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Method and apparatus for forming a thin polymer layer on an integrated circuit structure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
출원번호 US-0583888 (1996-01-08)
발명자 / 주소
  • Sivaramakrishnam Visweswaren
  • Nguyen Bang C.
  • Rao Gayathri
  • Robles Stuardo
  • Fong Gary L.
  • Lim Vicente
  • Lee Peter W.
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Thomason, Moser & Patterson
인용정보 피인용 횟수 : 68  인용 특허 : 24

초록

A method and apparatus are disclosed for forming thin polymer layers on semiconductor substrates. In one embodiment, the method and apparatus include the sublimation of stable dimer parylene material, the pyrolytic conversion of such gaseous dimer material into reactive monomers, and for the optiona

대표청구항

[ What is claimed is:] [1.] An apparatus for forming a thin polymer layer on the surface of an object, comprising:a vaporization chamber adapted to vaporize a polymerizable material into a carrier gas stream; anda deposition chamber in fluid communication with the vaporization chamber and adapted to

이 특허에 인용된 특허 (24)

  1. Yamazaki Shunpei (Tokyo JPX) Imatou Shinji (Atsugi JPX) Ishida Noriya (Atsugi JPX) Sasaki Mari (Atsugi JPX) Sakama Mitsunori (Hiratsuka JPX) Fukada Takeshi (Ebina JPX) Hirose Naoki (Atsugi JPX) Tsuch, Apparatus and method for forming thin films.
  2. Nichols Michael F. (Columbia MO) Hahn Allen W. (Columbia MO), Apparatus for applying a composite insulative coating to a substrate.
  3. Olson Roger A. (Amery WI) Kopitzke ; III Frederick W. (Indianapolis IN) O\Connor Joseph P. (Carmel IN), Continuous vapor deposition apparatus.
  4. Jahn Randy K. (Los Alamos NM) Liepins Raimond (Los Alamos NM), Di-p-xylylene polymer and method for making the same.
  5. Beach William F. (Bridgewater NJ) Olson Roger A. (Amery WI) Wary John (Noblesville IN), Method and apparatus for the deposition of parylene AF4 onto semiconductor wafers.
  6. Buchta Rudolf (sterskr SEX) Hssler Yngve (Linding SEX), Method and arrangement for treating silicon plates.
  7. Sarkozy, Robert F., Method for providing substantially waste-free chemical vapor deposition of thin-film on semiconductor substrates.
  8. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multi-chamber integrated process system.
  9. Lin Tyau-Jeen (Apt. E-14 ; 3131 Meetinghouse Rd. Boothwyn PA 19061) Antonelli Joseph A. (860 Homewood Dr. Riverton NJ 08077) Yang Duck J. (112 Bellant Cir. Wilmington DE 19807) Yasuda Hirotsugu (1004, Organic vapor deposition process for corrosion protection of metal substrates.
  10. Geller Anthony S. (7723 Storrie Pl. NE. Albuquerque NM 87109) Rader Daniel J. (7217 Ottawa Rd. NE. Albuquerque NM 87109), Particle-free microchip processing.
  11. Olson Roger A. ; Beach William F. ; Wary John, Parylene deposition apparatus including a heated and cooled dimer crucible.
  12. Wary John (Noblesville IN) Olson Roger A. (Amery WI) Beach William F. (Bridgewater NJ), Parylene deposition apparatus including a heated and cooled support platen and an electrostatic clamping device.
  13. Olsen Roger A. (Amery WI) Wary John (Noblesville IN) Beach William F. (Bridgewater NJ), Parylene deposition apparatus including a post-pyrolysis filtering chamber and a deposition chamber inlet filter.
  14. Crain Kermit (Amery WI) Wary John (Noblesville IN) Olson Roger A. (Amery WI) Beach William F. (Bridgewater NJ), Parylene deposition apparatus including a quartz crystal thickness/rate controller.
  15. Beach William F. (Bridgewater NJ) Wary John (Noblesville IN) Olson Roger A. (Amery WI), Parylene deposition apparatus including a tapered deposition chamber and dual vacuum outlet pumping arrangement.
  16. Wary John (Noblesville IN) Olson Roger A. (Amery WI) Beach William F. (Bridgewater NJ), Parylene deposition apparatus including an atmospheric shroud and inert gas source.
  17. Olson Roger A. (Amery WI) Wary John (Noblesville IN) Beach William F. (Bridgewater NJ), Parylene deposition apparatus including dry vacuum pump system and downstream cold trap.
  18. Stewart Jeffrey (690-D Avenida Sevilla Laguna Hills CA 92653), Parylene deposition chamber.
  19. Loh Ih-Houng (Maynard MA) Hudson David M. (Chelmsford MA), Polymerization reactor.
  20. Dolbier ; Jr. William R. (Gainesville FL) Rong Xiao X. (Gainesville FL), Processes for the preparation of octafluoro-[2,2]paracyclophane.
  21. Schmitz Johannes J. (Sunnyvale CA) Scholz Frederick J. (Fremont CA) Turner Norman L. (Gloucester MA) Chow Raymond L. (Cupertino CA) Uher Frank O. (Los Altos CA) Kang Sien G. (Tracy CA) Selbrede Steve, Purge gas in wafer coating area selection.
  22. Ohmori Toshiaki (Itami JPX) Fukumoto Takaaki (Itami JPX), Semiconductor manufacturing apparatus.
  23. White John M. (Hayward CA), Single substrate vacuum processing apparatus having improved exhaust system.
  24. You Lu (Troy NY) Yang Guang-Rong (Troy NY) Lu Toh-Ming (Loudonville NY) Moore James A. (Wynantskill NY) McDonald John F. P. (Clifton Park NY), Vapor deposition of parylene-F using 1,4-bis (trifluoromethyl) benzene.

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  1. Kristian E. Johnsgard ; Jean-Fran.cedilla.ois Daviet ; James A. Givens ; Stephen E. Savas ; Brad S. Mattson ; Ashur J. Atanos, Apparatus and method for thermal processing of semiconductor substrates.
  2. Sirhan, Motasim; Yan, John, Apparatus and methods for controlled substance delivery from implanted prostheses.
  3. Sirhan,Motasim; Yan,John, Apparatus and methods for variably controlled substance delivery from implanted prostheses.
  4. Tseng Heng-Yi,TWX ; Chen Chang-Ray,TWX ; Juang Maw-Sheng,TWX ; Ho Kuei-Chang,TWX, Apparatus for evacuating a process chamber.
  5. Choi, Dae-Han; Kim, Jisoo; Hudson, Eric; Lee, Sangheon; Chiang, Conan; Sadjadi, S. M. Reza, Apparatus for the deposition of a conformal film on a substrate and methods therefor.
  6. Hideki Gomi JP, Apparatus with high temperature gas releasing means for vapor deposition of parylene polymer without peeling.
  7. Lee, Chung J.; Kumar, Atul, Chemically and electrically stabilized polymer films.
  8. Lee, Chung J.; Kumar, Atul, Composite polymer dielectric film.
  9. Sirhan,Motasim; Yan,John, Delivery of therapeutic capable agents.
  10. Lee Chung J. ; Wang Hui ; Foggiato Giovanni Antonio, Deposition systems and processes for transport polymerization and chemical vapor deposition.
  11. Lee, Chung J., Dielectric thin films from fluorinated precursors.
  12. Lee,Chung J., Dielectric thin films from fluorinated precursors.
  13. Toda, Masayuki; Kusuhara, Masaki; Umeda, Masaru; Fukagawa, Mitsuru, Evaporation method and film deposition method.
  14. Cleary Thomas J. ; Wing James C., Exclusion of polymer film from semiconductor wafer edge and backside during film (CVD) deposition.
  15. Hashizume, Junichiro; Ueda, Shigenori; Okamura, Ryuji, Exhaust process and film depositing method using the exhaust process.
  16. Hashizume Junichiro,JPX ; Ueda Shigenori,JPX ; Okamura Ryuji,JPX, Exhaust system and vacuum processing apparatus.
  17. Loan James F. ; Salerno Jack P., Film processing system.
  18. Loan, James F.; Salerno, Jack P., Film processing system.
  19. Kawahara Jun,JPX ; Hayashi Yoshihiro,JPX ; Nakano Akinori,JPX ; Shimizu Mikio,JPX ; Nishikawa Tomohisa,JPX, Growth method of a polymer film.
  20. Rigali Louis A. ; Hoffman David E. ; Wang Keda, High Throughput plasma treatment system.
  21. Rigali, Louis A.; Hoffman, David E.; Wang, Keda; Smith, III, William F., High throughput plasma treatment system.
  22. Rigali,Louis A.; Hoffman,David E.; Wang,Keda; Smith, III,William F., High throughput plasma treatment system.
  23. Tyler, James Scott, High-speed symmetrical plasma treatment system.
  24. Robert P. Mandal, In-situ generation of p-xylyiene from liquid precursors.
  25. Lee, Chung J., Integration of low ε thin films and Ta into Cu dual damascene.
  26. Sirhan,Motasim; Yan,John, Intravascular delivery of methylprednisolone.
  27. Motasim Sirhan ; John Yan, Intravascular delivery of mycophenolic acid.
  28. Sirhan, Motasim; Yan, John, Intravascular delivery of mycophenolic acid.
  29. Saito, Masayuki, Low-pressure CVD apparatus and method of manufacturing a thin film.
  30. Condrashoff, Robert S.; Fazio, James P.; Hoffman, David E.; Tyler, James S., Material handling system and method for a multi-workpiece plasma treatment system.
  31. Condrashoff, Robert Sergel; Fazio, James Patrick; Hoffman, David Eugene; Tyler, James Scott, Material handling system and methods for a multichamber plasma treatment system.
  32. Takuya Miyakawa JP; Hiroaki Akiyama JP; Shintaro Asuke JP, Method and apparatus for atmospheric pressure plasma surface treatment, method of manufacturing semiconductor device, and method of manufacturing ink jet printing head.
  33. Robles, Stuardo A.; Sivaramakrishnan, Visweswaren; Nguyen, Bang C.; Rao, Gayathri; Fong, Gary; Lam, Vicente; Lee, Peter Wai-Man; Chang, Mei, Method and apparatus for forming a thin polymer layer on an integrated circuit structure.
  34. Xu Chongying ; Baum Thomas H. ; Carl Ralph J. ; Sturm Edward A., Method and apparatus for forming low dielectric constant polymeric films.
  35. Xu Chongying ; Baum Thomas H. ; Carl Ralph J. ; Sturm Edward A., Method and apparatus for forming low dielectric constant polymeric films.
  36. Loan James F. ; Salerno Jack P., Method for chemical vapor deposition of a material on a substrate.
  37. Miller, Gayle W.; Shelton, Gail D., Method for composing a dielectric layer within an interconnect structure of a multilayer semiconductor device.
  38. Miller, Gayle W.; Shelton, Gail D., Method for composing a dielectric layer within an interconnect structure of a multilayer semiconductor device.
  39. Chappa, Ralph A., Method for depositing a polymeric coating on a substrate.
  40. Gersdorff, Markus, Method for depositing a thin-film polymer in a low-pressure gas phase.
  41. Nogami, Hiroshi, Method of cleaning a CVD device.
  42. Timperio, Onofio L.; Luca, Stephen J., Method of reducing residue deposition onto ash chamber base surfaces.
  43. Kwak, Byung-sung; Singh, Kaushal K.; Bangert, Stefan; Krishna, Nety M., Methods for plasma activation of evaporated precursors in a process chamber.
  44. Chan,Bor Wen; Wang,Yu I; Tao,Han Jan, Microelectronic device having disposable spacer.
  45. Vu Lan ; Swartz Dennis C. ; Watts Jeff, Modified material deposition sequence for reduced detect densities in semiconductor manufacturing.
  46. Kim,Kwang Sik, Multi-sectored flat board type showerhead used in CVD apparatus.
  47. Mandal Robert P. ; Cheung David ; Lee Peter Wai-Man ; Lang Chi-I, Nano-porous copolymer films having low dielectric constants.
  48. Huang, Guo-Shing; Lin, Tung-Ying; Chang, Chun-Hao; Wang, Herrison; Wabg, Teng-Yen, Plasma assisted apparatus for organic film deposition.
  49. Lang, Chi-I; Jeng, Shin-Puu; Ma, Yeming Jim; Chang, Fong; Lee, Peter Wai-Man; Cheung, David W., Plasma enhanced chemical vapor deposition of copolymer of parylene N and comonomers with various double bonds.
  50. Honda, Masanobu; Matsui, Yutaka; Sato, Manabu, Plasma processing apparatus, plasma processing method, and storage medium.
  51. Honda, Masanobu; Matsui, Yutaka; Sato, Manabu, Plasma processing method.
  52. Lee,Chung J.; Kumar,Atul, Porous low E (<2.0) thin films by transport co-polymerization.
  53. Lee,Chung J.; Kumar,Atul, Porous low k(<2.0) thin film derived from homo-transport-polymerization.
  54. Mori, Shigeru; Ono, Yoshinori, Printed circuit board and manufacturing process thereof.
  55. Gaillard, Frederic; Xia, Li-Qun; Shu, Jen; Yieh, Ellie; Lim, Tian-Hoe, Process for forming a low dielectric constant carbon-containing film.
  56. Kenneth A. Peterson ; William R. Conley, Protection of microelectronic devices during packaging.
  57. Fu, Xinyu; Forster, John; Yu, Jick; Bhatnagar, Ajay; Gopalraja, Praburam, Remote plasma pre-clean with low hydrogen pressure.
  58. Gomi Hideki,JPX, Residue removal process for forming inter-level insulating layer of paraylene polymer without peeling.
  59. Ueno, Kazuyoshi, Semiconductor device manufacturing apparatus and semiconductor device manufacturing method.
  60. Ueno,Kazuyoshi, Semiconductor device manufacturing apparatus and semiconductor device manufacturing method.
  61. Lee,Chung J.; Kumar,Atul, Single and dual damascene techniques utilizing composite polymer dielectric film.
  62. Lee, Chung J., Stabilized polymer film and its manufacture.
  63. Lee,Chung J.; Kumar,Atul; Chen,Chieh; Pikovsky,Yuri, System for forming composite polymer dielectric film.
  64. Lyons, Christopher S.; Engle, Kent T.; Vanhoose, Steven R.; Spawn, Terence D.; Pieper, Joseph M.; Anderson, Edward J.; Stoss, Walter, Systems and methods for processing vapor.
  65. Toru Igarashi JP, Vacuum operation apparatus.
  66. Lyons Christopher S. ; Ruta Constantin I. ; Fleming Robert J. ; Blette Russell E., Vapor coating apparatus.
  67. Faguet, Jacques; Lee, Eric M., Vapor deposition system.
  68. Toda, Masayuki; Kusuhara, Masaki; Umeda, Masaru; Fukagawa, Mitsuru, Vaporizing apparatus and film forming apparatus provided with vaporizing apparatus.
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