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Packaging material web for a self-supporting packaging container wall, and packaging containers made from the web 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65D-005/62
출원번호 US-0820944 (1997-03-19)
우선권정보 SE-0001260 (1996-04-01)
발명자 / 주소
  • Lennartsson Mattias,SEX
출원인 / 주소
  • Tetra Laval Holdings & Finance S.A., CHX
대리인 / 주소
    Burns, Doane, Swecker & Mathis, L.L.P.
인용정보 피인용 횟수 : 24  인용 특허 : 26

초록

A packaging material web for a self-supporting packaging container wall which includes a number of continuous wall panels manufactured from flexible material layers which are interconnected with one another by means of a pattern of seals. Between the seals, there are formed cells which are inflatabl

대표청구항

[ What is claimed is:] [1.] A packaging material web for a self-supporting packaging container wall comprising a plurality of continuous wall panels, each of which includes flexible material layers which are interconnected with one another in a pattern of seals distributed over the surface area of t

이 특허에 인용된 특허 (26)

  1. Derryberry Lesli A. (Dallas TX) Williams Charles E. (Dallas TX), A chip carrier and mounting structure connected to the chip carrier.
  2. Corman Ned E. (Harrisburg PA) Kandybowski Steven J. (Tower City PA) Scheingold William S. (Palmyra PA) Youngfleish Frank C. (Harrisburg PA), Active device substrate connector having a heat sink.
  3. Brown Candice H. (San Jose CA), Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to th.
  4. Christiansen Robert A. (Salvisa KY) DiGirolamo Joel A. (Lexington KY), Circuit board with self-supporting connection between sides.
  5. Kirby Peter L. (Newcastle Upon Tyne GB2), Electrical assembly.
  6. Larson Ralph I. (North Reading MA), Graphite heat-sink mountings.
  7. Butt Sheldon H. (Godfrey IL) Voss Scott V. (Portola Valley CA), Heat dissipating interconnect tape for use in tape automated bonding.
  8. Wakabayashi Tetsushi (Kawasaki JPX) Honda Norio (Aizuwakamatsu JPX) Sakuma Osamu (Yokohama JPX), Heat sink for a semiconductor device.
  9. Schneider Mark R. (San Jose CA), Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same.
  10. Sugimoto Masahiro (Yokosuka JPX) Wakasugi Yasumasa (Kawasaki JPX), Heatsink package for flip-chip IC.
  11. McShane Michael B. (Austin TX) Lin Paul (Austin TX), High performance overmolded electronic package.
  12. Eisele Dieter (Lampertheim DEX) Weimann Klaus (Lampertheim DEX), High-power semiconductor assembly in disk-cell configuration.
  13. Frey Marshall (Ossining NY) Scheuer Thomas (East Williston NY), Inflatable insert for luggage.
  14. Fisher Robert J. (170 City Blvd. West ; Apt. 201 Orange CA 92668), Inflatable luggage.
  15. Kerr, Stanley R., Inflatable packaging material.
  16. Elkin Alfred A. (Pawtucket RI) Duffany Richard N. (Warwick RI) Duarte William S. (Seekonk MA), Inflatable packaging pouch.
  17. Patil Sadanand (San Jose CA) Murphy Adrian (San Jose CA) Newman Keith (Sunnyvale CA), Integral dam and heat sink for semiconductor device assembly.
  18. Pollard David D. (Amanda OH) Krajci Gary E. (American OH), Mounting arrangement for disc mounted semiconductor devices.
  19. Bjrck Bengt (Bjrred SEX), Packaging material and a method for its manufacture.
  20. Matsuda Hideo (Yokohama JPX), Press-packed semiconductor device with lateral fixing member.
  21. Malm Douglas N., Recyclable pinch flange welt and method of making same.
  22. Ljungstrm Tommy B. G. (532 Cherbourg Ct. South Buffalo Grove IL 60089) Anchor David (407 S. Sunnyside Itasca IL 60143), Reducible volume containers.
  23. Honda Norio (Kawasaki JPX) Sugahara Takehisa (Kawasaki JPX), Semiconductor device.
  24. Pitasi Martin J. (Newbury MA), Surface-to-air heat exchanger for electronic devices.
  25. Craft Scott (Phoenix AZ), Thermal shunt for electronic circuits.
  26. Schuck David B. (Escondido CA), VLSI Packaging system.

이 특허를 인용한 특허 (24)

  1. Breed,David S., Airbags with internal valves.
  2. Stanley, Scott Kendyl; Vanderbeek, Karl William; McGuire, Kenneth Stephen; Arent, Lee Mathew; Rapach, Andrew Paul; You, Jun, Disposable flexible containers having surface elements.
  3. Stanley, Scott Kendyl; McGuire, Kenneth Stephen; Lester, Joseph Craig; Rapach, Andrew Paul, Enhancements to tactile interaction with film walled packaging having air filled structural support volumes.
  4. Stanley, Scott Kendyl; McGuire, Kenneth Stephen; Arent, Lee Mathew; You, Jun, Flexible containers.
  5. Stanley, Scott Kendyl; McGuire, Kenneth Stephen; Arent, Lee Mathew; You, Jun, Flexible containers.
  6. Ishihara, Tadayoshi; Lester, Joseph Craig; Bourgeois, Marc Richard; McGuire, Kenneth Stephen; Clare, Benjamin Jacob; Stanley, Scott Kendyl; Arent, Lee Mathew; You, Jun; Rapach, Andrew Paul; Berg, Jr., Charles John; Gunnerson, Kory Adam, Flexible containers and methods of forming the same.
  7. Ishihara, Tadayoshi; Lester, Joseph; Bourgeios, Marc; Clare, Benjamin; Stanley, Scott, Flexible containers and methods of forming the same.
  8. Bourgeois, Marc Richard; Clare, Benjamin Jacob; Lester, Joseph Craig; Ishihara, Tadayoshi; Stanley, Scott Kendyl; You, Jun; Cox, Donald Joseph, Flexible containers and methods of making the same.
  9. Bourgeois, Marc Richard; Ishihara, Tadayoshi; Lester, Joseph Craig; Clare, Benjamin Jacob; You, Jun; Stanley, Scott Kendyl, Flexible containers and methods of making the same.
  10. Cox, Donald; McGuire, Ken; Stanley, Scott; Arent, Lee; Rapach, Andrew; You, Jun; Bourgeois, Marc; Lester, Joseph; Gunnerson, Kory, Flexible containers having flexible valves.
  11. Cox, Donald; McGuire, Ken; Stanley, Scott; Arent, Lee; Rapach, Andrew; You, Jun; Bourgeois, Marc; Lester, Joseph; Gunnerson, Kory, Flexible containers having flexible valves.
  12. Stanley, Scott Kendyl; Berg, Jr., Charles John; McGuire, Kenneth Stephen; Arent, Lee Mathew; Clare, Benjamin Jacob; Bourgeois, Marc Richard; Ishihara, Tadayoshi; Lester, Joseph Craig; Rapach, Andrew Paul, Flexible containers having improved seam and methods of making the same.
  13. Berg, Jr., Charles John; You, Jun; Stanley, Scott Kendyl; McGuire, Kenneth Stephen; Arent, Lee Mathew; Rapach, Andrew Paul; Gunnerson, Kory Adam, Flexible containers with biased dispensing.
  14. McGuire, Kenneth Stephen; Arent, Lee Mathew; Stanley, Scott Kendyl; Berg, Jr., Charles John, Flexible containers with product dispensing visibility.
  15. You, Jun; McGuire, Kenneth Stephen; Stanley, Scott Kendyl, Flexible containers with puckered corners.
  16. You, Jun; Stanley, Scott Kendyl; McGuire, Kenneth Stephen; Lester, Joseph Craig, Flexible containers with reinforcing seals.
  17. Stanley, Scott; Arent, Lee; Rapach, Andrew; McGuire, Ken; You, Jun; Gunnerson, Kory, Flexible containers with vent systems.
  18. McGuire, Kenneth Stephen; You, Jun; Arent, Lee Mathew, Flexible containers with venting structure.
  19. Stanley, Scott Kendyl; You, Jun; Boswell, Emily Charlotte; Arent, Lee Mathew; McGuire, Kenneth Stephen, Flexible materials for flexible containers.
  20. Stanley, Scott Kendyl; You, Jun; Boswell, Emily Charlotte; Arent, Lee Mathew; McGuire, Kenneth Stephen; Rapach, Andrew Paul, Flexible materials for flexible containers.
  21. Elansary,Mohamed, Insulated container for liquids.
  22. Stanley, Scott Kendyl; McGuire, Kenneth Stephen; Berg, Charles John; Arent, Lee Mathew; Rapach, Andrew Paul; You, Jun, Methods of making flexible containers.
  23. Stanley, Scott Kendyl; McGuire, Kenneth Stephen; Berg, Jr., Charles John; Arent, Lee Mathew; Rapach, Andrew Paul; You, Jun, Methods of making flexible containers.
  24. Dubois, Jean-Marc, Transport container.
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