초록 ▼

An improved apparatus and method is provided for handling, moving and storing semiconductor wafer carriers. The apparatus comprises two physically separate load ports, each coupled to a vertical transfer mechanism. Coupled between the two vertical transfer mechanisms is a horizontal transfer mechani

An improved apparatus and method is provided for handling, moving and storing semiconductor wafer carriers. The apparatus comprises two physically separate load ports, each coupled to a vertical transfer mechanism. Coupled between the two vertical transfer mechanisms is a horizontal transfer mechanism which extends above the footprint of the fabrication tool to which wafers are to be supplied. In a preferred embodiment the horizontal transfer mechanism comprises a bi-level conveyor comprised of a series of dual compartment segments. The dual compartment segments are coupled such that they may shift between a neutral and a positive position while maintaining a continuous movement channel between the two vertical transfer mechanisms. In this manner a wafer carrier may be placed within a first compartment of a neutrally positioned segment for movement; to store the wafer carrier the segment is shifted to the positive position. Thus a continuous movement channel comprised of the first or second compartments of a plurality of segments is maintained. The horizontal movement channel of a number of apparati may be interconnected to provide a local interconnection of fabrication tools.

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus for buffering wafer carriers to be loaded to a fabrication tool comprising:a first load port adapted to receive a wafer carrier;a first vertical transfer mechanism disposed to elevate the wafer carrier from the first load port to a height greater than that of

[ What is claimed is:] [1.] An apparatus for buffering wafer carriers to be loaded to a fabrication tool comprising:a first load port adapted to receive a wafer carrier;a first vertical transfer mechanism disposed to elevate the wafer carrier from the first load port to a height greater than that of the fabrication tool;a horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the fabrication tool, and adapted to transfer the wafer carrier from a first side of the fabrication tool to a second side of the fabrication tool;a second vertical transfer mechanism operatively coupled to said horizontal transfer mechanism at a location above the fabrication tool and adapted to lower the wafer carrier from said horizontal transfer mechanism to a position for loading into the fabrication tool; anda second load port disposed to receive the wafer carrier from said second vertical transfer mechanism;wherein said horizontal transfer mechanism defines a path between said first vertical transfer mechanism and said second vertical transfer mechanism.