초록 ▼

A notebook computer has a lower housing with a keyboard and an upper housing with a display, a central processing unit (CPU), and a conductive plate. The CPU is attached directly to the conductive plate to achieve maximum heat transfer. The conductive plate is exposed to the air outside the notebook

A notebook computer has a lower housing with a keyboard and an upper housing with a display, a central processing unit (CPU), and a conductive plate. The CPU is attached directly to the conductive plate to achieve maximum heat transfer. The conductive plate is exposed to the air outside the notebook computer through air vents in the upper housing. Other heat generating elements in the upper housing are directly attached to thermally isolated islands within the conductive plate to allow each element to maintain a separate operating temperature while still conducting heat out of the notebook computer to the outside air. Additionally, the conductive plate is used as part of an electromagnetic interference enclosure to reduce unwanted radiation from leaving the notebook.

대표청구항 ▼

[ What is claimed is:] [1.] A notebook computer, comprising:a lower housing comprising a keyboard; andan upper housing having a front side and a back side, said upper housing further comprising;a display attached to said front side;a central processing unit (CPU) comprising a top surface and a botto

[ What is claimed is:] [1.] A notebook computer, comprising:a lower housing comprising a keyboard; andan upper housing having a front side and a back side, said upper housing further comprising;a display attached to said front side;a central processing unit (CPU) comprising a top surface and a bottom surface;a conductive plate attached through a thermal conduit to said top surface of said CPU, said conductive plate including a plurality of thermally isolated sections; anda bus for connecting said keyboard in said lower housing with said display and said CPU in said upper housing;a plurality of heat producing components connected to said bus for communicating with said CPU, said plurality of heat producing components attached individually to said thermally isolated sections of said conductive plate through a thermal conduit.