$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Cooling method, cooling apparatus and treatment apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-021/02
출원번호 US-0041449 (1998-03-12)
우선권정보 JP-0076685 (1997-03-13)
발명자 / 주소
  • Tateyama Kiyohisa,JPX
출원인 / 주소
  • Tokyo Electron Limited, JPX
대리인 / 주소
    Foley & Lardner
인용정보 피인용 횟수 : 28  인용 특허 : 6

초록

An apparatus is provided with a cooling unit for cooling a treatment substrate, a supporting body for supporting the treatment substrate before being transferred to the cooling unit and a cooling apparatus for cooling the treatment substrate supported by the supporting body. The apparatus cools the

대표청구항

[ What is claimed is:] [1.] A method of cooling a treatment substrate comprising the steps of:(a) placing the treatment substrate in a standby position where the treatment substrate stands by before being transferred to a cooling unit and cooling the treatment substrate thereon in the standby positi

이 특허에 인용된 특허 (6)

  1. Jones ; III Robert H. (Lafayette LA), Apparatus and method for the cryogenic treatment and heating of materials.
  2. Shima Yoshisuke (Tokyo JPX), Continuous multistage thermal processing apparatus, freezing control method for use by the apparatus, and apparatus for.
  3. Peter Fritz (Binzmhlestr. 405 CH-8046 Zrich CHX) Murialdo Gastonge (Gaggio di Bioggio CH-6981 Vernate CHX), Conveyor for cooling and removal of objects from an in-line sectional production machine.
  4. Turner Virgil Q. (Sugarland TX) Light William D. (Richmond TX) Trevino Hilario T. (Needville TX) Guldi Richard L. (Dallas TX) Poag Frank (Plano TX) Paradis Douglas E. (Richardson TX), Enhanced cleansing process for wafer handling implements.
  5. Usuiwa Mikio (Matsudo JPX) Shinkai Masanobu (Tokyo JPX) Fujishima Chisato (Matsudo JPX), Method of manufacturing shoes.
  6. Garunts Feliks (1422 N. Tamarind Ave. ; Apt. #8 Los Angeles CA 90028) Darbinyan Robert (D17ur. Sundukyana #87 Yerevan 375012 ; Armenia SUX), Room air environment conditioner.

이 특허를 인용한 특허 (28)

  1. Raaijmakers Ivo, Apparatus for cooling substrates.
  2. Cox,Gerald, Apparatus for heating a substrate in a variable temperature process using a fixed temperature chuck.
  3. Raaijmakers, Ivo, Apparatus for thermal treatment of substrates.
  4. Lee,Sang Seok; Park,Sang Ho, Bonding device for manufacturing liquid crystal display device.
  5. Englhardt, Eric A.; Rice, Michael R.; Hudgens, Jeffrey C.; Hongkham, Steve; Pinson, Jay D.; Salek, Mohsen; Carlson, Charles; Weaver, William T; Armer, Helen R., Cartesian cluster tool configuration for lithography type processes.
  6. Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Katwyk, Kirk Van; Hoskins, Van; Shah, Vinay, Cartesian robot cluster tool architecture.
  7. Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lue, Brian, Cluster tool architecture for processing a substrate.
  8. Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lue, Brian, Cluster tool architecture for processing a substrate.
  9. Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lue, Brian, Cluster tool architecture for processing a substrate.
  10. Ishikawa,Tetsuya; Roberts,Rick J.; Armer,Helen R.; Volfovski,Leon; Pinson,Jay D.; Rice,Michael; Quach,David H.; Salek,Mohsen S.; Lowrance,Robert; Backer,John A.; Weaver,William Tyler; Carlson,Charles; Wang,Chongyang; Hudgens,Jeffrey; Herchen,Harald; Lue,Brian, Cluster tool architecture for processing a substrate.
  11. Volfovski, Leon; Ishikawa, Tetsuya, Cluster tool substrate throughput optimization.
  12. Akimoto,Masami; Hayashi,Shinichi; Hayashida,Yasushi; Matsuoka,Nobuaki, Coating and developing apparatus and coating and developing method.
  13. Albert Wang, End-effector with integrated cooling mechanism.
  14. Sugawara, Yudo, Ion supply device and workpiece processing system provided with the same.
  15. Ghanayem Steve G. ; Chandrachood Madhavi, Method and apparatus for reducing particle contamination during wafer transport.
  16. Raaijmakers Ivo, Method of cooling wafers.
  17. Cox, Gerald, Method of heating a substrate in a variable temperature process using a fixed temperature chuck.
  18. Albert Wang, Rapid heating and cooling of workpiece chucks.
  19. Yamagishi, Takayuki; Suwada, Masaei; Watanabe, Takeshi, Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections.
  20. Yamagishi,Takayuki; Suwada,Masaei; Watanabe,Takeshi, Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections.
  21. Thomas W. Aswad, Substrate cooling system.
  22. Aswad, Thomas W., Substrate cooling system and method.
  23. Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Van Katwyk, Kirk; Hoskins, Van; Shah, Vinay, Substrate processing sequence in a Cartesian robot cluster tool.
  24. Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Katwyk, Kirk Van; Hoskins, Van; Shah, Vinay, Substrate processing sequence in a cartesian robot cluster tool.
  25. Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Van Katwyk, Kirk; Hoskins, Van; Shah, Vinay, Substrate processing sequence in a cartesian robot cluster tool.
  26. Aggarwal, Ravinder; Kusbel, Jim; Alexander, Jim, System for the improved handling of wafers within a process tool.
  27. Aggarwal, Ravinder; Kusbel, James F., Transfer chamber with integral loadlock and staging station.
  28. Lester, Paul; Meyer, Scott; Atkins, Wyland L.; Richards, Douglas; Predoaica, Constantin; Hudgens, Jeffrey; Carlson, Charles; Kankanala, Penchala; Rice, Mike; Papanu, James S.; Baiya, Evanson G.; Rosato, John J., Wet clean system design.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로