초록 ▼

A method and apparatus for cleaning the edges of substrates. The present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based on friction at a point of contact between the wafer and a wafer edge brush. In one embodiment, the cleaning mechanism includes a side

A method and apparatus for cleaning the edges of substrates. The present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based on friction at a point of contact between the wafer and a wafer edge brush. In one embodiment, the cleaning mechanism includes a side brush that cleans the top-side or bottom-side of a wafer. The side brush is rotated by a motor that is attached to a first end of the side brush. An edge brush is attached to a second end of the side brush and is rotated along with the side brush to clean the edge of the wafer.

대표청구항 ▼

[ We claim:] [1.] A method for cleaning a top surface, a bottom surface and an edge of a wafer, said method comprising the steps of:a) rotating said wafer about a first axis of rotation, said first axis of rotation being perpendicular to said top and bottom surfaces;b) rotating a first brush having

[ We claim:] [1.] A method for cleaning a top surface, a bottom surface and an edge of a wafer, said method comprising the steps of:a) rotating said wafer about a first axis of rotation, said first axis of rotation being perpendicular to said top and bottom surfaces;b) rotating a first brush having a first plurality of bristles about a second axis of rotation, said second axis of rotation being substantially parallel to said top surface;c) rotating a second brush having a second plurality of bristles about a third axis of rotation, said third axis of rotation being substantially parallel to said bottom surface;d) rotating a third brush having a third plurality of bristles about said second axis of rotation;e) engaging said first bristles with said top surface of said wafer to clean said top surface;f) engaging said second bristles with said bottom surface of said wafer to clean said bottom surface; ande) engaging said third bristles with said edge of said wafer to clean said edge.