초록 ▼

An IC package is provided that has a flexible wiring sheet, including an upper portion, a lower portion and a side portion which is wound around a base member over an upper surface, side surfaces and a lower surface of the base member. An IC is loaded on an upper surface of the upper flexible wiring

An IC package is provided that has a flexible wiring sheet, including an upper portion, a lower portion and a side portion which is wound around a base member over an upper surface, side surfaces and a lower surface of the base member. An IC is loaded on an upper surface of the upper flexible wiring sheet covering the upper surface of the base member. The IC is connected to an electrode provided on an upper lead pattern portion laid along the upper surface of the flexible wiring sheet. The lead pattern is extended from the upper flexible wiring sheet to the lower flexible wiring sheet via the side surfaces of the flexible wiring sheet covering side surfaces of the base member. An electrode to be connected with an object is arranged on the lower lead pattern portion which is formed on the lower flexible wiring sheet, and overall the IC or an IC connection portion is sealed on the upper surface of the upper flexible wiring sheet.

대표청구항 ▼

[ What is claimed is:] [1.] An integrated circuit package comprising:a base member having an upper surface, outer side surfaces, and a lower surface;a unitary wiring sheet having an upper surface, a pair of side surfaces, a pair of lower surfaces, and a pair of ends, wherein said wiring sheet is wra

[ What is claimed is:] [1.] An integrated circuit package comprising:a base member having an upper surface, outer side surfaces, and a lower surface;a unitary wiring sheet having an upper surface, a pair of side surfaces, a pair of lower surfaces, and a pair of ends, wherein said wiring sheet is wrapped about said base member so that said upper surface of said wiring sheet overlays said upper surface of said base member, said pair of side surfaces of said wiring sheet overlay said outer side surfaces of said base member, said pair of lower surfaces of said wiring sheet overlay said lower surface of said base member, and said pair of ends of said wiring sheet face each other in a parallel opposing relation along said lower surface of said base member;upper electrodes arranged on said upper surface of said wiring sheet;lower electrodes arranged on said lower surfaces of said wiring sheet;a lead pattern disposed on said wiring sheet, said lead pattern connected between said upper electrodes and said lower electrodes, said lead pattern extending from said upper electrodes to said lower electrodes via said side surfaces of said wiring sheet; andan IC positioned on said upper surface of said wiring sheet, wherein a connection is formed between said IC and said upper electrodes.