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A composite substrate on which a heat-generating semiconductor device is to be mounted, comprising a composite layer which includes a matrix made of a metal having a high thermal conductivity and a fibrous or particulate dispersion material having low thermal expansion properties present in the matr

A composite substrate on which a heat-generating semiconductor device is to be mounted, comprising a composite layer which includes a matrix made of a metal having a high thermal conductivity and a fibrous or particulate dispersion material having low thermal expansion properties present in the matrix, and a metal layer provided onto one main surface of the composite layer, wherein either one of a heat-generating semiconductor device or a substrate with low thermal expansion properties having a heat-generating semiconductor device provided thereon, is mounted on the other main surface of the composite layer.

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[ What is claimed is:] [1.] A composite substrate on which a heat-generating semiconductor device is to be mounted, which comprises:a composite layer containing a matrix made of a high-thermal-conductivity metal and a fibrous dispersion material formed of a low-thermal-expansion substance contained

[ What is claimed is:] [1.] A composite substrate on which a heat-generating semiconductor device is to be mounted, which comprises:a composite layer containing a matrix made of a high-thermal-conductivity metal and a fibrous dispersion material formed of a low-thermal-expansion substance contained in said matrix; anda metal heat-dissipating layer for dissipating heat through said substrate generated by heat generating semi-conductor devices mounted on the substrate, provided onto one entire surface of main surfaces of said composite layer;wherein (i) either one of a heat-generating semiconductor device and a low-thermal-expansion substrate provided with a heat-generating semiconductor device, is to be mounted on another main surface of said composite layer; (ii) said metal layer and said matrix form a continuous phase; (iii) said metal layer is made of a metal material identical to that used in said matrix; and wherein (iv) fibrous dispersion material which is oriented in the same direction suppresses thermal expansion in said same direction.