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A method of fabricating a thermoelectric module in which a plurality of thermoelectric chips are arranged in a matrix between first and second dielectric substrates and electrically connected in series so as to heat one of the substrates and cool the other substrate. Elongated thermoelectric bars of

A method of fabricating a thermoelectric module in which a plurality of thermoelectric chips are arranged in a matrix between first and second dielectric substrates and electrically connected in series so as to heat one of the substrates and cool the other substrate. Elongated thermoelectric bars of P-type and N-type to be cut into the chips are employed together with a first conductive plate having a plurality of first contacts arranged in a matrix pattern. Adjacent first contacts spaced along the row are interconnected by horizontal bridges. The method of the present invention comprises the steps of integrating the first conductive plate to the first substrate to support the first conductive plate thereby; placing a plurality of the bars of the P-type and N-type on the first contacts along the rows in such a manner that the P-type bars alternate with the N-type bars in a spaced relation along the column; bonding each bar on its one face to the first contacts; cutting each bar into the chips and cutting the horizontal bridges simultaneously to allocate the chips on the individual first contacts; placing a plurality of second contacts of a second substrate onto the chips to form a series electric circuit of the chips in combination with the first contacts, and bonding the second substrate supporting the second contacts to the first substrate.

대표청구항 ▼

[ We claim:] [1.] A method of fabricating a thermoelectric module, said module composed of a plurality of thermoelectric chips arranged in a matrix between first and second dielectric substrates and electrically connected in series to each other so as to heat the side of the first substrate and cool

[ We claim:] [1.] A method of fabricating a thermoelectric module, said module composed of a plurality of thermoelectric chips arranged in a matrix between first and second dielectric substrates and electrically connected in series to each other so as to heat the side of the first substrate and cool the side of the second substrate due to the Peltier effect obtained in the thermoelectric chips, said method using a plurality of elongated thermoelectric bar of P-type and N-type to be separated into said thermoelectric chips and a first conductive plate carrying a plurality of first contacts arranged in a matrix, the adjacent ones of said first contacts arranged in a row of the matrix are interconnected respectively by horizontal bridges, while said first contacts are spaced along a column of the matrix;said method comprising the steps of:integrating said first conductive plate to said first substrate to support the first conductive plate by said first substrate;placing a plurality of said elongated thermoelectric bars of P-type and N-type on said first contacts along said rows in such a manner that P-type bars alternate the N-type bars in a spaced relation along said column of the matrix;bonding each elongated thermoelectric bar on its one face to said first contacts arranged in the row;cutting each elongated thermoelectric bar into said thermoelectric chips as well as cutting said horizontal bridges simultaneously to allocate the resulting thermoelectric chips on the individual first contacts;placing a plurality of second contacts on said chips opposite of the first contacts to form a series electric circuit of said chips in combination with said first contacts, and bonding the second substrate supporting said second contacts to said first substrate for connection therebetween.