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Laser scribe and break process 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-026/00
  • H01L-031/042
출원번호 US-0925979 (1997-09-09)
발명자 / 주소
  • Rafla-Yuan Howard C.
  • Bradley Rick
출원인 / 주소
  • Optical Coating Laboratory, Inc.
대리인 / 주소
    Workman, Nydegger & Seeley
인용정보 피인용 횟수 : 43  인용 특허 : 11

초록

A method for effectuating scribe and break of coated glass microsheets for use with satellite solar cell covers. The method improves the consistency and edge quality of scribed solar cell covers, and also adds scribe and break capabilities not available with the conventional processes, resulting in

대표청구항

[ What is claimed and desired to be secured by United States Letters Patent is:] [1.] A method of scribing and breaking microsheets comprising the steps of:a. obtaining a microsheet of glass of a predetermined physical thickness;b. obtaining a laser source capable of producing a wavelength which is

이 특허에 인용된 특허 (11)

  1. Baumeister Philip W. (Loomis CA) Krisl Matthew E. (Santa Rose CA), Article with thin film coating having an enhanced emissivity and reduced absorption of radiant energy.
  2. Shorrock Peter (Wigan GBX) Yale Brain (Ormskirk GBX), Borosilicate glass composition.
  3. Zappella Pierino I. (Garden Grove CA), Method and apparatus for dicing semiconductor substrates using an excimer laser beam.
  4. Glenn Gregory S. (Pacific Palisades CA) Cavicchi B. Terence (North Hollywood CA), Method of fabrication of thin semiconductor device.
  5. Fukuda Takeshi (Ebina JPX) Yamazaki Shunpei (Tokyo JPX) Sugawara Akira (Atsugi JPX), Patterning method by laser scribing.
  6. Arai Yasuyuki (Kanagawa JPX) Nakajima Setsuo (Kanagawa JPX), Solar cell and method of forming the same.
  7. Schilling Roland (Gemmingen DEX), Space solar cell.
  8. Yamazaki Shunpei (Tokyo JPX), Thin film pattern structure formed on a glass substrate.
  9. Brandhorst ; Jr. Henry W. (Berea OH) Weinberg Irving (Rocky River OH), Thin solar cell and lightweight array.
  10. Beauchamp William T. (Santa Rosa CA) Tuttle-Hart Trudy (Santa Rosa CA), UV/IR reflecting solar cell cover.
  11. Cogan George W. (Menlo Park CA) Christel Lee A. (Menlo Park CA) Merchant J. Thomas (Los Gatos CA) Gibbons James F. (Palo Alto CA), Ultra-thin solar cell and method.

이 특허를 인용한 특허 (43)

  1. Poo, Chia Yong; Jeung, Boon Suan; Waf, Low Siu; Yu, Chan Min; Loo, Neo Yong; Koon, Eng Meow; Leng, Ser Bok; Kwang, Chua Swee; Chung, So Chee; Seng, Ho Kwok, Apparatus and method for packaging circuits.
  2. Poo, Chia Yong; Jeung, Boon Suan; Waf, Low Siu; Yu, Chan Min; Lou, Neo Yong; Koon, Eng Meow; Leng, Ser Bok; Kwang, Chun Swee; Chung, So Chee; Song, Ho Kwok, Apparatus and method for packaging circuits.
  3. Poo, Chia Yong; Jeung, Boon Suan; Waf, Low Slu; Yu, Chan Min; Loo, Neo Yong; Koon, Eng Meow; Leng, Ser Bok; Kwang, Chua Swee; Chung, So Chee; Seng, Hu Kwok, Apparatus and method for packaging circuits.
  4. Hoekstra Brian L., Apparatus for separating non-metallic substrates.
  5. Xuan, Jialuo Jack; Shih, Chung-Yuang, Combined laser-scribing and laser-breaking for shaping of brittle substrates.
  6. Kosmowski, Mark, Fluid counterbalance for a laser lens used to scribe an electronic component substrate.
  7. Kang, Hyoung Shik; Hong, Soon Kug; Oh, Seok Chang; Song, Min Gyu; Baek, Kwang Yeol, Glass cutting method and apparatus with controlled laser beam energy.
  8. Liu, Kuo-Ching, Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure.
  9. Liu,Kuo Ching, Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure.
  10. Liu, Kuo-Ching, Method and apparatus for cutting devices from substrates.
  11. Liu,Kuo Ching, Method and apparatus for cutting devices from substrates.
  12. Liu,Kuo Ching, Method and apparatus for cutting devices from substrates.
  13. Hoekstra Brian L ; Glebov Leonid B. ; Efimov Oleg M., Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe.
  14. Hoekstra Brian L. ; Pierola Javier A. ; Kar Aravinda, Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator.
  15. Zhang, Haibin; Shan, Fang; Rekow, Mathew; Zhang, Min; Simenson, Glenn; Xu, Qian; Brookhyser, James; Frankel, Joe; Darwin, Michael; Rundel, Jack; Pysher, Matthew, Method and apparatus for separation of workpieces and articles produced thereby.
  16. Luettgens, Thomas; Hartmann, Winfred; Hoetzel, Bernd; Markschlager, Patrick; Neumayr, Andreas, Method and device for producing glass panes of any desired contour from sheet glass.
  17. Pirogovsky, Peter; Albelo, Jeffery A.; O'Brien, James; Osako, Yasu, Method for laser singulation of chip scale packages on glass substrates.
  18. Xuan, Jialuo Jack; Shih, Chung-Yuang; Nguyen, Thanh Duc, Method for laser-scribing brittle substrates and apparatus therefor.
  19. Kamada,Kenji; Ohta,Koji; Yamaguchi,Jun; Koyama,Tadashi, Method for machining glass substrate.
  20. Luettgens,Thomas; Hartmann,Winfred; Hoetzel,Bernd; Markschlager,Patrick; Neumayr,Andreas, Method for manufacturing glass plates of any contour from flat glass.
  21. Chia, Yong Poo; Waf, Low Siu; Boon, Suan Jeung; Koon, Eng Meow; Chua, Swee Kwang, Method for packaging circuits.
  22. Chia, Yong Poo; Waf, Low Siu; Boon, Suan Jeung; Koon, Eng Meow; Chua, Swee Kwang, Method for packaging circuits.
  23. Poo, Chia Y.; Waf, Low S.; Jeung, Boon S.; Koon, Eng M.; Kwang, Chua S., Method for packaging circuits.
  24. Chia, Yong Poo; Waf, Low Siu; Boon, Suan Jeung; Koon, Eng Meow; Chua, Swee Kwang, Method for packaging circuits and packaged circuits.
  25. Brian L. Hoekstra, Method for separating non-metallic substrates.
  26. Swenson, Edward J.; Sun, Yunlong; Sammi, Manoj Kumar; Johnson, Jay Christopher, Method of forming a scribe line on a ceramic substrate.
  27. Swenson,Edward J.; Sun,Yunlong; Sammi,Manoj Kumar; Johnson,Jay Christopher; Garcia,Doug; Anklekar,Rupendra M., Method of forming a scribe line on a passive electronic component substrate.
  28. Li, Xinghua; Moore, Lisa Anne, Methods for laser cutting glass substrates.
  29. Li, Xinghua; Moore, Lisa Anne, Methods for laser cutting glass substrates.
  30. Li, Xinghua, Methods for laser scribing and separating glass substrates.
  31. Worrall, III, Joseph A.; Williamson, Alexander S.; McEntee, John F., Methods for producing glass substrates for use in biopolymeric microarrays.
  32. Worrall, III,Joseph A.; Williamson,Alexander S.; McEntee,John F., Methods for producing glass substrates for use in biopolymeric microarrays.
  33. Abramov, Anatoli Anatolyevich; Zhou, Naiyue, Methods of cutting glass using a laser.
  34. Li, Xinghua, Methods of separating strengthened glass substrates.
  35. Liu, Kuo-Ching; Fang, Pei Hsien; Dere, Dan; Liu, Jenn; Huang, Jih-Chuang; Lucero, Antonio; Pinkham, Scott; Oltrogge, Steven; Middlebusher, Duane, Scribing sapphire substrates with a solid state UV laser.
  36. Liu, Kuo-Ching; Fang, Pei Hsien; Dere, Dan; Liu, Jenn; Huang, Jih-Chuang; Lucero, Antonio; Pinkham, Scott; Oltrogge, Steven; Middlebusher, Duane, Scribing sapphire substrates with a solid state UV laser.
  37. Liu, Kuo-Ching; Fang, Pei Hsien; Dere, Daniel J.; Liu, Jenn; Huang, Jih-Chuang; Lucero, Antonio; Pinkham, Scott; Oltrogge, Steven; Middlebusher, Duane, Scribing sapphire substrates with a solid state UV laser with edge detection.
  38. Masato Matsumoto JP, Scribing with laser.
  39. Sercel, Patrick J.; Sercel, Jeffrey P.; Park, Jongkook, System and method for cutting using a variable astigmatic focal beam spot.
  40. Sercel, Patrick J.; Sercel, Jeffrey P.; Park, Jongkook, System and method for cutting using a variable astigmatic focal beam spot.
  41. Sercel,Patrick J.; Sercel,Jeffrey P.; Park,Jongkook, System and method for cutting using a variable astigmatic focal beam spot.
  42. Chua, Swee Kwang; Boon, Suan Jeung; Chia, Yong Poo; Loo, Neo Yong, Wafer level packaging.
  43. Chua, Swee Kwang; Boon, Suan Jeung; Chia, Yong Poo; Neo, Yong Loo, Wafer level packaging.
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