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Laminate film-foam flooring composition 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-003/26
  • B32B-003/02
출원번호 US-0798632 (1997-02-11)
발명자 / 주소
  • Foster Stephen M.
출원인 / 주소
  • Tenneco Protective Packaging, Inc.
대리인 / 주소
    Arnold White & Durkee
인용정보 피인용 횟수 : 37  인용 특허 : 13

초록

A laminate composition of a thin film of low density polyethylene adhered to a sheet of low density polyethylene foam by means of a very thin layer of low density polyethylene. The polyethylene foam has a low density which is preferably between about 1.9 pcf and about 2.2 pcf. The bottom polyethylen

대표청구항

[ What is claimed is:] [1.] A laminate film-foam composition for use under laminate wood floors consisting essentially of a laminate of a sheet of polyethylene closed cell foam having a thickness between about 0.03-0.1 inches and a density of about 1-5 pcf and a film of polyethylene having a thickne

이 특허에 인용된 특허 (13)

  1. Beaupre Peter M. (Billerica MA), Fire resistant vapor barrier.
  2. Doyle Dennis J. (6795 Wilson Rd. Lancaster OH 43130) Miller Robert S. (4208 Greensview Dr. Columbus OH 43220), Floor structure incorporating a vapor and gas barrier.
  3. Abendroth Carl W. (Crystal Falls MI) Stephenson Gary (Crystal Falls MI), Flooring system.
  4. Middleton Breck (611 South Tuxedo Ave. Stockton CA 95204), Foldable sponge mat for surgical applications.
  5. Boyd Dana M. (Rushville NY) Colombo Edward A. (Fairport NY) Lashway William H. (Pittsfield MA), High performance three layer polyolefin film.
  6. Avellanet Frank J. (Westport CT), Infiltration and energy barrier.
  7. Pearson Ben (Coppell TX), Insulation and heat reflective barrier.
  8. Koonts ; Lamonte R., Insulation board.
  9. Groft Cory L. (650 Rife Rd. East Berlin PA 17316) Dauber Thomas W. (R.D. 2 ; Box 2387 Spring Grove PA 17362), Low emissivity insulation.
  10. Olsen Jan-Erik (Malmo SEX), Method for T or butt sealing of laminated all-plastic material.
  11. Heckel Klaus (Weinheim DEX) Klaffke Friedemann (Gorxheimertal-Unter-Flockenbach DEX) Umann Walter (Weinheim DEX) Schwarz Volker (Hirschberg DEX), Pipe insulating jacket.
  12. O'Connor ; Terence J., Scrim/foil laminate.
  13. Kawaguchi Shiro (Osaka JPX) Kai Katsunori (Osaka JPX), Soundproofing woody flooring.

이 특허를 인용한 특허 (37)

  1. Ramesh, Natarajan S.; Malwitz, Nelson, Composite materials containing a metallic layer and methods for producing same.
  2. Yang, Alain; Damiani, Mike W.; Scullion, Jerry J., Continuous process for duct liner production with air laid process and on-line coating.
  3. Vershum,Raymond G., Floor covering.
  4. Cappelle, Mark, Floor covering, floor element and method for manufacturing floor elements.
  5. Cappelle, Mark, Floor covering, floor element and method for manufacturing floor elements.
  6. Cappelle, Mark, Floor covering, floor element and method for manufacturing floor elements.
  7. Cappelle, Mark, Floor covering, floor element and method for manufacturing floor elements.
  8. Cappelle, Mark, Floor covering, floor element and method for manufacturing floor elements.
  9. Cappelle, Mark, Floor covering, floor element and method for manufacturing floor elements.
  10. Meersseman, Laurent; Segaert, Martin; Thiers, Bernard; Clement, Benjamin; Maesen, Christophe, Floor panel.
  11. Meersseman, Laurent; Segaert, Martin; Thiers, Bernard; Clement, Benjamin; Maesen, Christophe, Floor panel.
  12. Meersseman, Laurent; Segaert, Martin; Thiers, Bernard; Clement, Benjamin; Maesen, Christophe, Floor panel.
  13. Meersseman, Laurent; Segaert, Martin; Thiers, Bernard; Clement, Benjamin; Maesen, Christophe, Floor panel.
  14. Meersseman, Laurent; Segaert, Martin; Thiers, Bernard; Clement, Benjamin; Maesen, Christophe, Floor panel.
  15. Meersseman, Laurent; Vanhastel, Luc, Floor panel.
  16. Meersseman, Laurent; Vanhastel, Luc, Floor panel.
  17. Meersseman, Laurent; Vanhastel, Luc, Floor panel.
  18. Meersseman, Laurent; Vanhastel, Luc, Floor panel.
  19. Meersseman, Laurent; Vanhastel, Luc, Floor panel.
  20. Meersseman, Laurent; Vanhastel, Luc, Floor panel.
  21. Meersseman, Laurent; Vanhastel, Luc, Floor panel.
  22. Meersseman, Laurent; Vanhastel, Luc, Floor panel.
  23. Meersseman, Laurent; Vanhastel, Luc, Floor panel.
  24. Mao, Chen-Chi, Floor tile structure without adhesive coating at the bottom.
  25. Collison, Alan B., Floor underlayment.
  26. Jones, Matt; Rives, David; Ramesh, Natarajan S., Floor underlayment.
  27. Foster, Stephen M., Laminate film-foam flooring composition.
  28. Foster,Stephen M., Laminate film-foam flooring composition.
  29. Chen, Peng; Jiang, Yi; Sutherland, James Scott; Woodfin, Andrew David, Mini-reactor optimized channel sizing.
  30. Cappelle, Mark, Panel, covering and method for installing such panels.
  31. Cappelle, Mark, Panel, covering and method for installing such panels.
  32. Cappelle, Mark, Panel, covering and method for installing such panels.
  33. Ramesh, Natarajan S., Polyolefin foam/film composite and method for making the same.
  34. Benaets,Johan, Subfloor.
  35. Lu, Ziqiang; Chorney, Marc, Wood flooring with reinforced thermoplastic underlayer.
  36. Lu, Ziqiang; Chorney, Marc, Wood flooring with reinforced thermoplastic underlayer.
  37. Lu, Ziqiang; Chorney, Marc, Wood flooring with sealed joints for truck trailers and containers.
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