$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Thermoelectric semiconductor having a sintered semiconductor layer and fabrication process thereof 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H02L-031/058
출원번호 US-0901791 (1997-07-28)
우선권정보 JP-0197790 (1997-07-26)
발명자 / 주소
  • Tsuno Katsuhiro,JPX
  • Tosho Tsuyoshi,JPX
  • Watanabe Hideo,JPX
출원인 / 주소
  • Technova Inc. and Engineering Advancement Association of Japan, JPX
대리인 / 주소
    Evenson, McKeown, Edwards & Lenahan, P.L.L.C.
인용정보 피인용 횟수 : 33  인용 특허 : 5

초록

A thermoelectric semiconductor is formed of a sintered semiconductor layer nd metal layers arranged on sides of opposite end faces of the sintered semiconductor layer. These metal layers are to inhibit a reaction between the sintered semiconductor layer and older layers through which electrodes are

대표청구항

[ What is claimed is:] [1.] A thermoelectric semiconductor comprising:a sintered semiconductor layer composed of semi-conductor particles,metal layers integrally sintered on opposite end faces of said sintered semiconductor layer, respectively, andelectrodes joined, with an electrode-joining materia

이 특허에 인용된 특허 (5)

  1. Yahatz Michael ; Harper James, Fabrication of thermoelectric modules and solder for such fabrication.
  2. Miller Joel (14340 Trinidad Rd. San Leandro CA 94577), Laminated thermo element.
  3. Bierschenk James L. (4805 Highgate La. Rowlett TX 75088) Howarth Richard A. (915 Spring Brook Allen TX 75002) Socolowski Norbert J. (215 Fox Hill Rd. Denville NJ 07834-2507), Thermoelectric cooler.
  4. Fuschetti Dean F. (69 Winding Way Little Silver NJ 07739), Thermoelectric heat pump.
  5. Gelb Allan S. (2606 Hollow Bend Mesquite TX 75150) Townsend Peter B. (4204 High Mesa Ct. Arlington TX 76015) Purdy Erika (301 Rita Garland TX 75042), Thermoelectric heat pump.

이 특허를 인용한 특허 (33)

  1. Poliquin, Eric; Crane, Douglas T.; Jovovic, Vladimir; Dean, Joseph; Kossakovski, Dmitri; LaGrandeur, John Walter, Cartridge-based thermoelectric systems.
  2. Ghoshal, Uttam; Guha, Ayan, Heat pipes and thermoelectric cooling devices.
  3. LaGrandeur, John; Bell, Lon E., Heater-cooler with bithermal thermoelectric device.
  4. Ranalli, Marco; Adldinger, Martin; Crane, Douglas T., High efficiency thermoelectric generation.
  5. Maekawa Nobuteru,JPX ; Maksimovich Belov Iouri,RUX, Ingot plate made of thermoelectric material, rectangular bar cut from the ingot plate, and process of fabricating the ingot plate.
  6. Stark, Ingo, Low power thermoelectric generator.
  7. Stark, Ingo, Low power thermoelectric generator.
  8. Stark, Ingo; Zhou, Peter, Low power thermoelectric generator.
  9. Ghoshal, Uttam; Guha, Ayan; Borak, James, Method and apparatus for switched thermoelectric cooling of fluids.
  10. Aguirre, Mario; Scullin, Matthew L., Method and structure for thermoelectric unicouple assembly.
  11. Aguirre, Mario; Scullin, Matthew L., Method and structure for thermoelectric unicouple assembly.
  12. Tauchi Hitoshi,JPX ; Tomita Atsushi,JPX ; Ebisumori Kazuo,JPX, Method of producing thermoelectric semiconductor.
  13. Böttner, Harald; Schubert, Axel; Nurnus, Joachim; Künzel, Christa, Methods for producing a thermoelectric layer structure and components with a thermoelectric layer structure.
  14. Lorimer, Adam; Scullin, Matthew L.; Sura, Sravan Kumar R.; Hannemann, Christopher, Modular thermoelectric units for heat recovery systems and methods thereof.
  15. DiGiacomo Giulio, Pb-In-Sn tall C-4 for fatigue enhancement.
  16. Bell, Lon E.; LaGrandeur, John, System and method for climate control within a passenger compartment of a vehicle.
  17. Bell, Lon E.; LaGrandeur, John, System and method for distributed thermoelectric heating and cooling.
  18. LaGrandeur, John; Poliquin, Eric; Kossakovski, Dmitri; Jovovic, Vladimir, Systems and methods for reducing current and increasing voltage in thermoelectric systems.
  19. Kanatzidis, Mercouri G.; Androulakis, John; Sootsman, Joseph R., Thermoelectric compositions and process.
  20. Goenka, Lakhi Nandlal, Thermoelectric device efficiency enhancement using dynamic feedback.
  21. Reifenberg, John; Miller, Lindsay; Scullin, Matthew L.; Lorimer, Adam; Sura, Sravan Kumar R.; Beera, Sasi Bhushan; Crane, Douglas, Thermoelectric devices having reduced thermal stress and contact resistance, and methods of forming and using the same.
  22. Reifenberg, John; Miller, Lindsay; Scullin, Matthew L.; Lorimer, Adam; Sura, Sravan Kumar R.; Beera, Sasi Bhushan; Crane, Douglas, Thermoelectric devices having reduced thermal stress and contact resistance, and methods of forming and using the same.
  23. Bell, Lon E.; Diller, Robert W., Thermoelectric heat pump.
  24. Bell, Lon E.; Diller, Robert W., Thermoelectric heat pump.
  25. Bell, Lon E.; Diller, Robert W., Thermoelectric heat pump.
  26. Heremans, Joseph P.; Jaworski, Christopher M.; Jovovic, Vladimir; Harris, Fred, Thermoelectric materials having porosity.
  27. Robert W. Otey, Thermoelectric module with thin film substrates.
  28. Bell, Lon E.; Crane, Douglas Todd, Thermoelectric power generating systems utilizing segmented thermoelectric elements.
  29. Bell, Lon E.; Crane, Douglas Todd, Thermoelectric power generator for variable thermal power source.
  30. Bell, Lon E.; Crane, Douglas Todd, Thermoelectric power generator for variable thermal power source.
  31. Konishi Akio,JPX ; Fukuda Katsushi,JPX, Thermoelectric semiconductor material and method of manufacturing same.
  32. Akio Konishi JP; Katsushi Fukuda JP, Thermoelectric semiconductor material and method of manufacturing the same.
  33. Bell, Lon E., Thermoelectrics utilizing convective heat flow.

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로