초록 ▼

A heat frame (10) incorporates a mounting frame for mounting multiple circuit boards (38), a heat sink (24), a connector bracket (34), and hinge mounts (12) into one integral component. Heat removed by the heat sink (24) is transferred over the entire heat frame (10) with the aid of a heat pipe (44)

A heat frame (10) incorporates a mounting frame for mounting multiple circuit boards (38), a heat sink (24), a connector bracket (34), and hinge mounts (12) into one integral component. Heat removed by the heat sink (24) is transferred over the entire heat frame (10) with the aid of a heat pipe (44). Fins 17 dissipate heat through the housing of computer (50) under the display assembly (74). The integral nature of the heat frame (10) reduces assembly and testing costs, as well as providing superior heat transfer and EMI/RFI grounding.

대표청구항 ▼

[ What is claimed is:] [1.] An electronic apparatus, comprising:a plurality of circuit boards;an elongated heat frame formed of an integral piece of material for holding said plurality of circuit boards in a horizontal orientation, a portion of said heat frame being thermally coupled to a processor

[ What is claimed is:] [1.] An electronic apparatus, comprising:a plurality of circuit boards;an elongated heat frame formed of an integral piece of material for holding said plurality of circuit boards in a horizontal orientation, a portion of said heat frame being thermally coupled to a processor for removing heat therefrom and spreading the heat throughout the heat frame; anda housing for containing said heat frame and circuit boards.