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Processing a surface

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/304
  • H01L-021/306
출원번호 US-0335327 (1994-11-07)
발명자 / 주소
  • Rose Peter H.
  • Sferlazzo Piero
출원인 / 주소
  • Krytek Corporation
대리인 / 주소
    Fish & Richardson P.C.
인용정보 피인용 횟수 : 47  인용 특허 : 63

초록

In one aspect, foreign material on the surface of a substrate is processed to form a reaction product by: providing a directed flow of a fluid, comprising a reactant, to the vicinity of the foreign material to be processed; and delivering an aerosol of at least partially frozen particles continuousl

대표청구항

[ What is claimed is:] [1.] A method for processing foreign material on the surface of a substrate comprising the steps ofat any given time, providing from a first source a directed flow of a fluid, comprising a reactant, only to foreign material in a limited area reaction region corresponding to a

이 특허에 인용된 특허 (63)

  1. Whitlock Walter H. (Peapack NJ) Weltmer ; Jr. William R. (Murray Hill NJ) Clark James D. (Mountainside NJ), Apparatus and method for removing minute particles from a substrate.
  2. Titus Stephen D. (Houston TX), Apparatus and method of material removal with fluid flow within a slot.
  3. Lawson Robert M. (San Jose CA), Apparatus for cleaning semiconductor wafers.
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  5. Tano Teruo (Ohta JPX) Hamada Shuji (Yokohama JPX), Apparatus for processing workpiece with sandblasting.
  6. Hayashi Chikara (Chigasaki JPX), Apparatus for removing covering film.
  7. Hayashi Noriyuki (Shiga JPX) Murayama Hiromi (Kyoto JPX) Ishino Yukihiko (Kyoto JPX), Apparatus for removing organic substance from substrate.
  8. Layden Lawrence M. (Stanton NJ), Apparatus for removing small particles from a substrate.
  9. Kono Yasumasa (Fujisawa JA) Miyahara Shuji (Yokohama JA) Nomura Susumu (Yokohama JA) Ohkubo Hiroyuki (Yokohama JA) Fujimori Yoshio (Tokyo JA) Iwawaki Akira (Yokohama JA) Hirata Hiromasa (Yokohama JA), Apparatus for treating surfaces of sheet steel or the like.
  10. Sugimoto Kenji (Kyoto JPX), Apparatus for treating the surfaces of wafers.
  11. McDermott Wayne T. (Allentown PA) Wu Jin J. (Ossining NY) Ockovic Richard C. (Northampton PA), Apparatus to clean solid surfaces using a cryogenic aerosol.
  12. Fong Calvin C. (Beverly Hills CA) Altizer John W. (Simi Valley CA) Arnold Vernon E. (Fillmore CA) Lawson John K. (Granada Hills CA), Blasting machine utilizing sublimable particles.
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  15. Thompson Raymon F. (137 Sherry La. Kalispell MT 59901), Centrifugal wafer processor.
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  22. Olevitch Albert (Englewood OH), Cryogenic mechanical means of paint removal.
  23. McCune ; Jr. Robert C. (Birmingham MI) Toth Louis (Garden City MI) Bailey Robert S. (Newport News VA), Cryogenic process for metal lift-off.
  24. McDermott Wayne T. (Allentown PA) Ockovic Richard C. (Northampton PA), Diffusion gas diluter.
  25. Moore David E. (Cincinnati OH), Extrusion arrangement for a cryogenic cleaning apparatus.
  26. Blackwood Robert S. (Lubbock TX) Biggerstaff Rex L. (Lubbock TX) Clements L. Davis (Lincoln NE) Cleavelin C. Rinn (Lubbock TX), Gaseous process and apparatus for removing films from substrates.
  27. Tanaka Masato (Shiga JPX), Gaseous process for selectively removing silicon nitride film.
  28. Syverson Daniel J. (Robbinsdale MN) Novak Richard E. (Plymouth MN), HF gas etching of wafers in an acid processor.
  29. Cherry Roger L. (2636 Maria Ct. West Linn OR 97068), High-purity cleaning system, method, and apparatus.
  30. Cherry Roger L. (West Linn OR) Burke Joseph J. (Portland OR) Platt Christopher W. (Portland OR) Cowles Craig H. (Tigard OR), High-purity cleaning system, method, and apparatus.
  31. Tada Masuo (Yao JPX) Fukumoto Takaaki (Itami JPX) Ohmori Toshiaki (Itami JPX), Ice particle forming and blasting device.
  32. Gibot Claude (Malakoff FRX) Charles Jean-Michel (Marolles-en-Hurepoix FRX), Installation for the projection of particles of dry ice.
  33. Freeouf John L. (Peekskill NY) Jackson Thomas N. (Ossining NY) Oelhafen Peter (Basel NY CHX) Pettit George D. (Mahopac NY) Woodall Jerry M. (Bedford Hills NY), Intermediate passivation and cleaning of compound semiconductor surfaces.
  34. Zimmerman Sanford S. (Westport CT) Syarto Louis W. (Fairfield CT), Machining center having an inclinable vacuum-holding worktable.
  35. Hall William B. (Dallas PA), Megasonic jet cleaner apparatus.
  36. Syverson Daniel J. (Robbinsdale MN), Method and apparatus for controlling simultaneous etching of front and back sides of wafers.
  37. Rufin Denis A. (Hinsdale IL), Method and apparatus for in situ cleaning of excimer laser optics.
  38. Westergaard Knud E. (Rolighedsvej 16 9560 Hadsund DKX), Method and apparatus for particle blasting using particles of a material that changes its state.
  39. Imaike Sekiji (Osaka JPX) Hata Takeki (Kobe JPX) Yamazaki Norio (Itami JPX), Method and apparatus for producing microfine frozen particles.
  40. Brandt Georg (Erlangen DEX), Method for machining workpieces of brittle hard material into wafers.
  41. Izumi Akira (Kyoto JPX) Toei Keiji (Kyoto JPX) Watanabe Nobuatsu (Kyoto JPX) Chong Yong-Bo (Kyoto JPX), Method for removing a film on a silicon layer surface.
  42. Ohmori Toshiaki (Itami JPX) Kanno Itaru (Itami JPX) Fukumoto Takaaki (Itami JPX), Method of cleaning a surface by blasting the fine frozen particles against the surface.
  43. Endo Shinji (Hyogo JPX) Ohmori Toshiaki (Hyogo JPX) Fukumoto Takaaki (Hyogo JPX) Namba Keisuke (Hyogo JPX), Method of treating surface of substrate with ice particles and hydrogen peroxide.
  44. Moore David E. (212 Southampton Rd. Louisville KY 40223) Crane Newell D. (5988 Woodridge Dr. Milford OH 45150), Particle-blast cleaning apparatus and method.
  45. Lloyd Daniel L. (Mason OH), Phase change injection nozzle.
  46. Grant Robert W. (Excelsior MN) Torek Kevin (State College PA) Novak Richard E. (Plymouth MN) Ruzyllo Jerzy (State College PA), Process for etching oxide films in a sealed photochemical reactor.
  47. Hayashi Chikara (Chigasaki JPX), Process for removing covering film and apparatus therefor.
  48. Ockovic Richard C. (Allentown PA) McDermott Wayne T. (Allentown PA) Schwarz Alexander (Allentown PA), Process for sizing particles using condensation nucleus counting.
  49. Tada Masuo (Yao JPX) Hata Takeki (Kobe JPX) Fukumoto Takaaki (Itami JPX) Ohmori Toshiaki (Itami JPX), Processing apparatus for semiconductor wafers.
  50. Tada Masuo (Yao JPX) Hata Takeki (Kobe JPX) Fukumoto Takaaki (Itami JPX) Ohmori Toshiaki (Itami JPX), Processing apparatus for semiconductor wafers.
  51. Tada, Masuo; Hata, Takeki; Fukumoto, Takaaki; Ohmori, Toshiaki, Processing method for semiconductor wafers.
  52. Stemple Donald K. (Tempe AZ), Reactive sputter cleaning of semiconductor wafer.
  53. Leliaert Raymond M. (South Bend IN), Sand reclamation system.
  54. Fong Calvin C. (Beverly Hills CA), Sandblasting with pellets of material capable of sublimation.
  55. McNeilly Michael A. (Palo Alto CA), Semiconductor substrate heater and reactor process and apparatus.
  56. McNeilly Michael M. (Palo Alto CA), Semiconductor substrate heater and reactor process and apparatus.
  57. McNeilly Michael A. (Palo Alto CA), Semiconductor wafer processing apparatus.
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  60. Liu Benjamin Y. H. (North Oaks MN) Ahn Kang H. (Minneapolis MN), System for surface and fluid cleaning.
  61. Bard Steven (Northridge CA) Wu Jiunn-Jeng (Sierra Madre CA) Trimble Curtis A. (Sierra Madre CA), Ultra-high temperature stability Joule-Thomson cooler with capability to accommodate pressure variations.
  62. Moses ; Robert W., Valve cleaning machine.
  63. Levi Mark W. (Utica NY), Wafer cleaning method.

이 특허를 인용한 특허 (47)

  1. Rose Peter H. ; Sferlazzo Piero ; van der Heide Robert G., Aerosol surface processing.
  2. Murray,Timothy Gray; Maass,Bruce Alan, Apparatus and method for inspecting and cleaning semiconductor devices.
  3. Alitalo, Ville; Asikkala, Kai; Tammela, Simo; Virtanen, Sauli, Apparatus and method for producing aerosol and a focusing part.
  4. Fishkin, Boris; Sherrard, Michael, Apparatus for cleaning and drying substrates.
  5. Blattner,Jakob; Federici,Rudy, Device and method for cleaning articles used in the production of semiconductor components.
  6. Okazawa, Masaki; Iwama, Hideo, Dry ice cleaning method, dry ice cleaning apparatus, and part or unit cleaned by dry ice.
  7. Herbst, Tim W.; Maciej, Todd K.; Gast, Tracy A.; Wagener, Thomas J.; Siefering, Kevin L., Edge gripping device for handling a set of semiconductor wafers in an immersion processing system.
  8. Han, Yong-Pil; Sawin, Herbert H., HF vapor phase wafer cleaning and oxide etching.
  9. Banerjee, Souvik; Chung, Harlan Forrest, Liquid-assisted cryogenic cleaning.
  10. Banerjee,Souvik; Chung,Harlan Forrest, Liquid-assisted cryogenic cleaning.
  11. Struven, Kenneth C., Megasonic bath.
  12. Franklin, Patrick; Naughton, John J., Metal lift-off systems and methods using liquid solvent and frozen gas.
  13. Koike, Kunihiko; Yoshino, Yu; Makihira, Naohisa; Senoo, Takehiko; Aida, Toshihiro; Biro, Tomoya; Ichimaru, Hiroshi; Tainaka, Masahiro, Method and apparatus for supplying mixed gas.
  14. Jackson, David P., Method and apparatus for treating a substrate with dense fluid and plasma.
  15. Bran, Mario E., Method for megasonic processing of an article.
  16. Bollinger, Lynn David; Tokmouline, Iskander, Method for rapid thermal processing of substrates.
  17. Lee, Moon-hee; Lee, Kun-tack; Shim, Woo-gwan; Chung, Jong-ho, Method of and apparatus for removing contaminants from surface of a substrate.
  18. Lee,Moon hee; Lee,Kun tack; Shim,Woo gwan; Chung,Jong ho, Method of and apparatus for removing contaminants from surface of a substrate.
  19. Bran, Mario E., Method of manufacturing integrated circuit devices.
  20. Paul Ho SG; Simon Chooi SG; Yakub Aliyu SG; Mei Sheng Zhou SG; John Sudijono SG; Subhash Gupta SG; Sudipto Ranendra Roy SG; Yi Xu SG, Method to remove copper contamination by using downstream oxygen and chelating agent plasma.
  21. Boumerzoug,Mohamed; Tannous,Adel George, Methods for residue removal and corrosion prevention in a post-metal etch process.
  22. Boumerzoug,Mohamed; Tannous,Adel George; Makhamreh,Khalid, Methods for resist stripping and cleaning surfaces substantially free of contaminants.
  23. Tannous,Adel George; Makhamreh,Khalid, Methods for resist stripping and other processes for cleaning surfaces substantially free of contaminants.
  24. Tannous,Adel George; Makhamreh,Khalid, Methods for resist stripping and other processes for cleaning surfaces substantially free of contaminants.
  25. Tannous,Adel George; Makhamreh,Khalid, Methods for resist stripping and other processes for cleaning surfaces substantially free of contaminants.
  26. Yim, Dong-Kil; White, John M.; Choi, Soo Young; Kim, Han Byoul; Ha, Jin Man; Park, Beom Soo, Power loading substrates to reduce particle contamination.
  27. Yim, Dong-Kil; White, John M.; Choi, Soo Young; Kim, Han Byoul; Ha, Jin Man; Park, Beom Soo, Power loading substrates to reduce particle contamination.
  28. Haerle Andrew G. ; Meder Gerald S., Process for cleaning ceramic articles.
  29. Haerle, Andrew G.; Meder, Gerald S., Process for cleaning ceramic articles.
  30. Schwab, Günter; Franke, Helmut; Schöfberger, Manfred, Process for producing a semiconductor wafer.
  31. Kim Beom-Soo,KRX, Reticle cleaning apparatus for wafer exposure system.
  32. Yeh, Ming-Hsi; Chuang, Kuo-Sheng; Chien, Ying-Hsueh Chang; Yang, Chi-Ming; Lin, Chin-Hsiang, Semiconductor device cleaning method and apparatus.
  33. Haerle, Andrew G.; Meder, Gerald S., Semiconductor processing component having low surface contaminant concentration.
  34. Christenson, Kurt K.; Rathman, Christina A., Semiconductor wafer cleaning systems and methods.
  35. Achkire, Younes; Lerner, Alexander N; Govzman, Boris; Fishkin, Boris; Sugarman, Michael N; Mavliev, Rashid A; Fang, Haoquan; Li, Shijian; Shirazi, Guy E; Tang, Jianshe, Single wafer dryer and drying methods.
  36. Dobashi, Kazuya; Inai, Kensuke; Shimizu, Akitaka; Yasuda, Kenta; Yoshino, Yu; Aida, Toshihiro; Senoo, Takehiko, Substrate cleaning apparatus and vacuum processing system.
  37. Moriya, Tsuyoshi, Substrate cleaning method, substrate cleaning apparatus, substrate processing system, substrate cleaning program and storage medium.
  38. Izumi,Akira, Substrate processing apparatus and substrate processing method drying substrate by spraying gas.
  39. Toshima,Takayuki; Ueno,Kinya; Yamasaka,Miyako; Tsutsumi,Hideyuki; Iino,Tadashi; Kamikawa,Yuji, Substrate processing apparatus for resist film removal.
  40. Toshima, Takayuki; Ueno, Kinya; Yamasaka, Miyako; Tsutsumi, Hideyuki; Iino, Tadashi; Kamikawa, Yuji, Substrate processing method and apparatus.
  41. Toshima, Takayuki; Shindo, Naoki; Iino, Tadashi, Substrate processing method and substrate processing apparatus.
  42. Moriya, Tsuyoshi; Onishi, Tadashi; Nonaka, Ryo; Nishimura, Eiichi, Substrate processing system and substrate cleaning apparatus including a jetting apparatus.
  43. Jackson, David P., Substrate treatment process.
  44. Bran, Mario E., System for megasonic processing of an article.
  45. Park Chan-geun,KRX ; Lee Jong-jae,KRX, Vacuum dryer of drying semiconductor device using the same.
  46. Banerjee, Souvik; Chung, Harlan Forrest, Vapor-assisted cryogenic cleaning.
  47. Huang, Chien-Hua; Huang, Tsung-Min; Lee, Chung-Ju, Wet cleaning method for cleaning small pitch features.
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