초록 ▼

A method for quality assurance of a laser shock peening process that quantitatively analyzes a single laser shock peened dimple or spot. The method measures a first interior surface of the first dimple to obtain height data and the processes the height data to obtain production volumetric data of th

A method for quality assurance of a laser shock peening process that quantitatively analyzes a single laser shock peened dimple or spot. The method measures a first interior surface of the first dimple to obtain height data and the processes the height data to obtain production volumetric data of the dimple. The volumetric data may then be compared to a predetermined correlation of test volumetric data and high cycle fatigue failure based on high cycle fatigue tests of test pieces that were laser shock peened in the same or similar laser shock peening apparatus as the production workpieces. The test pieces may each have a failure precipitating flaw within a laser shock peened area of the test piece that was laser shock peened in the same or similar laser shock peening apparatus. Preferably, the measuring is performed using a profilometer such as an interferometric optical profilometer.

대표청구항 ▼

[ We claim:] [1.] A method for quality control testing of a laser shock peening process of production workpieces, said method comprising the following steps:(a) mounting a test object having a metallic first test area in a laser shock peening apparatus,(b) forming at least one single first laser sho

[ We claim:] [1.] A method for quality control testing of a laser shock peening process of production workpieces, said method comprising the following steps:(a) mounting a test object having a metallic first test area in a laser shock peening apparatus,(b) forming at least one single first laser shock peened dimple in the first test area by firing a single pulse of a first laser beam from the laser shock peening apparatus such that beneath the first dimple is a first dimple region having deep compressive residual stresses imparted by the single pulse of the first laser beam,(c) measuring a first interior surface of the first dimple to obtain height data, and(d) processing the height data to obtain production volumetric data.