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Method of cleaning surfaces with water and steam 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/00
출원번호 US-0809703 (1997-06-09)
우선권정보 DE-0022525 (1995-06-23)
국제출원번호 PCT/EP95/03838 (1995-09-28)
§371/§102 date 19970609 (19970609)
국제공개번호 WO-9610463 (1996-04-11)
발명자 / 주소
  • Kunze-Concewitz Horst,DEX
대리인 / 주소
    Jones, Tullar & Cooper, P.C.
인용정보 피인용 횟수 : 44  인용 특허 : 12

초록 ▼

A method and device for cleaning contaminated surfaces with both water and steam. A water film is applied to the contaminated surface and steam sprayed into the water film while water is continued to be applied to the water film. In this way the steam is directed into the water film and through the

대표청구항 ▼

[ I claim:] [1.] A method for cleaning contaminated surfaces with water and steam, comprising the steps of:applying a water film to the contaminated surface; andspraying steam into the applied water film while continuing to apply water to the water film,wherein the steam is applied through at least

이 특허에 인용된 특허 (12)

  1. Murdoch George (Andover GB2), Bed pan and urine bottle washing and disinfecting machines.
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  2. Hautau Charles M. (306 Brookville St. College Corner OH 45003), Blasting apparatus.
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  3. Castelli Daniel (North Haven CT) Donahue John (New Haven CT) Gillette Donald J. (Guilford CT) Hajek Bedrich (Clinton CT), Cleaning method using both wet and dry steam, and apparatus adapted therefor.
    상세보기
  4. Nguyen Quy C. (Santa Clara County) Shah Sushil (Alameda County) Jacobs William (Santa Clara County) Shifman Steven A. (Contra Costa County) Kuhns William (Alameda County CA), Disc washing system.
    상세보기
  5. Kuriyama Kazumi (Yamanashi JPX), Fluid supplying and processing device.
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  6. Gileta John (Chateauguay CAX), Method of cleaning workpieces with a potentially flammable or explosive liquid and drying in the tunnel.
    상세보기
  7. French Scott H. (Rockford MI), Parts washer.
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  8. Tuominen Aulis (Salo FIX), Procedure for washing circuit boards and means for use in said procedure.
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  9. Ito Hideo (Yokkaichi JPX) Narukawa Mitsutoshi (Yokkaichi JPX) Sakai Kazuhiro (Yokkaichi JPX), Process for cleaning silicon mass and the recovery of nitric acid.
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  10. Friedheim Max (8652 LeBerthon St. Sunland CA 91046), Steam jet cleaning and sterilizing system.
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  11. Yoshida Ichiro (Nagano JPX) Iida Hiroshi (Nagano JPX), Washing/drying method and apparatus.
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  12. Yoshida Ichiro (Nagano) Iida Hiroshi (Nagano) Kawaashima Shuzo (Nagano) Kuroiwa Fukuji (Shimotakai) Ito Isamu (Suzaka) Asanome Satoru (Nagano) Fujimori Toshiji (Nagano JPX), Washing/drying method with an aqueous solution containing surfactant.
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이 특허를 인용한 특허 (44)

  1. Toshima Masato, Apparatus and method for cleaning semiconductor wafers.
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  2. Wen-Jang Lu TW; Yi-Ta Tsou TW; Hui-Xiu Tang TW, Apparatus and method for cleaning wafer.
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  3. Lee, Seok Won; Jang, Sang Min; Kim, Sang Kyu, Apparatus and method for etching insulating film.
    상세보기
  4. Bergman, Eric J.; Hess, Mignon P., Apparatus and method for processing the surface of a workpiece with ozone.
    상세보기
  5. Jeong,In Kwon; Kim,Yong Bae; Kim,Jungyup, Apparatus and method for treating surfaces of semiconductor wafers using ozone.
    상세보기
  6. Jeong,In Kwon; Kim,Yong Bae; Kim,Jungyup, Apparatus and method for treating surfaces of semiconductor wafers using ozone.
    상세보기
  7. Bergman, Eric J., Apparatus for treating a workpiece with steam and ozone.
    상세보기
  8. Ponomarev, Sergey G., Cleaning apparatus and method of cleaning a contaminated surface.
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  9. Ben Kim, Cleaning with liquified gas and megasonics.
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  10. Pokorny, Joachim; Steinrücke, Andreas, Device and method for processing substrates.
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  11. Han, Nianci; Xu, Li; Shih, Hong; Zhang, Yang; Lu, Danny; Sun, Jennifer Y., Electroplating an yttrium-containing coating on a chamber component.
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  12. Kim, Jong-Guw, Flux cleaning method.
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  13. Shinozuka Shyuhei,JPX ; Miyoshi Kaori,JPX ; Fukunaga Akira,JPX ; Kobayashi Yoichi,JPX, Gas polishing apparatus and method.
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  14. D'Arcy H. Lorimer, Method and apparatus for cleaning flat workpieces.
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  15. Lorimer, D'Arcy Harold, Method and apparatus for cleaning flat workpieces within a semiconductor manufacturing system.
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  16. Jurgen Lohmuller DE, Method and apparatus for cleaning substrates.
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  17. Mertens, Paul; Meuris, Marc; Heyns, Marc, Method and apparatus for localized liquid treatment of the surface of a substrate.
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  18. Mertens, Paul; Meuris, Marc; Heyns, Marc, Method and apparatus for removing a liquid from a surface.
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  19. Paul Mertens BE; Marc Meuris BE; Marc Heyns BE, Method and apparatus for removing a liquid from a surface.
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  20. Mertens, Paul; Meuris, Mark; Heyns, Marc, Method and apparatus for removing a liquid from a surface of a rotating substrate.
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  21. Paul Mertens BE; Mark Meuris BE; Marc Heyns BE, Method and apparatus for removing a liquid from a surface of a rotating substrate.
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  22. Holsteyns, Frank; Heyns, Marc; Mertens, Paul W., Method and apparatus for removing a liquid from a surface of a substrate.
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  23. Rantanen, Rauno, Method and apparatus for spreading treating agent on a moving web.
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  24. Fyen, Wim; Mertens, Paul W., Method for coating substrates.
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  25. Bergman, Eric J.; Hess, Mignon P., Method for processing the surface of a workpiece.
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  26. Lorimer, D'Arcy Harold, Method of cleaning a wafer in an IC fabrication.
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  27. Han, Nianci; Xu, Li; Shih, Hong, Method of manufacturing a process chamber component having yttrium-aluminum coating.
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  28. Bergman, Eric J., Methods for cleaning semiconductor surfaces.
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  29. Bergman, Eric J., Methods for cleaning semiconductor surfaces.
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  30. Bergman, Eric J., Methods for processing a workpiece using steam and ozone.
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  31. Bergman,Eric J., Methods of thinning a silicon wafer using HF and ozone.
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  32. Bergman, Eric J., Process and apparatus for treating a workpiece such as a semiconductor wafer.
    상세보기
  33. Gebhart,Thomas Maximilia; Bergman,Eric J., Process and apparatus for treating a workpiece using ozone.
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  34. Bergman,Eric J., Process and apparatus for treating a workpiece with gases.
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  35. Han, Nianci; Xu, Li; Shih, Hong; Zhang, Yang; Lu, Danny; Sun, Jennifer Y., Process chamber component having electroplated yttrium containing coating.
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  36. Han, Nianci; Xu, Li; Shih, Hong, Process chamber component having yttrium—aluminum coating.
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  37. Bergman,Eric J., Processing a workpiece using water, a base, and ozone.
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  38. Kassir,Salman Moudrek; Spiegel,Larry A., Protection of work piece during surface processing.
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  39. Shih, Yu Lei, Substrate cleaning apparatus and method.
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  40. Nakajima,Kazuo; Sato,Masanobu; Sugimoto,Hiroaki; Hashizume,Akio; Tsujikawa,Hiroki, Substrate cleaning apparatus and substrate cleaning method.
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  41. Nakajima,Kazuo; Sato,Masanobu; Sugimoto,Hiroaki; Hashizume,Akio; Tsujikawa,Hiroki, Substrate cleaning apparatus and substrate cleaning method.
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  42. Miki, Nobuhiro; Nitta, Takahisa, Surface purification apparatus and surface purification method.
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  43. Hessburg Merilly Ann ; Lindsley Timothy John ; Darrow David Craig ; Sheffield John Edgar, System and method for hydrodynamic loading and unloading of objects into and out of substantially touchless hydrodynamic transport systems.
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  44. Bergman,Eric J.; Gebhart,Thomas Maximilian, System and methods for polishing a wafer.
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