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Process of making a glass semiconductor package 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C03B-019/00
  • H01L-021/56
  • H01L-023/29
출원번호 US-0692883 (1996-07-31)
발명자 / 주소
  • Farnworth Warren M.
  • Wood Alan G.
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    Ormiston Korfanta & Holland, PLLC
인용정보 피인용 횟수 : 115  인용 특허 : 23

초록 ▼

A process of making hermetically sealed glass semiconductor packages by injecting molding an electronic device within a body of molten thermoplastic glass which is solidified by cooling. The glass has a sealing temperature not over 350.degree. C. and a CTE not over 110.times.10.sup.-7 /.degree.C. an

대표청구항 ▼

[ We claim:] [1.] A process of making a glass semiconductor package for an electronic device, comprising:placing the electronic device in a mold;injecting molten thermoplastic glass consisting essentially of a glass having a sealing temperature not over 350.degree. C. and a coefficient of thermal ex

이 특허에 인용된 특허 (23)

  1. Mahulikar Deepak (Meriden CT) Popplewell James M. (Guilford CT), Aluminum alloy semiconductor packages.
    상세보기
  2. Kajihara Takehiro (Komaki JPX) Maekawa Koichiro (Ichinomiya JPX) Ohashi Toshio (Komaki JPX), Ceramic lid for sealing semiconductor element and method of manufacturing the same.
    상세보기
  3. Sakaguchi Noboru (Nagano JPX) Wakabayashi Shinichi (Nagano JPX) Nishiyama Yoshiro (Nagano JPX) Imai Kunihiko (Nagano JPX) Hirabayashi Yoshikazu (Nagano JPX), Ceramic package for semiconductor device.
    상세보기
  4. Eberlein Delvin D. (Altoona WI), Chip carrier.
    상세보기
  5. Francis Gaylord L. (Painted Post NY), Fusion sealing materials.
    상세보기
  6. Muller Gerd (Mainz-Weisenau DEX), Glass composition for passivating semiconductor surfaces.
    상세보기
  7. Lewis Cyril John (Runcorn EN) Carter Neil (Runcorn EN) Ray Neil Hunter (Runcorn EN), Glass injection moulding process.
    상세보기
  8. Holleran Louis M. (Big Flats NY) MacDowell John F. (Painted Post NY) Martin Francis W. (Painted Post NY), Glass-ceramics for electronic packaging.
    상세보기
  9. Nambu Seigo (Tokyo JPX) Takei Shinji (Tokyo JPX) Okuaki Hiroshi (Tokyo JPX), Heat-resistant plastic semiconductor device.
    상세보기
  10. Tower Steven A. (13 Onyx Dr. North Dartmouth MA 02747) Greenspan Jay S. (7 Hillside St. South Dartmouth MA 02748), Hermetic glass chip carrier.
    상세보기
  11. Harandi Mohsen N. (Lawrenceville NJ), Integrated process for converting methanol to gasoline and distillates.
    상세보기
  12. Yasunaga Masatoshi (Itami JPX) Kohara Masanobu (Itami JPX), Lead frame and semiconductor device.
    상세보기
  13. Steffen Francis (Aix-Les-Bains FRX) Labelle Jean (Aix-Les-Bains FRX), Method for the encapsulation of integrated circuits.
    상세보기
  14. Olszewski Anthony R. (Bath NY) Tick Paul A. (Corning NY) Sanford ; deceased Leon M. (late of Campbell NY by Michele R. Sanford ; administratrix), Moldable fluoroaluminophosphate glasses.
    상세보기
  15. Tick Paul A. (Corning NY) Sanford ; deceased Leon M. (late of Campbell NY by Michele R. Sanford ; administratrix), Moldable glass compositions.
    상세보기
  16. Sanford Leon M. (Painted Post NY) Tick Paul A. (Corning NY), Moldable glasses.
    상세보기
  17. Baird John (Scottsdale AZ), Molding process for encapsulating semiconductor devices using a thixotropic compound.
    상세보기
  18. Meddles Dennis (Torrance CA), Molding process for semiconductor devices and lead frame structure therefor.
    상세보기
  19. Needham Donald G. (Bartlesville OK), Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation.
    상세보기
  20. Butt Sheldon H. (Godfrey IL), Reinforced glass composites.
    상세보기
  21. Smith ; III Edward F. (Madison CT) Hoffman Lewis C. (Singer Island FL), Sealing glass composite.
    상세보기
  22. Finkelstein Leo (San Francisco CA) Dumesnil Maurice E. (Los Altos Hills CA) Tetschlag Richard R. (San Jose CA), Sealing glass compositions.
    상세보기
  23. Cornelius Lauren K. (Painted Post NY) Francis Gaylord L. (Painted Post NY) Tick Paul A. (Corning NY), Sealing materials and glasses.
    상세보기

이 특허를 인용한 특허 (115)

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  4. Cruz, Victor Hugo; Courtney, David Francis, Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages.
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  5. Roberts, John K.; Reese, Spencer D., High power radiation emitter device and heat dissipating package for electronic components.
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  7. Roberts,John K.; Reese,Spencer D., High power radiation emitter device and heat dissipating package for electronic components.
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  10. Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.
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  58. Seng,Erin Tan Swee; Chung,Edmund Low Kwok, Microelectronic component assemblies with recessed wire bonds and methods of making same.
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  59. Tan, Eric Swee Seng; Low, Edmund Kwok Chung, Microelectronic component assemblies with recessed wire bonds and methods of making same.
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