$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Modular refrigeration system

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-041/00
출원번호 US-0976352 (1997-11-21)
발명자 / 주소
  • Hare Jeffrey J.
  • Harris Willard S.
  • Hickey Jody A.
  • Schmidt Roger R.
  • Seminaro Edward J.
  • Chrysler Gregory M.
  • Chu Richard C.
  • Goth Gary F.
  • Simons Robert E.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Cutter
인용정보 피인용 횟수 : 72  인용 특허 : 19

초록

A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from computer systems. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to changes in thermal load. This allows the unit to op

대표청구항

[ The invention claimed is:] [1.] A cooling unit for continuous operation and wide thermal load range, said cooling unit comprising:a variable speed d.c. motor;a compressor driven by said motor;a condenser for receiving compressed refrigerant from said compressor;a thermal expansion device for recei

이 특허에 인용된 특허 (19)

  1. Neuenfeldt, Douglas L.; Thielman, David E., Air conditioner having improved structure for cooling electronics.
  2. Worthington Donald J. (3440 Eastlake Rd. ; #114 Palm Harbor FL 33563), Air conditioning apparatus having variable sensible heat ratio.
  3. Lndqvist Gsta B. (Johanneshov SEX), Apparatus for cooling telecommunications equipment in a rack.
  4. Leeb Karl-Erik (Djurhamn SEX), Arrangement for cooling electronic equipment by radiation transfer.
  5. Niggemann Richard E. (Rockford IL), Cold chassis for cooling electronic circuit components on an electronic board.
  6. Dudley Kevin F. (Cazenovia NY), Compressor discharge temperature control for a variable speed compressor.
  7. Porter Warren W. (Escandido CA), Computer component cooling system with local evaporation of refrigerant.
  8. Morrison Robert A. (Long Beach CA), Cooling system for electronic modules.
  9. Bennett Benjamin R. (West Covina CA) McBee Leroy D. (Brea CA) Horak Richard F. (Fullerton CA), Fail-safe refrigeration for continuous process.
  10. Jean Amigo (No. 18 ; Alley S ; Lane 19 ; Nu-Chung Rd. I-Lan City TWX), Flexible heat transfer device.
  11. Budelman Gerald A. (Aloha OR), High efficiency heat removal system for electric devices and the like.
  12. Fox Leslie (Boxboro MA) Wade Paul C. (Shirley MA), Hybird cooling system for electronic components.
  13. Green Peter J. (Huntington WV), Low headroom ventilating apparatus for cooling an electrical enclosure.
  14. Thielman David E. (Hennepin County MN) Welch Dennis E. (Anoka County MN) Bezat Theodore P. (Hennepin County MN), Method and apparatus for electromechanical air conditioning of industrial electronics.
  15. Priot Robert (Trevoux FRX), Method of cooling electrical components, device for implementing same and application to vehicle-borne components.
  16. Diggelmann Hans (Neuenegg CHX) Ulrich Bohdan (Kehrsatz CHX), Process and apparatus for dissipating the heat loss of at least one assembly of electrical elements.
  17. Cowans Kenneth W. (Fullerton CA), Refrigeration system and method for very large scale integrated circuits.
  18. Chan Chung K. (Los Angeles CA), Self-actuating heat switches for redundant refrigeration systems.
  19. Heffner Joseph H. (Chesterfield MO) Hoehne Dennis L. (St. Louis MO), Shuttle valve for a refrigeration system.

이 특허를 인용한 특허 (72)

  1. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.
  2. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack.
  3. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
  4. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
  5. Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
  6. Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
  7. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution.
  8. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Capacitively coupled plasma reactor having very agile wafer temperature control.
  9. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Capacitively coupled plasma reactor having very agile wafer temperature control.
  10. Manole, Dan M., Compact refrigeration system and power supply unit including dynamic insulation.
  11. Manole,Dan M.; Coffey,Donald L.; Moore,Michael J., Compact refrigeration system for providing multiple levels of cooling.
  12. Campbell, Levi A.; Chu, Richard C.; Colgan, Evan G.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Contaminant separator for a vapor-compression refrigeration apparatus.
  13. Campbell, Levi A.; Chu, Richard C.; Colgan, Evan G.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Contaminant separator for a vapor-compression refrigeration apparatus.
  14. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load.
  15. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling.
  16. Rasmussen, Neil; Bean, John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  17. Rasmussen, Neil; Bean, Jr., John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  18. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Cooling system for portable electronic and computer devices.
  19. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Cooling system with auxiliary thermal buffer unit for cooling an electronics module.
  20. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Dehumidifying and re-humidifying apparatus and method for an electronics rack.
  21. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Dehumidifying and re-humidifying cooling apparatus and method for an electronics rack.
  22. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Dehumidifying cooling apparatus and method for an electronics rack.
  23. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Dehumidifying cooling apparatus and method for an electronics rack.
  24. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Dehumidifying cooling apparatus and method for an electronics rack.
  25. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Dehumidifying cooling apparatus and method for an electronics rack.
  26. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat exchange assembly with integrated heater.
  27. W. John Bilski ; Matthew D. Nissley ; Erik Mallett, Heat management system.
  28. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  29. Wexler, Peter, In-row air containment and cooling system and method.
  30. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Integrated heat sink system for a closed electronics container.
  31. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  32. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
  33. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
  34. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
  35. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Liquid-to-air cooling system for portable electronic and computer devices.
  36. Gary F. Goth ; Jody A. Hickey ; Daniel J. Kearney ; Robert Makowicki ; John Loparco, Logic module refrigeration system with condensation control.
  37. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert, Logic module refrigeration system with condensation control.
  38. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert; Loparco, John, Logic module refrigeration system with condensation control.
  39. Tutunoglu, Ozan, Method and apparatus for cooling.
  40. Tutunoglu, Ozan; Bean, Jr., John H., Method and apparatus for cooling.
  41. Tutunoglu, Ozan; Lingrey, David James, Method and apparatus for cooling.
  42. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, Williams W.; Zubillaga, Glenn W.; Millian, Isaac, Method for agile workpiece temperature control in a plasma reactor using a thermal model.
  43. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert, Method for controlling a refrigeration unit for evaporator maintenance.
  44. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert, Method for controlling multiple refrigeration units.
  45. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert, Method for operating a logic module refrigeration unit.
  46. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert, Method for shutting down a refrigerating unit.
  47. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert, Method for starting a refrigeration unit.
  48. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert, Method of controlling a refrigeration unit.
  49. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor.
  50. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor.
  51. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of operating a capacitively coupled plasma reactor with dual temperature control loops.
  52. Tutunoglu, Ozan; Bean, Jr., John H., Method of operating a cooling system having one or more cooling units.
  53. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of processing a workpiece in a plasma reactor using feed forward thermal control.
  54. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of processing a workpiece in a plasma reactor using multiple zone feed forward thermal control.
  55. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  56. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  57. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
  58. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Plasma reactor with a multiple zone thermal control feed forward control apparatus.
  59. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with a multiple zone thermal control feed forward control apparatus.
  60. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes.
  61. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes.
  62. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with wafer backside thermal loop, two-phase internal pedestal thermal loop and a control processor governing both loops.
  63. Takano Yoshiaki,JPX ; Izawa Satoshi,JPX ; Ito Hajime,JPX ; Sugi Hikaru,JPX, Refrigerating cycle system with hot-gas bypass passage.
  64. Shrivastava, Saurabh K.; VanGilder, James W., System and method for arranging equipment in a data center.
  65. VanGilder, James William, System and method for prediction of temperature values in an electronics system.
  66. Healey, Christopher M.; Zhang, Xuanhang, System and method for sequential placement of cooling resources within data center layouts.
  67. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermal resistance-based monitoring of cooling of an electronic component.
  68. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat.
  69. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, refrigeration cooling of an electronic component.
  70. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, vapor-compression refrigeration apparatus facilitating cooling of an electronic component.
  71. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, vapor-compression refrigeration method facilitating cooling of an electronic component.
  72. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Vapor-compression refrigeration apparatus with backup air-cooled heat sink and auxiliary refrigerant heater.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트