초록

Deaggregated highly disperse silicic acid, in which the average particle size is less than 100 nm, preferably less than 50 nm, is prepared by extremely high mechanical stress. The deaggregated silicic acid is employed as a filler in silicone rubber mixtures.

대표청구항 ▼

[ What is claimed as new and desired to be secured by Letters Patent of the United States is:] [1.] A process for deaggregating silicic acid, comprising:subjecting to mechanical stress a mixture comprising:(a) highly dispense silicic acid, and(b) at least one organosilicon compound which is liquid a

[ What is claimed as new and desired to be secured by Letters Patent of the United States is:] [1.] A process for deaggregating silicic acid, comprising:subjecting to mechanical stress a mixture comprising:(a) highly dispense silicic acid, and(b) at least one organosilicon compound which is liquid at 25 .degree. C. and 1 atmosphere;wherein said subjecting is carried out at a temperature of 20 to 200.degree. C. in a closed mixing unit which has no dead space and has at least one rotating mixing organ rotating at a speed of greater than 3 m/s, andsaid subjecting is conducted until said silicic acid has an average particle size of less than 100 nm.