초록 ▼

An apparatus and method for removing heat from a heat generating component located within a thin-profile consumer electronic or computer system enclosure is disclosed. In one embodiment the cooling system of the present invention includes an air duct comprising a thermally conductive housing having

An apparatus and method for removing heat from a heat generating component located within a thin-profile consumer electronic or computer system enclosure is disclosed. In one embodiment the cooling system of the present invention includes an air duct comprising a thermally conductive housing having internal fins dispersed along the internal walls of the duct. An air flow generator produces an air flow that is directed from an inlet port located at or near the center of the air duct to first and second exit ports located at opposite ends of the duct. A low resistance thermal path, such as a heat pipe, transfers heat from the heat generating component to the air duct housing.

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus removing heat from a heat generating component, said apparatus comprising:a heat pipe comprising an evaporator portion and a condenser portion, said heat generating component being thermally coupled to said evaporator portion;an air duct comprising a housing

[ What is claimed is:] [1.] An apparatus removing heat from a heat generating component, said apparatus comprising:a heat pipe comprising an evaporator portion and a condenser portion, said heat generating component being thermally coupled to said evaporator portion;an air duct comprising a housing having internal fins, said air duct directing an air flow from an inlet port located near the center of said air duct to first and second exit ports located at opposite end portions of said air duct, said condenser portion of said heat pipe being attached to said housing; andan air flow generator coupled to said inlet port for producing said air flow.