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A process for making a chip sized semiconductor device, in which a semiconductor chip is prepared so as to have electrodes on one of surfaces thereof and an electrically insulating passivation film formed on the one surface except for areas where the electrodes exist. An insulation sheet is prepared

A process for making a chip sized semiconductor device, in which a semiconductor chip is prepared so as to have electrodes on one of surfaces thereof and an electrically insulating passivation film formed on the one surface except for areas where the electrodes exist. An insulation sheet is prepared so as to have first and second surfaces and a metallic film coated on the first surface. The second surface of the insulation sheet is adhered on the one surface of the semiconductor chip. First via-holes are provided in the metallic film at positions corresponding to the electrodes. Second via-holes are provided in the insulation sheet at positions corresponding to the first via-holes so that the electrodes are exposed. The metallic film is electrically connected to the electrodes of the semiconductor chip through the first and second via-holes. A circuit pattern is formed from the metallic film so that the circuit pattern has external terminal connecting portions. An insulation film is adhered on the insulation sheet so that the external terminal connecting portions are exposed. External connecting terminals are electrically connected to the external terminal connecting portions of the circuit pattern.

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[ We claim:] [1.] A process for making a chip sized semiconductor device, said process comprising:preparing a wafer from which a plurality of semiconductor chips are made, each of said semiconductor chips having electrodes on a surface thereof and an electrically insulating passivation film formed o

[ We claim:] [1.] A process for making a chip sized semiconductor device, said process comprising:preparing a wafer from which a plurality of semiconductor chips are made, each of said semiconductor chips having electrodes on a surface thereof and an electrically insulating passivation film formed on said surface excluding areas where said electrodes exist;preparing an insulation sheet having first and second surfaces and a metallic film coated onto said first surface;adhering said second surface of the insulation sheet on said passivation film;providing first via-holes in said metallic film at positions corresponding to said electrodes;providing second via-holes in said insulation sheet at positions corresponding to said first via-holes so that said electrodes are exposed;electrically plating a metal to connect said metallic film to said electrodes of each semiconductor chip extending through said first and second via-holes;partially removing said metallic film to form a circuit pattern on each semiconductor chip so that said circuit pattern has external terminal connecting portions;coating said insulation sheet to form an insulation layer thereon so that said external terminal connecting portions are exposed;electrically connecting external connecting terminals to said external terminal connecting portions of the circuit pattern; andslicing the wafer into individual pieces to obtain a plurality of semiconductor devices.