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Composite heat sink/support structure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0145847 (1998-09-02)
발명자 / 주소
  • Bulante Roderick A.
  • Duncan Gary L.
  • Conwell Troy A.
  • Quan Dennis
  • Stafford John P.
  • Lee Sung H.
출원인 / 주소
  • Hughes Electronics Corporation
대리인 / 주소
    Grunebach
인용정보 피인용 횟수 : 62  인용 특허 : 12

초록

A heat sink board structure includes a thermal/structural base having a composite core layer of a mass of graphitized carbon fibers infiltrated with a first resin material matrix. The graphitized carbon fibers of the composite core are substantially unidirectional and oriented parallel to the face o

대표청구항

[ What is claimed is:] [1.] A heat sink board structure, comprising a thermal/structural base including:a composite core layer comprising a mass of substantially unidirectionally oriented first carbon fibers infiltrated with a first resin material matrix, the composite core layer having a first face

이 특허에 인용된 특허 (12)

  1. Martin Jacob (Wellesley MA), Combination conductive and convective heatsink.
  2. Grapes Thomas F. (Columbia MD) Fertig Timothy M. (Pasadena MD) Schroeder Mark S. (Severna Park MD), Composite heat transfer means.
  3. Bonafino Edward J. (Endwell NY) Carpenter Richard W. (Johnson City NY) Lueck Peter J. (Leonberg NY DEX) Summa William J. (Endwell NY) Wang David W. (Vestal NY), Electronic circuit packages with tear resistant organic cores.
  4. Voorhes David W. (Winchester MA) Goldman Richard D. (Stoughton MA) Lopez Robert R. (Boxford MA), Heat sink.
  5. Montesano Mark J. (Fairfax VA), Heat transfer device and method.
  6. Kibler John J. (Lansdale PA) Cassin Thomas G. (Prospectville PA), High conductivity hydrid material for thermal management.
  7. Leibowitz Joseph D. (Culver City CA), High-frequency multilayer printed circuit board.
  8. Unger Scott M. ; Riddle Guy T., Integrated circuit heat transfer element and method.
  9. LeVasseur Robert D. (Binghamton NY) McKeown Stephen A. (Endicott NY), Low thermal expansion, heat sinking substrate for electronic surface mount applications.
  10. Zweben Carl H. (Devon PA) Mogle Rodman A. (Clinton NY) Rodini ; Jr. Benjamin T. (Wayne PA) Thaw Charles L. (Phoenixville PA), Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite.
  11. Leibowitz Joseph D. (Culver City CA), Method of fabricating multilayer printed circuit board structure.
  12. Buchanan Alan M. (Midvale UT) Abramowitz Jay S. (Salt Lake City UT) Flygare Roberta A. Y. (Salt Lake City UT), Printed wiring board substrate for surface mounted components.

이 특허를 인용한 특허 (62)

  1. Steenwyk, Meredith Marie; Coxon, Danny Weldon; Streyle, John Jay; Vander Ploeg, Benjamin Jon, Avionics chassis.
  2. Streyle, John Jay; Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon, Avionics chassis.
  3. Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon; Horton, Paul James; Streyle, John Jay, Avionics chassis.
  4. Matonis Richard A. ; Smith David M. ; Arena John J., Avionics rack with external electronics module.
  5. Smith, Kevan; Marosfalvy, Hans; Hutchison, Randall D.; Schiffbauer, Robert; Taubert, Tomasz, Cable interface for electronic equipment enclosure.
  6. Yoshimura, Hideaki; Fukuzono, Kenji; Iida, Kenji; Abe, Tomoyuki; Maehara, Yasutomo; Nakagawa, Takashi; Hirano, Shin; Kanda, Takashi, Circuit board.
  7. Fowler, Michael L., Circuit board chassis and method including sidewall aperture and backplane insertion slots for side assembled backplane.
  8. Azar, Kaveh, Circuit board cooling system.
  9. Bhakta, Jayesh R.; Yu, Enchao; Chen, Chi She; Flaig, Richard E., Circuit with flexible portion.
  10. Bhakta, Jayesh R.; Yu, Enchao; Chen, Chi She; Flaig, Richard E., Circuit with flexible portion.
  11. Randall D. Hutchison ; Robert Shiffbauer ; Kevan Smith, Concentrical slot telecommunications equipment enclosure.
  12. Kusuda, Charles E.; Glasnovich, Jeffrey W.; Godo, Erik L.; Nye, Roy D.; Kim, Namsoo P., Conduction cooled module.
  13. Porreca, Paul J.; Maille, Todd P.; Palis, Michael R., Conduction-cooled apparatus and methods of forming said apparatus.
  14. Brown, Karl; Arellano, Nora; Sherstinsky, Semyon; Lau, Allen; Tsai, Cheng-Hsiung; Mehta, Vineet; Sansoni, Steve; Wang, Wei W., Detachable electrostatic chuck.
  15. Brown,Karl; Sherstinsky,Semyon; Wang,Wei W.; Tsai,Cheng Hsiung; Mehta,Vineet; Lau,Allen; Sansoni,Steve, Detachable electrostatic chuck for supporting a substrate in a process chamber.
  16. Parkhe, Vijay D.; Tsai, Cheng Tsiung; Sansoni, Steven V., Detachable electrostatic chuck having sealing assembly.
  17. Yurko,Joseph M., Device for increased thermal conductivity between a printed wiring assembly and a chassis.
  18. Stutzman, Randall J.; Dando, III, Charles H.; Long, Clint, Efficient heat transfer from conduction-cooled circuit cards.
  19. Kato, Shogo, Electronic apparatus.
  20. Hutchison, Randall D.; Schiffbauer, Robert, Electronic equipment enclosure.
  21. Bhakta, Jayesh R.; Yu, Enchao; Chen, Chi She; Flaig, Richard E., Electronic module with flexible portion.
  22. You Wang ; Shamouil Shamouilian ; Arnold Kholodenko ; Alexander M. Veytser ; Surinder S. Bedi ; Kadthala R. Narendrnath ; Semyon L. Kats ; Dennis S. Grimard ; Wing L. Cheng ; Ananda H. Kumar, Electrostatic chuck bonded to base with a bond layer and method.
  23. Matyushkin, Alexander; Koosau, Dennis; Panagopoulos, Theodoros; Holland, John, Electrostatic chuck having a plurality of heater coils.
  24. Kholodenko Arnold ; Shamouilian Shamouil ; Wang You ; Cheng Wing L. ; Veytser Alexander M. ; Bedi Surinder S. ; Narendrnath Kadthala R. ; Kats Semyon L. ; Grimard Dennis S. ; Kumar Ananda H., Electrostatic chuck having gas cavity and method.
  25. Wang, You; Shamouilian, Shamouil; Kholodenko, Arnold; Veytser, Alexander M.; Bedi, Surinder S.; Narendrnath, Kadthala R.; Kats, Semyon L.; Grimard, Dennis S.; Cheng, Wing L.; Kumar, Ananda H., Electrostatic chuck having heater and method.
  26. Shamouil Shamouilian ; You Wang ; Surinder S. Bedi ; Arnold Kholodenko ; Alexander M. Veytser ; Kadthala R. Narendrnath ; Semyon L. Kats ; Dennis S. Grimard ; Wing L. Cheng ; Ananda H. Kumar, Electrostatic chuck having improved electrical connector and method.
  27. Hutchison Randy ; Shiffbauer Robert, Enclosure for telecommunications equipment.
  28. Ellsworth, Jr., Michael J.; Marotta, Egidio; Singh, Prabjit, Finned heat sink.
  29. Cho,In Soo; Kim,Sok San, Heat dissipating sheet and plasma display device including the same.
  30. Yu, Enchao; An, Zhiyong, Heat dissipation for electronic modules.
  31. Yu, Enchao; An, Zhiyong, Heat dissipation for electronic modules.
  32. Leon,Eduardo; Harwood,Walter; Bond,William; Hernandez,Frank; Vaidya,Avinash K., Heat pipe cooled electronics enclosure.
  33. Yu, Enchao, Heat spreader for electronic modules.
  34. Yu, Enchao, Heat spreader for memory modules.
  35. Reist, Daniel T.; Garner, Scott D.; Weyant, Jens E.; Ames, E. Michael, Heat transferring clamp.
  36. Pauley,Robert S.; Bhakta,Jayesh R.; Gervasi,William M.; Chen,Chi She; Delvalle,Jose, High density memory module using stacked printed circuit boards.
  37. Pauley, Robert S.; Bhakta, Jayesh R.; Gervasi, William M.; Chen, Chi She; Delvalle, Jose, High density module having at least two substrates and at least one thermally conductive layer therebetween.
  38. Webb, Brent J., High thermal conductivity heat transfer pad.
  39. Laetsch, Erich K., Local loop telecommunication repeater housing having mounting slots enabling replaceable repeater and voltage protector assemblies.
  40. Laetsch, Erich K., Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction.
  41. Yu, Enchao, Memory module having thermal conduits.
  42. Ellsworth, Jr.,Michael J.; Marotta,Egidio; Singh,Prabjit, Method of manufacturing a finned heat sink.
  43. Barcley, Tina P., Method of transporting heat from a heat dissipating electrical assemblage.
  44. Smith, Kevan; Marosfalvy, Hans; Hutchison, Randall D.; Schiffbauer, Robert, Modular electronic equipment enclosure comprising sealed cable interface module.
  45. Pauley, Robert S.; Bhakta, Jayesh R.; Gervasi, William M.; Chen, Chi She; Delvalle, Jose, Module having at least two surfaces and at least one thermally conductive layer therebetween.
  46. Pauley, Robert S.; Bhakta, Jayesh R.; Gervasi, William M.; Chen, Chi She; Delvalle, Jose, Module having at least two surfaces and at least one thermally conductive layer therebetween.
  47. Murata, Daisuke; Yoshida, Hiroshi; Ishibashi, Hidetoshi, Power module.
  48. Pohl Jens,DEX ; Muff Simon,DEX ; Schneider Michael,DEX, Semiconductor component assembly.
  49. Hoffman Scott, Single mount and cooling for two two-sided printed circuit boards.
  50. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate processing with rapid temperature gradient control.
  51. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate support assembly.
  52. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate support assembly having rapid temperature control.
  53. Matyushkin, Alexander; Koosau, Dennis; Panagopoulos, Theodoros; Holland, John, Substrate support with electrostatic chuck having dual temperature zones.
  54. Ootomo, Hisashi; Ezoe, Tomonori, Substrate unit and electronic device.
  55. Sundstrom, Lance L., Systems and methods for printed board assembly isolated heat exchange.
  56. Hutchison, Randall D.; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.
  57. Lin, Wanlai; Hutchison, Randall D.; Smith, Kevan; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.
  58. Randall D. Hutchinson ; Tomasz Taubert, Telecommunications enclosure with individual, separated card holders.
  59. Balzano Alfiero, Thermal management system.
  60. Fowler, Michael Lee; Brindle, Andrew Jonathan, Thermal transfer component, apparatus and method including thermally conductive frame penetrated by thermally conductive plug.
  61. Barcley, Tina P., Thermal transport element for use with a heat dissipating electrical assemblage.
  62. Vos David L. ; Hughto-Delzer Francis W., Thermally conductive vibration isolators.
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