$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Plate fin heat exchanger having fluid control means 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
  • H05K-007/20
출원번호 US-0673802 (1996-06-27)
발명자 / 주소
  • Azar Kaveh
출원인 / 주소
  • Advanced Thermal Solutions, Inc.
대리인 / 주소
    Lieberman & Brandsdorfer, LLC
인용정보 피인용 횟수 : 43  인용 특허 : 16

초록

A heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and

대표청구항

[ What is claimed is:] [10.] A heat exchanger for dissipating heat from a heat generating component, said heat exchanger comprising:a thermally conductive base in thermal communication with said component;a plurality of thermally conductive plate fins affixed to said base, at least one plate fin hav

이 특허에 인용된 특허 (16)

  1. Mansingh Vivek (Santa Clara CA), Air-cooled heat exchanger for electronic circuit modules.
  2. Lindquist Stephen E. (Boylston MA) Bailey Douglas A. (Concord MA), Apparatus for an air impingement heat sink using secondary flow generators.
  3. Hatada Toshio (Tsuchiura JPX) Atarashi Takayuki (Tsuchiura JPX) Daikoku Takahiro (Ushiku NY JPX) Kobayashi Satomi (New York NY) Zushi Shizuo (Hadano JPX) Kobayashi Fumiyuki (Sagamihara JPX) Iwai Susu, Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system.
  4. Terasaki Kazuo (Machida JPX) Takemura Hiroshi (Chofu JPX), Heat exchanger core.
  5. Minakami Ko (Kawasaki JPX) Terashima Toshinori (Yokohama JPX) Maeda Toshio (Yokohama JPX) Sasaki Tomiya (Kawasaki JPX) Hisano Katsumi (Yokohama JPX) Iwasaki Hideo (Kawasaki JPX) Kawano Koichiro (Yoko, Heat sink and the producing method thereof.
  6. Wakabayashi Tetsushi (Kawasaki JPX) Honda Norio (Aizuwakamatsu JPX) Sakuma Osamu (Yokohama JPX), Heat sink for a semiconductor device.
  7. Chrysler Gregory M. (Poughkeepsie NY) Chu Richard Chao-Fan (Poughkeepsie NY) Simmons Robert E. (Poughkeepsie NY), Immersion cooled circuit module with improved fins.
  8. Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Vader David T. (New Paltz NY), Impingment cooled compliant heat sink.
  9. Nelson Richard D. (Austin TX) Herrell Dennis J. (Austin TX), Low pressure high heat transfer fluid heat exchanger.
  10. Jordan William D. (Dallas TX) Hinshaw Howard G. (Dallas TX), Method and apparatus for dissipating thermal energy.
  11. Simons Robert E. (Poughkeepsie NY), Multi-stage heat sink.
  12. Azar Kaveh (Westwood MA) Caron Richard E. (Salem NH), Narrow channel finned heat sinking for cooling high power electronic components.
  13. Kitajo Sakae (Tokyo JPX), Package with heat sink.
  14. Serizawa Hideaki (3-12 ; Ookubo 4-chome Kisarazu-shi ; Chiba-ken JPX) Hayami Masayoshi (Tokyo JPX) Yokozuka Kunimoto (Gunma-ken JPX), Radiation plate and method of producing the same.
  15. Fujisaki Akihiko,JPX ; Ishimine Junichi,JPX ; Suzuki Masumi,JPX ; Miyo Masahiro,JPX ; Kikuchi Shunichi,JPX ; Hirano Minoru,JPX ; Nori Hitoshi,JPX, Semiconductor element cooling apparatus.
  16. Leaycraft Edgar C. (Woodstock NY) Oktay Sevgin (Poughkeepsie NY) Ostergren Carl D. (Montgomery NY), Slotted heat sinks for high powered air cooled modules.

이 특허를 인용한 특허 (43)

  1. Tanner, James, Active cooling fin pack.
  2. Guan, Zhi-Bin, Airflow guiding cover and electronic device having the same.
  3. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
  4. Barsun, Stephan Karl; Barr, Andrew Harvey; Dobbs, Robert William, Cooling device having fins arranged to funnel air.
  5. Gerard MacManus GB; Bruce Fryers GB; Nicholas Foley GB; Michael Tate GB, Cooling devices.
  6. Laurila,Risto; Sikanen,Jukka; Ukkola,Erkki, Cooling element.
  7. Fryers Bruce,GBX ; MacManus Gerard,GBX ; Tate Michael,GBX ; Foley Nicholas,GBX, Cooling equipment.
  8. Thomas, Michael R., Curved plate/fin heater exchanger.
  9. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  10. Pawar, Rahul; Karnbach, Rob S, Electrical switchgear system.
  11. Kaori Yasufuku JP; Taiji Hosaka JP; Masaaki Miyazawa JP, Electronic module.
  12. Tuomola, Juha; Baldwin, Brian; Crawley, Dan, Electronics compartment.
  13. Thomas F. Craft, Jr. ; Charles E. Johnson ; Steven J. Smith ; Dinh G. Lai ; Dianne S. Wolpensinger, Fluid flow management system.
  14. Hsieh, Cheng-Wen; Liao, Wen-Neng, Fluid heat exchange apparatus.
  15. Ellsworth, Jr., Michael J.; Marotta, Egidio; Notohardjono, Budy D.; Schmidt, Roger R.; Singh, Prabjit, Foil heat sink and a method for fabricating same.
  16. Sheng, Jian Qing; Lee, Meng Tzu; Lin, Shu Ho, Heat dissipating device.
  17. Chang, Shih-Wei, Heat dissipation apparatus with coarse surface capable of intensifying heat transfer.
  18. Huang,Yu Nien; Liu,Yu, Heat dissipation device.
  19. Malone,Christopher G.; Simon,Glenn C., Heat exchanger including flow straightening fins.
  20. Okochi Takaki,JPX ; Yamaguchi Hiroo,JPX ; Hayashi Takayuki,JPX ; Kafuku Kazuaki,JPX, Heat generating element cooling unit with louvers.
  21. Chen, Hong-Long; Chou, Chien-Jiu, Heat sink.
  22. Hwang,Ching Bai; Meng,Jin Gong, Heat sink.
  23. Keiichiro Ohta JP, Heat sink.
  24. Suzuki, Masumi, Heat sink and electronic device with heat sink.
  25. Malone, Christopher G.; Abbott, Ryan, Heat sink apparatus with air duct.
  26. Bridges, Jeremy S.; La Rocca, Paul J.; Megarity, William M., Heat sink for distributing a thermal load.
  27. North, Mark T.; Koffs, Steven E., Heat sink with converging device.
  28. Azar Kaveh, Heat sink with flow guide.
  29. Larson, Ralph I., Heatsink assembly and method of manufacturing the same.
  30. Larson,Ralph I., Heatsink assembly and method of manufacturing the same.
  31. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
  32. Li,Nien Lun; Yeh,Yun Yeu; Hsu,To; Chu,Hung Chung; Lee,Cheng Hsing, Method and apparatus for side-type heat dissipation.
  33. Lamb,Fred S., Methods to reduce the sensitivity of endothelially-compromised vascular smooth muscle.
  34. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
  35. Okuaki, Kenichi, Motor drive unit with heat sink dealing with drop of cutting fluid.
  36. Katsui Tadashi,JPX ; Yamamoto Haruhiko,JPX, Outside panel for an electronic device.
  37. Kabadi Ashok N., Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors.
  38. Berukhim, David; Leishman, Andrew; Avanessian, Vahe, Plate-fin heat exchanger with a porous blocker bar.
  39. Hwang, Ching-Bai; Fang, Yi-Chyng; Lin, Yeu-Lih, Radiator with airflow guiding structure.
  40. Karni, Jacob, Solar receiver system.
  41. Ichigaya, Hiroshi, Spacer for cooling devices.
  42. Ghadiri Moghaddam, Davood; LePoudre, Philip Paul; Gerber, Manfred, Systems and methods for managing conditions in enclosed space.
  43. Lamb,Fred S.; Schutte,Brian C.; Yang,Baoli, Use of ClC3 chloride channel blockers to modulate vascular tone.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로