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Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-029/00
  • F28F-007/00
  • G01R-031/00
출원번호 US-0654311 (1996-05-28)
발명자 / 주소
  • Burward-Hoy Trevor
대리인 / 주소
    Fliesler, Dubb, Meyer & Lovejoy LLP
인용정보 피인용 횟수 : 88  인용 특허 : 27

초록 ▼

An apparatus for varying a temperature of a device under test (DUT). The apparatus comprises a plate having a surface area configured to couple to the DUT to transfer heat to and from the DUT by way of conduction. A heat exchanger is connected to the plate to set a temperature of the surface area of

대표청구항 ▼

[ What is claimed is:] [17.] An apparatus for varying a temperature of a device under test (DUT), comprising:a plate having a surface area configured to couple to the DUT to transfer heat to and from the DUT by way of conduction; anda body having a set of channels formed therein connected to the pla

이 특허에 인용된 특허 (27)

  1. Peters Alfred C. (Garland TX), Apparatus for controlling the temperature of an integrated circuit package.
    상세보기
  2. Henderson G. Douglas (Orlando FL), Apparatus for heating and cooling devices under test.
    상세보기
  3. Buol Douglas A. (Dallas TX) Mize Dean N. (Garland TX) Pattschull John W. (Garland TX) Wallace Robert M. (Dallas TX), Apparatus for testing integrated circuits.
    상세보기
  4. Jones Elmer R. (North Reading MA), Burn-in module.
    상세보기
  5. Nobi Laszlo (Fort Collins CO), Burn-in process and apparatus.
    상세보기
  6. Jones Elmer R. (North Reading MA), Burn-in tower.
    상세보기
  7. Funk, Gary L., Control of heat transfer from heat exchangers in parallel.
    상세보기
  8. Murakami Kyoshiro (Shimizu JPX) Yamashita Tetsuji (Shizuoka JPX) Yoshikawa Tomio (Shimizu JPX) Yasuda Hiromu (Shizuoka JPX) Zushi Shizuo (Hadano JPX), Cooling apparatus and temperature control method therefor.
    상세보기
  9. Blanz John H. (Carlisle MA), Cryogenic probe station having movable chuck accomodating variable thickness probe cards.
    상세보기
  10. Horiuchi Akinori (Tokyo JPX) Binnaka Toshio (Kawasaki JPX) Maruyama Shigeyuki (Yokohama JPX), Device for testing semiconductor devices at a high temperature.
    상세보기
  11. Berry Gregory F. (Naperville IL) Minkov Vladimir (Skokie IL) Petrick Michael (Joliet IL), Direct-contact closed-loop heat exchanger.
    상세보기
  12. Miyata Eiji (Fuchu JPX) Sugiyama Masahiko (Nirasaki JPX) Kohno Masahiko (Yamanashi JPX) Hatta Masataka (Yamanashi JPX), Electric probing-test machine having a cooling system.
    상세보기
  13. Miyata Eiji (Fuchu) Sugiyama Masahiko (Nirasaki) Kohno Masahiko (Yamanashi) Hatta Masataka (Yamanashi JPX), Electric probing-test machine having a cooling system.
    상세보기
  14. Margozzi Paul D. (San Jose CA), Environmental box for automated wafer probing.
    상세보기
  15. Heumann John M. (Loveland CO) Peiffer Ronald J. (Ft. Collins CO), Identification of pin-open faults by measuring current or voltage change resulting from temperature change.
    상세보기
  16. Yamashita Satoru (Kofu JPX), Probe apparatus.
    상세보기
  17. Iino Shinji (Yamanashi-ken JPX) Iida Itaru (Yamanashi-ken JPX), Probe apparatus having burn-in test function.
    상세보기
  18. Davenport Robert E. ; Tepman Avi, Semiconductor processing apparatus for promoting heat transfer between isolated volumes.
    상세보기
  19. Moulene, Daniel; Gourdon, Pierre, Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support.
    상세보기
  20. Hosoya Tsutomu (Numazu JPX) Inaba Katsuhiro (Numazu JPX) Akiyama Toru (Numazu JPX) Fujita Shigeru (Numazu JPX), Temperature control device.
    상세보기
  21. Burton David P. (Parteen IEX) Dillon Paul A. (Foxrock IEX) Stephenson Malcolm I. (Adare IEX), Temperature control instrument for electronic components under test.
    상세보기
  22. Heimanson Dorian ; Omstead Thomas R., Temperature controlled chuck for vacuum processing.
    상세보기
  23. Blanz John H. (Carlisle MA), Temperature stable cryogenic probe station.
    상세보기
  24. Blanz John H. (Carlisle MA), Test station having vibrationally stabilized X, Y and Z movable integrated circuit receiving support.
    상세보기
  25. Jones Elmer R. (North Reading MA), Thermal control system for a semi-conductor burn-in.
    상세보기
  26. Jones Elmer R. (North Reading MA), Thermal control system for a semi-conductor burn-in.
    상세보기
  27. Nieh Sen (14345 Hollyhock Way Burtonsville MD 20866), Vortex heat exchange method and device.
    상세보기

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  1. Kabbani,Samer; Beyerle,Rick; Bachelder,Don, Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing.
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  2. Barabi, Nasser; Nazarov, Elena; Tienzo, Joven R.; Ho, Chee-Wah, Active thermal control unit for maintaining the set point temperature of a DUT.
    상세보기
  3. Stuckey, Larry, Advanced thermal control interface.
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  4. Wall, Charles B.; Barnes, Cynthia M., Apparatus and method for controlling the temperature of an electronic device under test.
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  5. Wall,Charles B.; Barnes,Cynthia M., Apparatus and method for controlling the temperature of an electronic device under test.
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  6. Pichl, Franz; Hertkorn, Michael; Jeserer, Guenther, Apparatus and method for testing electronic devices.
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  7. Wayburn,Lewis S.; Spearing,Ian G.; Schmidt, Jr.,Charles R., Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test.
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  8. Di Stefano, Thomas H., Apparatus to control device temperature utilizing multiple thermal paths.
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  9. Di Stefano, Thomas H., Apparatus to control device temperature utilizing multiple thermal paths.
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  10. Bell, Lon E.; LaGrandeur, John; Davis, Stephen, Battery thermal management system including thermoelectric assemblies in thermal communication with a battery.
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  11. Hamilton,Harold E.; Tremmel,Tom A., Burn-in oven heat exchanger having improved thermal conduction.
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  12. Gawthrop, Peter R., Climate control method for hybrid vehicles using thermoelectric devices.
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  13. Gawthrop, Peter R., Climate control system for vehicles using thermoelectric devices.
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  14. Storm, Bruce H; Chen, Dingding; Song, Haoshi, Cooling apparatus, systems, and methods.
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  15. Yamabuchi, Hiroshi; Nishiyama, Ryoji; Kuramoto, Yuji; Ishibashi, Satoshi, Cooling system of power semiconductor module.
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  16. Park,Chan Ho; Hwang,Hyun Joo; Seo,Jae Bong; Park,Young Geun; Song,Ho Keun, Device for compensating for heat deviation in a modular IC test handler.
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  17. Neeb James Edward, Directed self-heating for reduction of system test time.
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  18. Goenka, Lakhi N.; Crane, Douglas T.; Bell, Lon E., Energy management system for a hybrid-electric vehicle.
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  20. Straznicky, Ivan; Ratliff, William Edward, Fluid cooled enclosure for circuit module apparatus and methods of cooling a conduction cooled circuit module.
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  21. Corbin, Jr.,John Saunders; Garza,Jose Arturo; Kent,Dales Morrison; Larsen,Kenneth Carl; Mahaney, Jr.,Howard Victor; Phan,Hoa Thanh; Salazar,John Joseph, Functional and stress testing of LGA devices.
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  22. Corbin, Jr.,John Saunders; Garza,Jose Arturo; Kent,Dales Morrison; Larsen,Kenneth Carl; Mahaney, Jr.,Howard Victor; Phan,Hoa Thanh; Salazar,John Joseph, Functional and stress testing of LGA devices.
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  23. Corbin, Jr.,John Saunders; Garza,Jose Arturo; Kent,Dales Morrison; Larsen,Kenneth Carl; Mahaney, Jr.,Howard Victor; Phan,Hoa Thanh; Salazar,John Joseph, Functional and stress testing of LGA devices.
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  24. Corbin, Jr.,John Saunders; Garza,Jose Arturo; Kent,Dales Morrison; Larsen,Kenneth Carl; Mahaney, Jr.,Howard Victor; Phan,Hoa Thanh; Salazar,John Joseph, Functional and stress testing of LGA devices.
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  25. Corbin, Jr.,John Saunders; Garza,Jose Arturo; Kent,Dales Morrison; Larsen,Kenneth Carl; Mahaney, Jr.,Howard Victor; Phan,Hoa Thanh; Salazar,John Joseph, Functional and stress testing of LGA devices.
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  26. Corbin, Jr.,John Saunders; Garza,Jose Arturo; Kent,Dales Morrison; Larsen,Kenneth Carl; Mahaney, Jr.,Howard Victor; Phan,Hoa Thanh; Salazar,John Joseph, Functional and stress testing of LGA devices.
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  27. Corbin, Jr.,John Saunders; Garza,Jose Arturo; Kent,Dales Morrison; Larsen,Kenneth Carl; Mahaney, Jr.,Howard Victor; Phan,Hoa Thanh; Salazar,John Joseph, Functional and stress testing of LGA devices.
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  28. Corbin, Jr.,John Saunders; Garza,Jose Arturo; Kent,Dales Morrison; Larsen,Kenneth Carl; Mahaney, Jr.,Howard Victor; Phan,Hoa Thanh; Salazar,John Joseph, Functional and stress testing of LGA devices.
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  29. Corbin, Jr.,John Saunders; Garza,Jose Arturo; Kent,Dales Morrison; Larsen,Kenneth Carl; Mahaney, Jr.,Howard Victor; Phan,Hoa Thanh; Salazar,John Joseph, Functional and stress testing of LGA devices.
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  33. Storm, Jr., Bruce H.; Schultz, Roger L.; Fripp, Michael L., Heating and cooling electrical components in a downhole operation.
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  60. Shin, Kyung Mo; McMullen, Thomas; Kim, Dong Wook, System and method for temperature cycling.
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