초록 ▼

This invention relates to mounting integrated circuits (IC) to multi-chip modules (MCM) or substrates. More specifically, it provides a method of mounting a semiconductor die such as a thin slice of Mercury Cadmium Telluride (MCT) to a silicon semiconductor substrate, a read-out integrated circuit (

This invention relates to mounting integrated circuits (IC) to multi-chip modules (MCM) or substrates. More specifically, it provides a method of mounting a semiconductor die such as a thin slice of Mercury Cadmium Telluride (MCT) to a silicon semiconductor substrate, a read-out integrated circuit (ROIC), using a thermoplastic to reduce stress on the MCT caused by mismatched Coefficients of Thermal Expansion (CTE). This process provides for an array of infrared photodetectors on a material such as MCT to be mounted to a read-out integrated circuit (ROIC) using the Vertical Integrated Photodiode (VIP) approach to FPAs, while allowing double sided interdiffusion of CdTe for surface passivation to reduce dark currents and improve performance, without the problems associated with mismatched coefficients of thermal expansion during high temperature processes.

대표청구항 ▼

[ What is claimed is:] [1.] A microelectronic structure for fabricating a focal plane array comprising:(a) a readout integrated circuit; and(b) a MCT layer passivated on the top side and directly bonded to said read out integrated circuit with a thin layer of thermoplastic adhesive allowing for an a

[ What is claimed is:] [1.] A microelectronic structure for fabricating a focal plane array comprising:(a) a readout integrated circuit; and(b) a MCT layer passivated on the top side and directly bonded to said read out integrated circuit with a thin layer of thermoplastic adhesive allowing for an array of photodetector devices to be fabricated in the MCT layer and directly connected to the readout integrated circuit with an array of vias formed through the MCT structure to the readout integrated circuit, wherein said thermoplastic adhesive is a material which melts when heated above a softening temperature, wherein said layer of thermoplastic adhesive is from 1-2 microns thick.