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Heat-radiating structure for CPU 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0054513 (1998-04-03)
발명자 / 주소
  • Yu Shu-Jen,TWX
출원인 / 주소
  • Ideal Electronics Inc., TWX
인용정보 피인용 횟수 : 79  인용 특허 : 4

초록

Disclosed is a heat-radiating structure for CPU mainly including a radiating seat, at least one thermal pipe, a radiating member, and a cooling fan. The radiating seat is connected to a radiating block attached to the CPU, so that heat produced by the CPU can be transmitted to the radiating seat via

대표청구항

[ What is claimed is:] [1.] A heat-radiating structure for quickly and effectively lowering high temperature of a CPU in a computer, comprising a radiating seat, at least one thermal pipe, a radiating member, and a cooling fan, said radiating seat including a central portion and cooling fins arrange

이 특허에 인용된 특허 (4)

  1. Yeh Robin,TWX, Cooling apparatus for a computer central processing unit.
  2. Fox Leslie (Boxboro MA) Wade Paul C. (Shirley MA), Hybird cooling system for electronic components.
  3. Nelson Daryl (Beaverton OR), Multiple-fan microprocessor cooling through a finned heat pipe.
  4. Toedtman Thomas (Lake Forest CA) Welch Randall S. (Lake Forest CA), Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices.

이 특허를 인용한 특허 (79)

  1. DeKeuster, Richard M., Battery module cooling fins and footings.
  2. Connors, Matthew Joseph, Bi-level heat sink.
  3. Shih-Tsung, Chen, CPU cooling using a heat pipe assembly.
  4. Lee, Sang Cheol, Chipset cooling device of video graphic adapter card.
  5. Ru-Ching Wang TW, Compact heat sink module.
  6. Cheng,Stan, Computer chassis frame support.
  7. Scott, Alexander Robin Walter, Computer cooling apparatus.
  8. Scott, Alexander Robin Walter, Computer cooling apparatus.
  9. Scott,Alexander Robin Walter, Computer cooling apparatus.
  10. Lyon, Geoff Sean; Holden, Michael James, Computer cooling system with preferential cooling device selection.
  11. Tracy, Mark S.; Doczy, Paul J.; Lev, Jeffrey A., Computer device cooling system.
  12. Koo,Kyung ha, Computer having a heat discharging unit.
  13. Lopatinsky,Edward; Fedoseyev,Lev; Rosenfeld,Saveliy; Schaefer,Daniel, Cooler with blower between two heatsinks.
  14. Hiroshi Nakamura JP; Chihei Kitahara JP; Kentaro Tomioka JP; Katsuhiko Yamamoto JP, Cooling unit for cooling a heat-generating component in an electronic apparatus.
  15. Nakamura Hiroshi,JPX ; Yamamoto Katsuhiko,JPX, Cooling unit for cooling a heat-generating components and electronic apparatus having the cooling unit.
  16. Lin, Kuo-Len; Tsui, Hui-Min, Dual-layer heat dissipating structure.
  17. Gates William George,GBX, Electronic apparatus.
  18. Chang, Chien-Lung; Cong, Hai-Wei, Heat dissipating apparatus.
  19. Chang, Cheng-Yi, Heat dissipating apparatus extended laterally from heat pipe.
  20. Chang,Hung, Heat dissipating device.
  21. Wang, Yaxiong; Huang, Chung-Yuan; Dong, Shun Chi, Heat dissipating device for electronic component.
  22. Wu, Hung-Yi; Ye, Zhen-Xing; Sun, Ke; Chen, Ming-Ke; Chen, Xiao-Zhu, Heat dissipation assembly.
  23. Chen,Chun Chi; Wu,Yi Qiang, Heat dissipation device.
  24. Lee, Hsieh Kun; Chen, Chun-Chi; Peng, Winsan, Heat dissipation device.
  25. Lee, Kuo-Shao, Heat dissipation device comprised of multiple heat sinks.
  26. Todd, John J.; Longsderff, David R.; Toth, Jerome E., Heat pipe fin stack with extruded base.
  27. Kim,Kyoung Ho, Heat radiating apparatus.
  28. Wei Ta Lo CN, Heat removal system.
  29. Xia,Wan Lin; Li,Tao; Xiao,Min Qi; Zhong,Yong, Heat sink.
  30. Chen,Yun Lung, Heat sink assembly.
  31. Liu Eric,TWX ; Lin Pao Lung,TWX ; Lu Chun-Hsin,TWX, Heat sink assembly.
  32. Ohta Keiichiro,JPX ; Furukawa Yuichi,JPX, Heat sink device for electronic devices.
  33. Kubo,Yoshinari, Heat sink for electronic devices and heat dissipating method.
  34. Wang,David G.; Muller,P. Keith, Heat sink for enhanced heat dissipation.
  35. Malone,Christopher G.; Miyamura,Harold, Heat sink with angled heat pipe.
  36. Malone,Christopher G.; Miyamura,Harold, Heat sink with heat pipe in direct contact with component.
  37. Lofland, Steven J.; Chesser, Jason B., Heat sink with heat pipes and fan.
  38. Gawve, Warren Lee, Heat sink with multiple surface enhancements.
  39. Yu Z. Zack ; Good Arthur A., Heat spreader with excess solder basin.
  40. Ito, Calvin H.; Rowe, Nigel C., Heat transport apparatus.
  41. Lee Sui Yung,TWX ; Hsu Chien-hung,TWX, Heat-radiating structure.
  42. Chrysler Gregory M. ; Chu Richard C., Hybrid cooling system for electronics module.
  43. Xia,Wan Lin; Li,Tao; Zhong,Yong, Hybrid heat dissipation device.
  44. Chiang, Tsai Liang; Wu, Takashi, Integrated heat dissipating device with curved fins.
  45. Bookhardt Gary L. ; McEuen Shawn S., Integrated heat dissipation apparatus.
  46. Chiang, Tsai Liang, Integrated heat dissipation apparatus.
  47. Galbraith, Richard Leo; Stanek, David James, Method and apparatus for enhanced timing loop for a PRML data channel.
  48. Williams, Peter, Method of determining the nucleotide sequence of oligonucleotides and DNA molecules.
  49. Williams, Peter, Method of determining the nucleotide sequence of oligonucleotides and DNA molecules.
  50. Williams, Peter, Method of determining the nucleotide sequence of oligonucleotides and DNA molecules.
  51. Williams, Peter, Method of determining the nucleotide sequence of oligonucleotides and DNA molecules.
  52. Williams, Peter; Taylor, Thomas J.; Williams, Daniel J. B.; Gould, Ian; Hayes, Mark A., Method of determining the nucleotide sequence of oligonucleotides and DNA molecules.
  53. Williams, Peter; Taylor, Thomas J.; Williams, Daniel J. B.; Gould, Ian; Hayes, Mark A., Method of determining the nucleotide sequence of oligonucleotides and DNA molecules.
  54. Williams, Peter; Taylor, Thomas J.; Williams, Daniel J. B.; Gould, Ian; Hayes, Mark A., Method of determining the nucleotide sequence of oligonucleotides and DNA molecules.
  55. Williams, Peter; Williams, Daniel J. B.; Bloom, Linda; Taylor, Thomas J., Method of determining the nucleotide sequence of oligonucleotides and DNA molecules.
  56. Williams, Peter; Williams, Daniel J. B.; Bloom, Linda; Taylor, Thomas J., Method of determining the nucleotide sequence of oligonucleotides and DNA molecules.
  57. Quake, Stephen; Volkmuth, Wayne; Unger, Marc, Methods and apparatus for analyzing polynucleotide sequences.
  58. Quake,Stephen; Braslavsky,Ido; Hebert,Benedict; Kartalov,Emil, Methods and apparatus for analyzing polynucleotide sequences by asynchronous base extension.
  59. Quake,Stephen R., Methods and apparatuses for analyzing polynucleotide sequences.
  60. Buzby,Philip Richard, Methods and compositions for improving fidelity in a nucleic acid synthesis reaction.
  61. Harris, Timothy; Buzby, Philip Richard; Jarosz, Mirna; DiMeo, James Joseph; Gill, Jaime, Methods and devices for nucleic acid sequence determination.
  62. Quake, Stephen, Methods and kits for analyzing polynucleotide sequences.
  63. Liu,David R., Nucleotide analogs.
  64. Ching-Bin Lin TW, Self-recirculated heat dissipating means for cooling central processing unit.
  65. Lapidus, Stanley N.; Buzby, Philip R.; Harris, Timothy D., Short cycle methods for sequencing polynucleotides.
  66. Lapidus, Stanley; Buzby, Philip Richard; Harris, Timothy, Short cycle methods for sequencing polynucleotides.
  67. Lapidus, Stanley; Buzby, Phillip Richard; Harris, Timothy, Short cycle methods for sequencing polynucleotides.
  68. Lapidus,Stanley N; Buzby,Philip Richard; Harris,Timothy, Short cycle methods for sequencing polynucleotides.
  69. Lapidus,Stanley; Buzby,Phillip Richard; Harris,Timothy, Short cycle methods for sequencing polynucleotides.
  70. Lapidus, Stanley, Single molecule sequencing of captured nucleic acids.
  71. Lapidus, Stanley N., Single molecule sequencing of captured nucleic acids.
  72. Buzby,Philip Richard, Stabilizing a nucleic acid for nucleic acid sequencing.
  73. Lee, Sang-cheol, Supporting block of VGA chipset cooling device.
  74. Zeighami,Roy M.; Belady,Christian L.; Edwards,Glen, System and method for cooling electronic assemblies.
  75. Watwe, Abhay; Prasher, Ravi, Thermal cooling apparatus.
  76. Lu Chun-Hsin,TWX, Thermal module.
  77. Shiaw-Jong S. Chen ; Roger J. Hooey, Top mounted cooling device using heat pipes.
  78. Chen, Kuo Jui, Tube-style radiator structure for computer.
  79. Julien Jean-Noel,FRX ; Lachise Jacques,FRX, Two-phase or mono-phase heat exchanger for electronic power component.
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