초록 ▼

Semiconductor wafers and other electronic parts which similarly require ultra-high purity manufacturing environments are treated with ultra-high purity liquid cleaning and etching agents prepared at the site of use from gaseous raw materials which have been purified to a level compatible with semico

Semiconductor wafers and other electronic parts which similarly require ultra-high purity manufacturing environments are treated with ultra-high purity liquid cleaning and etching agents prepared at the site of use from gaseous raw materials which have been purified to a level compatible with semiconductor manufacturing standards, combined when appropriate with ultra-pure water.

대표청구항 ▼

[ What is claimed is:] [1.] A system for the manufacture of a high-precision electronic component, said system comprising:(a) a production line containing a plurality of workstations successively arranged for treating a workpiece to be formed into said electronic component, one such workstation sele

[ What is claimed is:] [1.] A system for the manufacture of a high-precision electronic component, said system comprising:(a) a production line containing a plurality of workstations successively arranged for treating a workpiece to be formed into said electronic component, one such workstation selected for application of a liquid treatment agent to said workpiece;(b) means for conveying said workpiece to said workstations in succession along said production line; and(c) a subunit adjoining said production line at said selected workstation to supply said liquid treatment agent in ultra-high purity form, said subunit supplied by raw materials including a gaseous raw material selected from the group consisting of ammonia, hydrogen fluoride, hydrogen chloride, hydrogen bromide, phosphine, arsine, diborane and sulfur dioxide, and said subunit comprising:(i) means for purifying said gaseous raw material to a purity compatible with semiconductor manufacturing standards .[.defined as a resistivity of at least about 15 megohm-cm at 25.degree. C., less than about 25 ppb of electrolytes other than said raw material itself, a particulate content of less than about 150/cm.sup.3 and a particle size of less than 0.2 micron, a microorganism content of less than about 10/cm.sup.3, and total organic carbon of less than 100 ppb.].;(ii) means for combining said gaseous raw material so purified with further raw material of a purity compatible with said semiconductor manufacturing standards, under conditions such that said gaseous raw material and said further raw material are converted to said ultra-high purity liquid treatment agent at a rate approximately equal to that at which said liquid treatment agent will be applied to a workpiece; and(iii) means for applying said ultra-high purity liquid treatment agent thus formed directly to a workpiece at said workstation;said production line, said conveying means and said subunit all being contained in an environment maintained free of contamination by said semiconductor manufacturing standards.