초록 ▼

The bending of a ball grid array electronic package having a metallic base is reduced minimizing stresses applied to the innermost row of solder balls when the package base is cyclically heated and cooled. Reducing the stresses applied to the solder balls increases the number of thermal cycles befor

The bending of a ball grid array electronic package having a metallic base is reduced minimizing stresses applied to the innermost row of solder balls when the package base is cyclically heated and cooled. Reducing the stresses applied to the solder balls increases the number of thermal cycles before solder ball fracture causes device failure. Among the means disclosed to reduce the bending moment are a bimetallic composite base, an integral stiffener, a centrally disposed cover bonded to an external structure and a package base with a stress accommodating depressed portion.

대표청구항 ▼

[ We claim:] [1.] A ball grid array electronic package, comprising:a base component having a first horizontal portion integral with a second horizontal portion wherein said first horizontal portion includes a plurality of metallized circuit traces extending from a peripheral portion of said base to

[ We claim:] [1.] A ball grid array electronic package, comprising:a base component having a first horizontal portion integral with a second horizontal portion wherein said first horizontal portion includes a plurality of metallized circuit traces extending from a peripheral portion of said base to a central portion thereof, and said second horizontal portion has a coefficient of thermal expansion that is less than the coefficient of thermal expansion of said first horizontal portion;a plurality of solder balls bonded to said metallized circuit traces at a peripheral portion of said base;a semiconductor device electrically interconnected to said metallized circuit traces and bonded to a central portion of said base; anda cover component encapsulating said semiconductor device and a portion of said circuit traces, said cover further bonded to an external structure.