초록 ▼

Method of cooling electronic systems an semiconductor devices as well as an electronic system and a semiconductor device with heat dissipating elements. The method includes the steps of providing an electronic system or a semiconductor device with a heat sink including at least a first element havin

Method of cooling electronic systems an semiconductor devices as well as an electronic system and a semiconductor device with heat dissipating elements. The method includes the steps of providing an electronic system or a semiconductor device with a heat sink including at least a first element having a generally flat shape with a shoulder projecting from one generally flat surface, and configured to thermally engage similar elements. In one embodiment, a first and a second heat sink element are provided, with one of the first and second elements having a protrusion and the other of the first and second elements defining a depression configured to receive and retain said protrusion. Alternatively, the first and second elements may be bonded together with a thermally conductive adhesive.

대표청구항 ▼

[ What is claimed is:] [21.] A method of assembling a heat sink assembly, comprising the steps of:(a) providing a first fin including a projection extending from a surface thereof;(b) providing a second fin including a recess formed in a surface thereof for press-fittingly receiving said projection,

[ What is claimed is:] [21.] A method of assembling a heat sink assembly, comprising the steps of:(a) providing a first fin including a projection extending from a surface thereof;(b) providing a second fin including a recess formed in a surface thereof for press-fittingly receiving said projection, and further including a projection extending from a surface thereof that is opposite to said surface in which said recess is formed;(c) assembling the first and second fins together by press-fitting said projection of the first fin into said recess of the second fin;(d) providing an adapter including a recess formed in a surface thereof for press-fittingly receiving said projection of the second fin, and a projection extending from a surface thereof that is opposite to said surface in which said recess is formed, wherein said projection of the adapter has a cross-section that is smaller than a cross-section of said recess of the adapter; and(e) assembling the adapter to the second fin by press-fitting said projection into said recess.