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A slapper detonator includes an explosive pellet disposed within a detonator housing and a bridge chip disposed within a pocket defined between a pair of printed circuit boards. One of the printed circuit boards is disposed between the bridge chip and the explosive pellet and includes an opening cen

A slapper detonator includes an explosive pellet disposed within a detonator housing and a bridge chip disposed within a pocket defined between a pair of printed circuit boards. One of the printed circuit boards is disposed between the bridge chip and the explosive pellet and includes an opening centered over the bridge element to permit a flyer to accelerate before impacting the explosive pellet. The printed circuit board with the opening also establishes a connection between the bridge contact pads and metalized patterns or pads on the other printed circuit board which are, in turn, connected with metalized patterns or pads on an opposite side of the board. Various input contacts can be attached to the metalized pads, including an adapter board which converts side-by-side pads to concentric pads to permit coaxial connectors to be used. The slapper detonator can be used with a hermetic feed-through assembly having a feed-through housing which connects to a fuze housing in hermetically sealed relation and output contacts which mate in a detachable manner with the input contacts on the slapper detonator to permit removal of the detonator from the fuze electronics for periodic inspection and testing.

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[ What is claimed is:] [11.] A method of manufacturing a slapper detonator comprising the steps ofdefining a pair of metalized pads on one side of a first printed circuit board;defining a pair of metalized pads on each side of a second printed circuit board;connecting each of the metalized pads on t

[ What is claimed is:] [11.] A method of manufacturing a slapper detonator comprising the steps ofdefining a pair of metalized pads on one side of a first printed circuit board;defining a pair of metalized pads on each side of a second printed circuit board;connecting each of the metalized pads on the second printed circuit board with a metalized pad on the opposite side of the second board;defining a pocket between the first and second printed circuit boards;placing a bridge chip with contact pads connected by a bridge element in the pocket;positioning each of the metalized pads on the first printed circuit board over a bridge contact pad and a metalized pad on an opposed surface of the second printed circuit board to establish a connection between the bridge contact pad and a metalized pad on an opposite side of the second printed circuit board; andreflowing solder between the metalized pads.