초록 ▼

A transcutaneous transmission patch transfers power and/or data to an implantable device implanted under a user's skin. The transcutaneous transmission patch is made of a flexible material with a top surface and a bottom surface. Located on or formed within the top surface is a pouch or cavity that

A transcutaneous transmission patch transfers power and/or data to an implantable device implanted under a user's skin. The transcutaneous transmission patch is made of a flexible material with a top surface and a bottom surface. Located on or formed within the top surface is a pouch or cavity that houses electronic circuitry. The electronic circuitry typically includes a substrate on which an integrated circuit (IC) chip and a transmission coil are mounted. Alternatively, the transmission coil may be molded within the flexible material from which the pouch is made. The electronic circuitry is capable of transcutaneously transmitting power and/or data to a receiving coil in the implanted device. The electronic circuitry is powered by a battery or other power source which is also housed within the pouch or cavity or otherwise carried by the patch. The bottom surface of the transcutaneous transmission patch includes an adhesive layer that detachably secures the patch to a skin surface of the user. In one embodiment, the transcutaneous transmission patch is disposable. In another embodiment, select components of the transcutaneous transmission patch may be removed and reused.

대표청구항 ▼

[ What is claimed is:] [1.] A method for transmitting signals through the skin of a user to a receiving coil of an implantable unit, comprising the steps of:(a) providing a flexible transcutaneous transmission patch having a pouch formed therein wherein electronics and a power source for transmittin

[ What is claimed is:] [1.] A method for transmitting signals through the skin of a user to a receiving coil of an implantable unit, comprising the steps of:(a) providing a flexible transcutaneous transmission patch having a pouch formed therein wherein electronics and a power source for transmitting signals to the implantable unit are removably carried, the transcutaneous transmission patch having means for adhesively securing it to a surface of the user's skin; and(b) detachably securing the transcutaneous transmission patch to the user's skin at a position that allows signals to be coupled from the electronics to the implantable unit.