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특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Method of planarizing tips of probe elements of a probe card assembly

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01R-009/00   
미국특허분류(USC) 29/842 ; 29/844 ; 174/261 ; 324/754 ; 324/761 ; 361/772 ; 361/774 ; 361/776 ; 361/789
출원번호 US-0554902 (1995-11-09)
발명자 / 주소
  • Eldridge Benjamin N.
  • Grube Gary W.
  • Khandros Igor Y.
  • Mathieu Gaetan L.
출원인 / 주소
  • FormFactor, Inc.
대리인 / 주소
    Larwood
인용정보 피인용 횟수 : 369  인용 특허 : 3
초록
▼

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are "stacked up" so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe ca...

대표
청구항

[ What is claimed is:] [1.] In a probe card assembly, a method of altering the orientation of probe elements for probing semiconductor devices, comprising:providing a probe card;providing a support substrate with plurality of probe elements for probing semiconductor devices;mounting the support substrate on the probe card; andaltering the orientation of the support substrate relative to the probe card.

이 특허에 인용된 특허 (3)

  1. Kwon Oh-Kyong (Richardson TX) Malhi Satwinder (Garland TX) Hashimoto Masahi (Garland TX), Compliant contact pad.
  2. Tsuji Hiroki (Yokohama JPX) Kawano Kyoichiro (Yokohama JPX) Murase Teruo (Yokohama JPX), Connecting apparatus.
  3. Bargain Raymond (Sartrouville FRX) Riverie Jean (Limours FRX) Ollivier Jean-Francois (Versailles FRX), Intermediate connector for use between a printed circuit card and a substrate for electronic circuits.

이 특허를 인용한 특허 (369)

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  22. Strid, Eric; Campbell, Richard, Calibration structures for differential signal probing.
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  62. Eldridge, Benjamin N., Electrical contactor, especially wafer level contactor, using fluid pressure.
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  169. Eldridge, Benjamin N.; Wenzel, Stuart W., Method for forming microelectronic spring structures on a substrate.
  170. Khandros,Igor Y.; Mathieu,Gaetan L.; Reynolds,Carl V., Method for making a socket to perform testing on integrated circuits.
  171. Chen,Jimmy Kuo, Method for mounting and heating a plurality of microelectronic components.
  172. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Method for probing an electrical device having a layer of oxide thereon.
  173. Hayden, Leonard; Martin, John; Andrews, Mike, Method of assembling a wafer probe.
  174. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method of constructing a membrane probe.
  175. Eldridge, Benjamin N., Method of designing a probe card apparatus with desired compliance characteristics.
  176. Eldridge,Benjamin N., Method of designing a probe card apparatus with desired compliance characteristics.
  177. Eslamy, Mohammad; Pedersen, David V.; Cobb, Harry D., Method of fabricating segmented contactor.
  178. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Wenzel, Stuart W., Method of fabricating shaped springs.
  179. Garabedian, Raffi; Tea, Nim Hak; Wang, Steven; Karklin, Heather, Method of forming probe card assembly.
  180. Akram, Salman, Method of forming tester substrates.
  181. Kim,Kieun; Cohen,Adam L.; Larsen,Willa M.; Chen,Richard T.; Kumar,Ananda H.; Kruglick,Ezekiel J. J.; Arat,Vacit; Zhang,Gang; Lockard,Michael S., Method of making a contact.
  182. Eldridge,Benjamin Niles; Grube,Gary William; Khandros,Igor Yan; Mathieu,Gaetan L., Method of making a contact structure with a distinctly formed tip structure.
  183. Grube, Gary W.; Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L., Method of manufacturing a probe card.
  184. Grube, Gary W.; Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L.; Lotfizadeh, Poya; Tseng, Chih-Chiang, Method of manufacturing a probe card.
  185. Grube,Gary W.; Khandros,Igor Y.; Eldridge,Benjamin N.; Mathieu,Gaetan L., Method of manufacturing a probe card.
  186. Grube,Gary W.; Khandros,Igor Y.; Eldridge,Benjamin N.; Mathieu,Gaetan L.; Lotfizadeh,Poya; Tseng,Jim Chih Chiang, Method of manufacturing a probe card.
  187. Eldridge, Benjamin N.; Mathieu, Gaetan L., Method of manufacturing a resilient contact.
  188. Eslamy, Mohammad; Pedersen, David V.; Cobb, Harry D., Method of repairing segmented contactor.
  189. Orsillo,James E., Method of retrofitting a probe station.
  190. Orsillo, James, Method of using a replacement headplate to adapt a probe station.
  191. Eldridge, Benjamin N.; Barbara, Bruce Jeffrey, Method to build a wirebond probe card in a many at a time fashion.
  192. Eldridge,Benjamin N.; Barbara,Bruce Jeffrey, Method to build a wirebond probe card in a many at a time fashion.
  193. Fjelstad, Joseph, Methods and structures for electronic probing arrays.
  194. Joseph Fjelstad, Methods and structures for electronic probing arrays.
  195. Mathieu,Gaetan L.; Khandros,Igor Y.; Reynolds,Carl, Methods for making plated through holes usable as interconnection wire or probe attachments.
  196. Mathieu,Gaetan L.; Khandros,Igor Y.; Reynolds,Carl V., Methods for making plated through holes usable as interconnection wire or probe attachments.
  197. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.
  198. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.
  199. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.
  200. Mathieu,Gaetan L.; Eldridge,Benjamin N.; Wenzel,Stuart W., Methods of fabricating and using shaped springs.
  201. Cooper,Timothy E.; Eldridge,Benjamin N.; Khandros,Igor Y.; Martens,Rod; Mathieu,Gaetan L., Methods of probing an electronic device.
  202. Akram, Salman, Methods of testing integrated circuitry.
  203. Chen,Chih Chung, Micro contact device comprising the micro contact element and the base member.
  204. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
  205. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure.
  206. Grube, Gary W.; Mathieu, Gaetan L.; Madsen, Alec, Microelectronic contact structure.
  207. Grube, Gary W.; Mathieu, Gaetan L.; Madsen, Alec, Microelectronic contact structure.
  208. Kim,Kieun; Cohen,Adam L.; Larsen,Willa M.; Chen,Richard T.; Kumar,Ananda H.; Kruglick,Ezekiel J. J.; Arat,Vacit; Zhang,Gang; Lockard,Michael S., Microprobe tips and methods for making.
  209. Kim,Kieun; Cohen,Adam L.; Larsen,Willa M.; Chen,Richard T.; Kumar,Ananda H.; Kruglick,Ezekiel J. J.; Arat,Vacit; Zhang,Gang; Lockard,Michael S.; Bang,Christopher A., Microprobe tips and methods for making.
  210. Lee,Yi Chang; Liu,An Hong; Huang,Hsiang Ming; Lee,Yao Jung; Wang,Yeong Her, Modular probe card.
  211. Eldridge,Benjamin N.; Grube,Gary W.; Khandros,Igor Y.; Mathieu,Gaetan L., Mounting spring elements on semiconductor devices, and wafer-level testing methodology.
  212. Wu, Ming Ting; Larsen, III, Rulon Joseph; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.
  213. Wu, Ming Ting; Larsen, III, Rulon J.; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.
  214. Wu, Ming Ting; Larsen, III, Rulon J.; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.
  215. Kister, January, Multiple contact probes.
  216. Kister, January, Multiple contact probes.
  217. Kuo, Yung-Hsin, Non-reflow probe card structure.
  218. Strid,Eric; Campbell,Richard, On-wafer test structures for differential signals.
  219. Tervo,Paul A.; Cowan,Clarence E., POGO probe card for low current measurements.
  220. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Planarizer for a semiconductor contactor.
  221. Brandorff, Alexander; Pardee, William P., Planarizing interposer for thermal compensation of a probe card.
  222. Karklin, Ken; Garaedian, Raffi, Planarizing probe card.
  223. Joo, Sung-Ho; Kim, Yu-Kyum; Kim, Joon-Yeon, Pogo pin and probe card, and method of manufacturing a semiconductor device using the same.
  224. Warwick, Thomas P.; Russell, James V.; Turpuseema, Dhananjaya, Power supply transient performance (power integrity) for a probe card assembly in an integrated circuit test environment.
  225. Eldridge, Benjamin N.; Miller, Charles A., Predictive, adaptive power supply for an integrated circuit under test.
  226. Eldridge, Benjamin N.; Miller, Charles A., Predictive, adaptive power supply for an integrated circuit under test.
  227. Eldridge,Benjamin N.; Miller,Charles A., Predictive, adaptive power supply for an integrated circuit under test.
  228. Kister, January, Probe bonding method having improved control of bonding material.
  229. Hosaka, Hisatomi, Probe card.
  230. Endres, Eric; Strom, John T.; Kuwasaki, Christian; McLaughlin, Christopher, Probe card analysis system and method.
  231. Endres, Eric; Strom, John T.; Kuwasaki, Christian; McLaughlin, Christopher, Probe card analysis system and method.
  232. Audette, David M.; Fregeau, Dustin; Gardell, David L.; Neff, Peter W.; Roy, III, Frederick H.; Wagner, Grant W., Probe card assembly.
  233. Audette,David M.; Gardell,David L.; Hagios,John F.; Sullivan,Christopher L., Probe card assembly.
  234. Garabedian,Raffi; Tea,Nim Hak; Wang,Steven; Karklin,Heather, Probe card assembly.
  235. Khandros, Jr., Igor Y.; Sporck, Jr., A. Nicholas; Eldridge, Jr., Benjamin N., Probe card assembly.
  236. Khandros,Igor Y.; Sporck,A. Nicholas; Eldridge,Benjamin N., Probe card assembly.
  237. Eldridge, Benjamin N.; Khandros, Igor Y.; Sporck, A. Nicholas, Probe card assembly and kit.
  238. Khandros,Igor Y.; Sporck,A. Nicholas; Eldridge,Benjamin N., Probe card assembly and kit.
  239. Khandros,Igor Y.; Sporck,A. Nicholas; Eldridge,Benjamin N., Probe card assembly and kit.
  240. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.
  241. Eldridge, Benjamin Niles; Grube, Gary William; Khandros, Igor Yan; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.
  242. Garabedian, Raffi; Tea, Nim Hak; Wang, Steven; Karklin, Heather, Probe card assembly and method of forming same.
  243. Eldridge, Benjamin N.; Grube, Gary W.; Mathieu, Gaetan L., Probe card assembly for contacting a device with raised contact elements.
  244. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Probe card assembly having an actuator for bending the probe substrate.
  245. Eldridge, Benjamin N.; Reynolds, Carl V., Probe card covering system and method.
  246. Eldridge,Benjamin N.; Reynolds,Carl V., Probe card covering system and method.
  247. Benjamin N. Eldridge ; Gary W. Grube ; Gaetan L. Mathieu, Probe card for probing wafers with raised contact elements.
  248. Kwon, Duk Kyu; Lee, Kyu Han; Lee, Yong Goo, Probe card for testing a semiconductor chip.
  249. Lee, Yong Goo; Lee, Maeng Youl, Probe card having a plurality of space transformers.
  250. Sporck, A. Nicholas; Shinde, Makarand S., Probe card with coplanar daughter card.
  251. Sporck,Alistair Nicholas; Shinde,Makarand S., Probe card with coplanar daughter card.
  252. Kasukabe, Susumu; Okamoto, Naoki, Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device.
  253. Akram Salman ; Doherty C. Patrick ; Farnworth Warren M. ; Hembree David R., Probe card, test method and test system for semiconductor wafers.
  254. Salman Akram ; C. Patrick Doherty ; Warren M. Farnworth ; David R. Hembree, Probe card, test method and test system for semiconductor wafers.
  255. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Probe construction using a recess.
  256. Robert Edward Aldaz ; Theodore A. Khoury, Probe contact system having planarity adjustment mechanism.
  257. Theodore A. Khoury ; Robert Edward Aldaz, Probe contact system having planarity adjustment mechanism.
  258. Yu, David; Zhou, Yu; Aldaz, Robert Edward, Probe contact system having planarity adjustment mechanism.
  259. Zhou, Yu; Yu, David; Aldaz, Robert Edward, Probe contact system having planarity adjustment mechanism.
  260. Aldaz, Robert Edward; Khoury, Theodore A., Probe contract system having planarity adjustment mechanism.
  261. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Probe devices formed from multiple planar layers of structural material with tip regions formed from one or more intermediate planar layers.
  262. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  263. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  264. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  265. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  266. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  267. Campbell,Richard L.; Andrews,Michael; Bui,Lynh, Probe for high frequency signals.
  268. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Probe for testing a device under test.
  269. Salmon, Jay; Swart, Roy E.; Liew, Brandon, Probe head assemblies and probe systems for testing integrated circuit devices.
  270. Smith, Kenneth; Jolley, Michael; Van Syckel, Victoria, Probe head having a membrane suspended probe.
  271. Smith,Kenneth; Jolley,Michael; Van Syckel,Victoria, Probe head having a membrane suspended probe.
  272. Dang, Son N.; Back, Gerald W.; Kazmi, Rehan, Probe head structure for probe test cards.
  273. Schwindt,Randy, Probe holder for testing of a test device.
  274. Caldwell,John; McBride,Jerry; Crump,Brett; Byrd,Phil, Probe interposers and methods of fabricating probe interposers.
  275. Kister, January; Shtarker, Alex, Probe retention arrangement.
  276. Kister, January; Shtarker, Alex, Probe retention arrangement.
  277. Kister, January, Probe skates for electrical testing of convex pad topologies.
  278. Nordgren, Greg; Dunklee, John, Probe station.
  279. Nordgren, Greg; Dunklee, John, Probe station.
  280. Peters, Ron A.; Hayden, Leonard A.; Hawkins, Jeffrey A.; Dougherty, R. Mark, Probe station having multiple enclosures.
  281. Peters,Ron A.; Hayden,Leonard A.; Hawkins,Jeffrey A.; Dougherty,R. Mark, Probe station having multiple enclosures.
  282. Cowan, Clarence E.; Tervo, Paul A.; Dunklee, John L., Probe station thermal chuck with shielding for capacitive current.
  283. Dunklee,John; Cowan,Clarence E., Probe station with low inductance path.
  284. Lesher, Timothy; Miller, Brad; Cowan, Clarence E.; Simmons, Michael; Gray, Frank; McDonald, Cynthia L., Probe station with low noise characteristics.
  285. Navratil,Peter; Froemke,Brad; Stewart,Craig; Lord,Anthony; Spencer,Jeff; Runbaugh,Scott; Fisher,Gavin; McCann,Pete; Jones,Rod, Probe station with two platens.
  286. Kohno, Ryuji; Nagata, Tatsuya; Shimizu, Hiroya; Miyatake, Toshio; Miura, Hideo, Probe structure.
  287. Kohno, Ryuji; Nagata, Tatsuya; Shimizu, Hiroya; Miyatake, Toshio; Miura, Hideo, Probe structure.
  288. Lesher, Timothy E., Probe testing structure.
  289. Wang,Zhong L.; Hughes,William L.; Buchine,Brent A., Probe tips and method of making same.
  290. Kister, January, Probes with high current carrying capability and laser machining methods.
  291. Kister, January, Probes with offset arm and suspension structure.
  292. Smith, Kenneth R.; Hayward, Roger, Probing apparatus with impedance optimized interface.
  293. Lou, Choon Leong, Probing apparatus with multiaxial stages for testing semiconductor devices.
  294. Eldridge, Benjamin N.; Mathieu, Gaetan L., Re-assembly process for MEMS structures.
  295. Eldridge,Benjamin N.; Mathieu,Gaetan L., Re-assembly process for MEMS structures.
  296. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
  297. Eslamy, Mohammad; Pedersen, David V; Cobb, Harry D., Segmented contactor.
  298. Eslamy,Mohammad; Pedersen,David V.; Cobb,Harry D., Segmented contactor.
  299. Eslamy,Mohammad; Pedersen,David V.; Cobb,Harry D., Segmented contactor.
  300. Notohardjono, Budy D.; Schmidt, Roger R., Self-aligning wafer burn-in probe.
  301. Kirloskar Mohan ; Horiuchi Michio,JPX ; Takeuchi Yukiharu,JPX, Semiconductor device and production thereof.
  302. Fukuda Jun,JPX, Semiconductor device test board and a method of testing a semiconductor device.
  303. Mathieu,Gaetan L.; Eldridge,Benjamin N.; Wenzel,Stuart W., Shaped spring.
  304. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Madsen, Alex; Mathieu, Gaetan L., Sharpened, oriented contact tip structures.
  305. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for high-frequency testing of a device under test.
  306. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Shielded probe for testing a device under test.
  307. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  308. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  309. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  310. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  311. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  312. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  313. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe with low contact resistance for testing a device under test.
  314. Horikawa, Yasuyoshi; Ihara, Yoshihiro; Mochizuki, Kenji; Tanaka, Masato, Socket and method of fabricating the same.
  315. Kister, January, Space transformers employing wire bonds for interconnections with fine pitch contacts.
  316. Benjamin N. Eldridge ; Igor Y. Khandros ; David V. Pedersen ; Ralph G. Whitten, Special contact points for accessing internal circuitry of an integrated circuit.
  317. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.
  318. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.
  319. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.
  320. Ihara, Yoshihiro; Terasawa, Takehito; Kitajima, Masakuni, Substrate having leads.
  321. Tunaboylu,Bahadir, Substrate with patterned conductive layer.
  322. Do, Trent K., Surface connector with silicone spring member.
  323. Wagman, Daniel C.; Jol, Eric S.; Do, Trent K., Surface connector with silicone spring member.
  324. Dunklee,John, Switched suspended conductor and connection.
  325. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
  326. Strid,Eric W.; Schappacher,Jerry B.; Carlton,Dale E.; Gleason,K. Reed, System for evaluating probing networks.
  327. Andrews, Peter; Hess, David, System for testing semiconductors.
  328. Mok, Sammy; Chong, Fu Chiung, Systems for testing and packaging integrated circuits.
  329. Mok, Sammy; Chong, Fu Chiung; Milter, Roman, Systems for testing and packaging integrated circuits.
  330. Negishi, Kazuki; Hansen, Mark, Test apparatus for measuring a characteristic of a device under test.
  331. Bucksch,Thorsten, Test device for wafer testing digital semiconductor circuits.
  332. Eldridge, Benjamin N.; Wenzel, Stuart W., Test head assembly for electronic components with plurality of contoured microelectronic spring contacts.
  333. Eldridge,Benjamin N.; Wenzel,Stuart W., Test head assembly having paired contact structures.
  334. Miller, Charles A., Test signal distribution system for IC tester.
  335. Miller,Charles A., Test signal distribution system for IC tester.
  336. Tokumo,Yasushi; Maekawa,Shigeki; Kashiba,Yoshihiro; Takada,Shigeru, Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested.
  337. Campbell, Richard, Test structure and probe for differential signals.
  338. Campbell,Richard, Test structure and probe for differential signals.
  339. Miller, Charles A., Tester channel to multiple IC terminals.
  340. Miller,Charles A., Tester channel to multiple IC terminals.
  341. Rumbaugh,Scott, Thermal optical chuck.
  342. Orsillo, James, Tooling plate adapted to facilitate rapid and precise attachment into a probing station.
  343. Chen, Richard T.; Arat, Vacit; Folk, Chris; Cohen, Adam L., Two-part microprobes for contacting electronic components and methods for making such probes.
  344. Cheng, Hsu Ming, Ultra-fine area array pitch probe card.
  345. Cheng, Hsu Ming; Chao, Clinton; Chang, Fa-Yuan; Wu, Hua-Shu, Ultra-fine pitch probe card structure.
  346. Cheng, Hsu Ming; Hwang, Frank; Chao, Clinton, Ultra-fine pitch probe card structure.
  347. Dibene, II, Joseph T.; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
  348. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
  349. Jafari, Nasser Ali; Karklin, Kenneth Dean; Sprague, William T., Unified apparatus and method to assure probe card-to-wafer parallelism in semiconductor automatic wafer test, probe card measurement systems, and probe card manufacturing.
  350. Eldridge,Benjamin N.; Mathieu,Gaetan, Variable width resilient conductive contact structures.
  351. Kister, January, Vertical guided layered probe.
  352. Kister, January, Vertical probe array arranged to provide space transformation.
  353. Kister, January, Vertical probe array arranged to provide space transformation.
  354. Gengying Gao ; Kevin Weaver, Vibration resistant test module for use with semiconductor device test apparatus.
  355. Eldridge, Benjamin N.; Reynolds, Carl V., Wafer level interposer.
  356. Hayden, Leonard; Martin, John; Andrews, Mike, Wafer probe.
  357. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  358. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  359. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  360. Schwindt, Randy J.; Harwood, Warren K.; Tervo, Paul A.; Smith, Kenneth R.; Warner, Richard H., Wafer probe station having a skirting component.
  361. Schwindt,Randy J.; Harwood,Warren K.; Tervo,Paul A.; Smith,Kenneth R.; Warner,Richard H., Wafer probe station having a skirting component.
  362. Harwood, Warren K.; Tervo, Paul A.; Koxxy, Martin J., Wafer probe station having environment control enclosure.
  363. Harwood,Warren K.; Tervo,Paul A.; Koxxy,Martin J., Wafer probe station having environment control enclosure.
  364. Khandros, Igor Y.; Pedersen, David V., Wafer-level burn-in and test.
  365. Khandros, Igor Y.; Pedersen, David V., Wafer-level burn-in and test.
  366. Khandros, Igor Y.; Pedersen, David V., Wafer-level burn-in and test.
  367. Khandros,Igor Y.; Pedersen,David V., Wafer-level burn-in and test.
  368. Khandros,Igor Y.; Pedersen,David V., Wafer-level burn-in and test.
  369. Campbell, Richard, Wideband active-passive differential signal probe.

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