초록 ▼

A method and apparatus are provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of cu

A method and apparatus are provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided are a method and apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided are a method and apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided are a method and apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.

대표청구항 ▼

[ We claim:] [1.] A computer system assembly comprising:a chassis to provide a structural framework, the chassis comprising an electrically conducting material;a base mounted to the chassis;a chip package mounted to the chassis to house an integrated circuit, the chip package having a plurality of c

[ We claim:] [1.] A computer system assembly comprising:a chassis to provide a structural framework, the chassis comprising an electrically conducting material;a base mounted to the chassis;a chip package mounted to the chassis to house an integrated circuit, the chip package having a plurality of connectors including supply and ground inputs which electrical couple the integrated circuit with the chassis through the base;a power supply to provide a current for powering the integrated circuit, wherein the current flows through the supply and/or ground current input pins and the chassis.