Gregory W.; Lakin, Eric D., Rack mounted electronics having connectors with heat cooling fingers.
  33. Amaike, Takeshi; Heo, Seon Meyong; Watanabe, Makoto; Yasaku, Takayuki; Izumi, Shinya; Shikamura, Naoya, Server unit comprising stacked multiple server unit cabinets accommodating multiple cartridge type server units.
  34. Smith, Russell C.; Coxe, William K.; Hartman, Corey Dean; McAnally, Andrew L., Systems and methods for heat management of an information handling resource in an information handling system.
  35. Hartman, Corey Dean; Smith, Russell C.; Strmiska, Bernard D.; McAnally, Andrew Lafayette, Systems and methods for insertion of an information handling resource in an information handling system.
  36. Hoss Shawn P. ; Moss David L., Thermal connection system for modular computer system components.
  37. Centola, Bruno; Gomez, Claude, Thermal connector for transferring heat between removable printed circuit boards.
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