Data carrier with a component-containing module and with a coil, method of producing such a data carrier and module ther
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0011120
(1998-01-29)
|
우선권정보 |
AT-0000422 U (1995-08-01) |
국제출원번호 |
PCT/IB96/00694
(1996-07-15)
|
§371/§102 date |
19980129
(19980129)
|
국제공개번호 |
WO-9705571
(1997-02-13)
|
발명자
/ 주소 |
|
출원인 / 주소 |
- Austria Card Plastikkarten, ATX
|
인용정보 |
피인용 횟수 :
7 인용 특허 :
8 |
초록
▼
In a data carrier (46) with a data carrier body (14), a component (31) and a coil (2) are incorporated in the data carrier body (14) and the component (31) is disposed in a component level zone (Z2) of the data carrier body (14) and the coil turns (3) of the coil (2), at least in their area adjacent
In a data carrier (46) with a data carrier body (14), a component (31) and a coil (2) are incorporated in the data carrier body (14) and the component (31) is disposed in a component level zone (Z2) of the data carrier body (14) and the coil turns (3) of the coil (2), at least in their area adjacent the component (31), are disposed in a winding level zone (Z1) situated outside the component level zone (Z2), and two module connecting contacts (32, 33) extend through the component level zone (Z2) up to the coil connecting contacts (4, 5).
대표청구항
▼
[ I claim:] [1.] A data carrier comprising a data carrier body bounded by a body surface and incorporating a module and a coil, which coil is separate from the module and has coil turns and at least two coil connecting contacts, the module comprising a plate-shaped carrier, which extends substantial
[ I claim:] [1.] A data carrier comprising a data carrier body bounded by a body surface and incorporating a module and a coil, which coil is separate from the module and has coil turns and at least two coil connecting contacts, the module comprising a plate-shaped carrier, which extends substantially parallel to said body surface and which is bounded by a first carrier main surface facing said body surface and by a second carrier main surface substantially parallel to the first carrier main surface, and at least one component, which component is incorporated in the data carrier body, is connected to the carrier, is raised with respect to the second carrier main surface, and is disposed in a component level zone which extends transversely to said body surface, and at least two module connecting contacts connected to the carrier and arranged in the area of the second carrier main surface, and the coil turns of the coil, at least in their area adjacent the component, being disposed in a winding level zone which is situated outside the component level zone and which extends transversely to said body surface, the coil connecting contacts together with the coil turns being disposed in the winding level zone, and each coil connecting contact being disposed opposite a module connecting contact in a direction transverse to the second carrier main surface and being connected to the last-mentioned connecting contact in an electrically conductive manner, and the module connecting contacts projecting beyond the level of the component and extending through the component level zone up to the coil connecting contacts, which are disposed in the winding level zone, and the data carrier having a recess which terminates in said body surface and which accommodates the module, characterized in that the data carrier body has been manufactured from at least two foils by means of a lamination process, and there has been provided a recess formed by means of a material removal process, and in a bottom area of the recess, which bottom area is remote from said body surface, at least two passages, which extend from the bottom area of the recess up to the coil connecting contacts, have been formed, preferably also by means of the same material removal process, through which passages the module connecting contacts are connected to the coil connecting contacts in an electrically conductive manner.
이 특허에 인용된 특허 (8)
-
Gaumet Michel (Saint Denis en Val FRX) Larchevesque Alain D. (Ferolles FRX), Contactless smart card the electronic circuit of which comprises a module.
-
Fidalgo Jean-Christophe (Gemenos FRX), Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for.
-
Yamamoto Hiroshi (Ibaraki JPX) Arakawa Ryutaro (Ibaraki JPX) Anada Akio (Ibaraki JPX), IC card.
-
Yanaka Yoshimi (Toride JPX) Miyamoto Keiji (Ibaraki JPX), IC package and IC card incorporating the same thereinto.
-
Mundigl Josef,DEX ; Houdeau Detlef,DEX, Method for producing a smart card module for contactless smart cards.
-
Hoppe Joachim (Munich DEX) Hohmann Arno (Munich DEX), Method for producing identity cards.
-
Ohno Hisashi,JPX, Non-contact IC card having insulated exposed leads.
-
Yamaji Yasuhiro (Kawasaki JPX) Hiruta Yoichi (Matsudo JPX) Nakazawa Tsutomu (Yokohama JPX) Katoh Katsuto (Tokyo JPX) Atsumi Yoshihiro (Yokohama JPX) Hirano Naohiko (Yokohama JPX) Mase Akihiro (Tokyo , Semiconductor device of multichip module-type.
이 특허를 인용한 특허 (7)
-
Tran,Donald T., Electronic assembly with integrated IO and power contacts.
-
Ottobon, Stephane; Fidalgo, Jean-Christophe; Audouard, Laurent; Seban, Frederick, Electronic module with three-dimensional communication interface.
-
Wilm Robert,DEX ; Houdeau Detlef,DEX ; Reiner Robert,DEX ; Rettig Rainer,DEX, Method and connection arrangement for producing a smart card.
-
Lange Martin,DEX ; Azdasht Ghassem,DEX, Method for producing a contactless chip card.
-
Terrance J. Dishongh ; Paul W. Churilla ; David H. Pullen, Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple.
-
Akagawa, Masatoshi, Non-contact type IC card and process for manufacturing-same.
-
Leighton,Keith R., Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.