초록 ▼

A mold for BGA semiconductor packages which includes a height adjusting member adapted to adjust the height of the top cavity insert of the top mold or the bottom cavity insert of the bottom mold, an elastic member disposed between the height adjusting member and associated insert, clamping regions

A mold for BGA semiconductor packages which includes a height adjusting member adapted to adjust the height of the top cavity insert of the top mold or the bottom cavity insert of the bottom mold, an elastic member disposed between the height adjusting member and associated insert, clamping regions of different heights formed at its top or bottom cavity insert, or air vents having a width and depth of an optimum ratio to the area and depth of cavities, thereby being capable of maintaining an optimum and uniform clamping pressure between the top and bottom molds for a variety of PCB strips having a thickness deviation among different portions thereof or having various average thicknesses, upon molding resin encapsulants on those PCB strips, thereby achieving an improvement in the quality of finally produced packages while preventing a sweeping phenomenon of bonding wires electrically connecting a semiconductor chip to conductive traces.

대표청구항 ▼

[ What is claimed is:] [1.] A mold for fabricating ball grid array semiconductor packages, the mold including a top mold and a bottom mold to mold resin encapsulants on portions of a printed circuit board (PCB) strip respectively including semiconductor chip mounting regions, the PCB strip being mou

[ What is claimed is:] [1.] A mold for fabricating ball grid array semiconductor packages, the mold including a top mold and a bottom mold to mold resin encapsulants on portions of a printed circuit board (PCB) strip respectively including semiconductor chip mounting regions, the PCB strip being mounted with a plurality of semiconductor chips at the semiconductor chip mounting regions, respectively, and bonded with wires adapted to electrically connect respective circuit patterns of the semiconductor chips to conductive traces, wherein:the top mold comprises a top mold base provided at a lower surface thereof with a longitudinally extending recess, a top center block centrally disposed in the recess beneath the top mold base, a pair of detachable height adjusting members respectively disposed in the recess in opposite sides of the top center block, the height adjusting members having a flat plate shape, and a pair of top cavity inserts respectively disposed in the recess just beneath the height adjusting members;each of the top cavity inserts has a lower surface positioned at a higher level than lower surfaces of the top mold and the top center block, thereby forming a step having a desired height;the bottom mold comprises a bottom mold base provided at an upper surface thereof with a longitudinally extending recess, a bottom center block centrally disposed in the recess on the bottom mold base, and a pair of bottom cavity inserts respectively disposed in the recess in opposite sides of the bottom center block;the bottom center block has a pot adapted to melt a molding resin, and a runner adapted as an elongated conduit for feeding the melted resin, and each of the bottom cavity inserts is provided at an upper surface thereof with a plurality of concave portions and clamping regions respectively disposed around the concave portions to define the concave portions, each of the concave portions communicating with the runner at one of the corners thereof while having air vents at the remaining corners thereof;the clamping regions of the bottom cavity insert define, along with a lower surface of the top cavity insert, resin encapsulant molding cavities in which the semiconductor chips mounted on the PCB strip and electrically connected to the conductive traces are received, respectively, when the top and bottom molds are coupled to carry out a molding process; andeach of the detachable height adjusting members has a thickness selected to provide the step defined between the lower surface of the top cavity insert and the lower surfaces of the top mold base and the top center block so that an optimum clamping pressure is applied to the PCB strip between the top and bottom molds in the molding process where the PCB strip has a thickness deviation among different portions thereof.