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Test fixtures for testing of printed circuit boards 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23Q-003/00
출원번호 US-0799707 (1997-02-11)
발명자 / 주소
  • Aksu Allen
대리인 / 주소
    Myers, Dawes & Andras LLP
인용정보 피인용 횟수 : 33  인용 특허 : 6

초록

There is disclosed a fastener useful for the precise positioning of a plurality of plates in a parallel, spaced-apart array. The fastener has a cylindrical standard with distal fixed abutments and carries a plurality of spacers that are axially adjustable on the standard. At least one spacer is axia

대표청구항

[ What is claimed is:] [1.] In a method for the assembly of a fixture for testing of printed circuit boards wherein a plurality of test pins are placed in a vertical to near vertical spaced apart array corresponding to the locations of test points of a circuit board in aligned through apertures of a

이 특허에 인용된 특허 (6)

  1. Locker John C. (8061 Round Moon Cir. Jessup MD 20794), Cam-lock circuit board spacer.
  2. Reznikov Naum (Fremont CA), Locking standoff for circuit boards.
  3. Petri Hector D. (384 Edmunds Rd. Framingham MA 01701), Spacer for circuit boards and circuit board assembly including same.
  4. Till David P. (Sturbridge MA), Stand-off device.
  5. Delpech Guy (Ballainvilliers FRX) Garnier Gilles (Fontenay-le-Fleury FRX), Support for printed circuit boards.
  6. Simon Werner (Weidenstr. 5 D-5883 Kierspe 3 DEX), Variable-length distancing unit.

이 특허를 인용한 특허 (33)

  1. Mueller, Donald; Stambaugh, Deron; Russo, Anthony, Apparatus and methods for interconnecting electrical circuit substrates and components.
  2. Chang,Hsien Te, Circuit board clamping device.
  3. Fetzer, Barry A.; Negley, Mark A., Circuit board clip apparatus and method.
  4. Manabu Mizusaki JP, Deformation-resistant mounting structure of portable device.
  5. Mizusaki, Manabu, Deformation-resistant mounting structure of portable device.
  6. Yang,Bor Ching; Chen,Ping Hui; Huang,Jui Chuan, EMI-resistant circuit board assembly.
  7. Xiao,Feng, Electrical connector assembly.
  8. Dunkel, Christoph; Masina, Remo; Pirker, Raphael, Electronic component.
  9. Lin, Chieh-Hsiang; Peng, Wen-Tang, Fixing device for circuit board.
  10. Eifert, Daniel J., Gripping PWB hex standoff.
  11. Hartke, David J; Dibene, II, Joseph T.; Derian, Edward J.; Broder, James M., Integrated power delivery and cooling system for high power microprocessors.
  12. Yamamoto, Takeyoshi, Junction box.
  13. Coteus, Paul W.; Ferencz, Andrew; Hall, Shawn Anthony; Takken, Todd Edward, Low resistance, low-inductance power connectors.
  14. Coteus, Paul W.; Ferencz, Andrew; Hall, Shawn Anthony; Takken, Todd Edward, Low resistance, low-inductance power connectors.
  15. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  16. Verrigni, Alexander V., Method and structure for fastening a planar board to a chassis.
  17. Jones, Patrick, Method for producing a semiconductor module arrangement.
  18. Yi,George Youzhi, Methods and apparatus for holding circuit boards together.
  19. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
  20. Hsiang-Hsiang Tsai TW; Chao-Kun Chan TW, PC board support adapted to support a PC board above a frame in a computer.
  21. Mukouyama, Takahide, Printed board unit and fixing parts thereof.
  22. Lu, Jiun Nan, Printed circuit board assembly with shock absorbing structure.
  23. Hampo, Richard J.; Pavlovic, Slobodan; Sharaf, Nadir; Rai, Rutunj; Khan, Aftab Ali, Printed circuit board connection assembly.
  24. Hampo, Richard J.; Pavlovic, Slobodan; Sharaf, Nadir; Rai, Rutunj; Khan, Aftab Ali, Printed circuit board connection assembly.
  25. Lawrence J. Brekosky ; Douglas M. Eakin ; William G. Lenker, Printed circuit board connector.
  26. Meyer, Daniel B.; Taylor, Kevin; Vilhauer, Mike A.; Lyford, J. Steve, Printed circuit board mounting facility.
  27. Wade White, Printed circuit board top side mounting standoff.
  28. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
  29. Jones, Patrick; Koch, Christoph; Sielaff, Michael, Semiconductor module arrangement and method for producing a semiconductor module arrangement.
  30. Derian, Edward J.; DiBene, II, Joseph Ted; Hartke, David H., Separable power delivery connector.
  31. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
  32. Pan, Jian-Chun; Zhou, Hai-Qing; Tu, Yi-Xin, Test device for printed circuit board.
  33. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
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