초록 ▼

A method and apparatus for providing a prepackaged mold compound for use in encapsulating integrated circuit die and leadframe assemblies. A piece of mold compound 71 is placed in a receptacle 91 in a bottom mold chase 83. The receptacle 91 is coupled to a group of die cavities 85 by runners 87. Lea

A method and apparatus for providing a prepackaged mold compound for use in encapsulating integrated circuit die and leadframe assemblies. A piece of mold compound 71 is placed in a receptacle 91 in a bottom mold chase 83. The receptacle 91 is coupled to a group of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 83 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 93 is placed over the bottom mold chase and the prepackaged mold compound 71. The prepackaged mold compound 71 is a piece of mold compound 73 packaged in a plastic film which has sealed edges 77. The edges are peelable seals, which are released during the molding process. The mold compound 73 is then forced through the seals during the molding process by the pressure applied by a plunger 101. The plunger 101 can be applied using variable speed and pressure to control the rate the mold compound 73 fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.

대표청구항 ▼

[ What is claimed is:] [1.] A method of encapsulating an integrated circuit die and leadframe assembly, comprising the steps of:providing a bottom mold chase having a plurality of cavities for defining a bottom surface of an integrated circuit package, each cavity being coupled to a mold compound re

[ What is claimed is:] [1.] A method of encapsulating an integrated circuit die and leadframe assembly, comprising the steps of:providing a bottom mold chase having a plurality of cavities for defining a bottom surface of an integrated circuit package, each cavity being coupled to a mold compound receptacle by a runner, and each cavity having a gate to control the flow of mold compound into said cavity;placing at least one leadframe strip over said bottom mold chase, each leadframe strip having a plurality of integrated circuit dies, the leadframe strip being positioned such that each one of said integrated circuit dies is positioned over one of said cavities;providing a rectangular shaped piece of prepackaged mold compound and placing said piece into a receptacle in said bottom mold chase, said runners each providing a path from said receptacle to an associated one of said cavities, said runners being of approximately equal length;placing a top mold chase over said bottom mold chase, said top mold chase having cavities associated with the cavities of said bottom mold chase and being positioned over said cavities of said bottom mold chase and said integrated circuit dies;heating said top and bottom mold chases until the mold compound within said prepackaged mold compound reaches a low viscosity stage; andforcing said mold compound of out of said prepackaged mold compound into the runners and surrounding said integrated circuit dies and filling said cavities with mold compound;wherein said step of providing a rectangular shaped piece of prepackaged mold compound comprises providing a piece of mold compound packaged in a plastic film that has a heat seal at the edges, and wherein said step of heating relaxes said heat seal such that the heat seal opens in response to said heating step and the mold compound may be forced through the heat seal under pressure by said forcing step.