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Apparatus for mounting a very large scale integration (VLSI) chip to a computer chassis for cooling

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0777604 (1996-12-31)
발명자 / 주소
  • Borkar Shekhar Yeshwant
  • Dreyer Robert S.
  • Mulder Hans
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman
인용정보 피인용 횟수 : 8  인용 특허 : 23

초록

An apparatus is provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to th

대표청구항

[ We claim:] [1.] A computer system assembly comprising:a chassis made of an electrically conducting, rigid material, the chassis having first and second sections, the first section being electrically isolated from the second section;a microprocessor;a package housing the microprocessor, the package

이 특허에 인용된 특허 (23)

  1. Balderes Demetrios (Wappingers Falls NY) Frankovsky Andrew J. (Endwell NY) Jarvela Robert A. (Wappingers Falls NY), Apparatus for directly powering a multi-chip module from a power distribution bus.
  2. Naedel Richard G. (Rockville MD) Harris David B. (Columbia MD) Uehling Mark (Bowie MD), Chassis and personal computer for severe environment embedded applications.
  3. Brown David F. (22 Waterpump Ct. Thorplands ; Northampton GB2) Anstey Michael J. (Penhallow ; Kiln Ride Extension Wokingham ; Berks GB2), Circuit assembly.
  4. Karpman Maurice S. (Westwood MA), Circuit board thermal contact device.
  5. Hulsebosch David A. (8006 White Marsh Ct. Spring TX 77379) Faulk Richard A. (12911 Forest Meadow Cypress TX 77429), Compact construction for portable computer power supply.
  6. Webb Matthew L., Computer having a heat sink structure incorporated therein.
  7. Borkar Shekhar (Portland OR) Mooney Stephen R. (Beaverton OR), Daisy chained clock distribution scheme.
  8. Benck Jeffrey W. (Delray Beach FL) Mansuria Mohanlal S. (Coral Springs FL) Wysong Robert D. (Boca Raton FL), Digitizer tablet having cooling apparatus with base and integrated heat sink.
  9. Ono Hideyo (Hyogo JPX) Yoshitake Kunitoshi (Hyogo JPX) Kakuta Nobuyuki (Hyogo JPX), Electronic device housing with temperature management functions.
  10. Neal James R. (Cameron Park CA) Brown Peter F. (Orangevale CA) Agatstein Louis W. (El Dorado Hills CA) Gutman Michael (Zichron-Ya\cov ILX), Employing on die temperature sensors and fan-heatsink failure signals to control power dissipation.
  11. Edwards David Linn ; Iruvanti Sushumna ; Messina Gaetano Paolo ; Sherif Raed A., Flat plate cooling using a thermal paste retainer.
  12. Tousignant Lew A. (Shoreview MN), Flexible thermal transfer apparatus for cooling electronic components.
  13. Voorhes David W. (Winchester MA) Goldman Richard D. (Stoughton MA) Lopez Robert R. (Boxford MA), Heat sink.
  14. Lau Tim O. (Milpitas CA) Huang Alexander (Menlo Park CA) Lo Douglas P. (San Jose CA), Housing cooling system.
  15. Jakob Gert (Stuttgart DEX) Schupp Karl (Pforzheim DEX) Hussmann Dieter (Steinheim DEX) Jessberger Thomas (Eberdingen/Hochdorf DEX) Karr Dieter (Tiefenbronn DEX), Housing for an electronic circuit with improved heat dissipation means.
  16. Penniman Mark B. (Austin TX) Skillman Peter N. (San Carlos CA) Lillios Tony J. (Palo Alto CA) Boyle Dennis J. (Palo Alto CA), Integrated circuit dual cooling paths and method for constructing same.
  17. Self Keith-Michael W. (Aloha OR) Peterson Craig B. (Portland OR) Sutton ; II James A. (Portland OR) Urbanski John A. (Hillsboro OR) Cox George W. (Portland OR) Rankin Linda J. (Beaverton OR) Archer D, Microprocessor point-to-point communication.
  18. Beilin Solomon I. (San Carlos CA) Chou William T. (Cupertino CA) Kudzuma David (San Jose CA) Lee Michael G. (San Jose CA) Murase Teruo (San Jose CA) Peters Michael G. (Santa Clara CA) Roman James J. , Multichip module substrate.
  19. Nelson Daryl (Beaverton OR), Multiple-fan microprocessor cooling through a finned heat pipe.
  20. Self Keith-Michael W. (Aloha OR) Borkar Shekhar Y. (Portland OR) Jex Jerry G. (Forest Grove OR) Burton Edward A. (Hillsboro OR) Mooney Stephen R. (Beaverton OR) Nag Prantik K. (Portland OR), Point-to-point phase-tolerant communication.
  21. Roth Gregory A. (Dearborn MI), Spring clip for a heat sink apparatus.
  22. Lee Richard M. L. (8F-6 ; No. 100 ; Sec. 2 ; Hoping E. Road Taipei TWX), Thermostat controlled cooler for a CPU.
  23. Moresco Larry L. (San Carlos CA) Horine David A. (Los Altos CA) Wang Wen-Chou V. (Cupertino CA), Three-dimensional multichip module.

이 특허를 인용한 특허 (8)

  1. Steven Lofland, Apparatus and methods for attaching thermal spreader plate to an electronic card.
  2. Sui-Lin Lim GB, Generic external portable cooling device for computers.
  3. Merz, Nicholas G.; Difonzo, John C.; Zadesky, Stephen P.; Prichard, Michael J., Heat dissipation in computing device.
  4. Kavanagh, Martin, Heat transfer apparatus.
  5. Moss, David L.; Schmitt, Ty R., Liquid cooling module.
  6. Shekhar Yeshwant Borkar ; Robert S. Dreyer ; Hans J. Mulder, Method and apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply.
  7. Yinon Degani ; Thomas Dixon Dudderar ; King Lien Tai, Packaging silicon on silicon multichip modules.
  8. Viswanath, Ram S., Thermal design for minimizing interface in a multi-site thermal contact condition.
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